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IMAPS and SEMI proudly announce a
Topical Workshop on |
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Wire Bonding
Monday, July 13, 2009
San Francisco Marriott Hotel
San Francisco, CA
This event will run prior to SEMICON West 2009 – July 14-16.
Early Registration Deadline: June 19, 2009
Housing Deadline: June 29, 2009
Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.
Monday, July 13, 2009
Registration: 8:30 am – 4:30 pm
Continental Breakfast: 8:30 am – 9:15 am
Opening Remarks: 9:15 am – 9:30 am
Session 1: Copper and Gold Ball Bonding
Session Chairs: Daniel D. Evans, Jr., Palomar Technologies, Inc.; Joe Bubel, Hesse & Knipps
9:30 AM - 12:15 PM
Nickel-Palladium Bond Pads for Copper and Gold Wire Bonding
Horst Clauberg, Asaf Hashmonai, Jamin Ling, Bob Chylak, Kulicke and Soffa Industries Inc.; Tom Thieme, Atotech GmbH
Wirebonded Gold Inductor on Top of ICs
James J. Wang, Power Gold LLC
HAZ-Free Ultra-Low Loop Method for Multi-Chip Stacked Die Applications
Jovy Michael G. Sena, Marcelino BuenaflorIreneo, Villavert Marit Seidel, BESI North America Inc. |
Session 2: Wire / Ribbon Bonding & Materials
Session Chairs: Keith Easton, BESI North AmericaInc.; Mike McKeown, Orthodyne Electronics Corporation
9:30 AM - 12:15 PM
The Stressful World of RF Ribbon Bonding
Joseph J. Kreuzpaintner, Karen Wooldridge, Donna Gerrity, Tom Shenton, Steve Wilson, Jeff Jennings, Harris GCSD
Characterization and Calibration of the Ultrasonic System of U/S Wire and Flip-Chip Die Bonders
Mike Kölling, F&K Physiktechnik GmbH
Wire Bond Integrity Versus Surface Finish of Aluminum Clad Substrates
Barry Njoes, David Williams, Paula Goldstein, Technical Materials Inc.; Mike McKeown, Orthodyne Electronics; Steve Lopez, Farmingdale State College |
Break: 11:00 am – 11:15 am
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Wire Bonding Semiconductor Devices for Metallurgists
Lee R. Levine, Process Solutions Consulting
Inert Environment Requirements for Copper Ball Bonding
Bob Chylak, Shai Friedman, John Foley, Gary Gillotti, Gary Schulze, Kulicke and Soffa Industries Inc. |
Practical Considerations for PowerRibbon® Bonding of Hybrid Packages
Richard Elliott, Orthodyne Electronics
Perfection Through Inspection: The Way to Zero-Defect Production of Wire Bonds
Josef Sedlmair, F&K Delvotec Bondtechnik GmbH
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LUNCH: 12:15 pm – 1:15 pm
Session 3: Copper and Gold Bonding & Materials
Session Chairs: Lee Levine, Process Solutions Consulting; Keith Easton, BESI North America Inc.
1:15 PM - 4:15 PM
Odd Form Factor Package Wire Bonding Case Studies
Daniel D. Evans, Jr., Palomar Technologies, Inc.
Advanced Looping in Copper Wire Bonding
O Dal Kwon, Bob Chylak, Oranna Yauw, Samuel III Capistrano, Kulicke & Soffa Industries Inc.
Overview of Actual Bonding Wire Technologies and Possible Solutions Based on Different Interconnection Materials
Tobias Mueller, Eugen Milke, Ping Ha Yeung, W. C. Heraeus GmbH
Break: 2:45 pm – 3:15 pm
Copper Wirebonding without the Plasma
Terence Q. Collier, CV Inc.
Bond Wire Yield Rate Optimization on SiP in a 3D Design Environment
John Sovinsky, Gordon Jensen, CAD Design Software
Closing Remarks: 4:15 pm
Register On-line
Housing: Hotel Cut-off is June 29, 2009
The IMAPS Topical Workshop is being run at the San Francisco Marriott Hotel, in conjunction with SEMICON West.
To book online, Please visit the official housing site: https://www.cmrhousing.com/SEMI_S5/HotelList.aspx
Or call the SEMICON West Housing Office
Monday - Friday, 6:00am - 6:00pm Pacific Standard Time
1.800.421.2499 (US & Canada)
1.415.979.2287 (International)
Room Rate: Single: $273/night – 1 person Double: $293/night – 2 persons
Please reference SEMICON West when making reservations by phone.
San Francisco Marriott Hotel
55 Fourth Street
San Francisco, CA 94103
Speaker Dates/Information:
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Extended Abstract or Presentation Material due: June 19, 2009
- Early Registration Deadline: June 19, 2009
- Hotel Deadline: June 29, 2009
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Powerpoint/Presentation file for CD-Rom due not later than: July 13, 2009
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Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
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