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Topical Workshop & Tabletop Exhibition on
Wire Bonding

January 21-22, 2014
San Jose Airport Hotel
San Jose, CA 95112

Early Registration/Hotel Deadline: December 20, 2013

Thank you to our Corporate Sponsor:
Corporate Sponsor: Hesse Mechatronics
See wire bonding in action

General Chair:
Lee Levine
Process Solutions Consulting
Phone: 610-248-2002
levilr@ptd.net

Wire Bonding Workshop Organizing Committee:

Dana Baedke

Key Marketing

dana@keymarketing.biz

Joe Bubel

Hesse Mechatronics

joseph.bubel@hesse-mechatronics.us

Leroy Christie

ASM Pacific

leroy.christie@asmpt.com

Bob Chylak

Kulicke & Soffa         

bchylak@kns.com

Bud Crockett

Tanaka

w-crockett@ml.tanaka.co.jp

Doug Day

Shinkawa

d_day@shinkawausa.com

Daniel Evans

Palomar

devans@bonders.com

Mark Greenwell

CoorsTek Gaiser Tools

mgreenwell@coorstek.com

Amy Low

Heraeus

amy.low@heraeus.com

Mike McKeown

Hesse Mechatronics, Inc

michael.mckeown@hesse-mechatronics.us

Alon Menachel

RED Micro Wire

amenache@redmicrowire.com

Josef Sedlmair

F&K Delvotec

imaps@sedlmair.org

Vito Tanzi

Ametek

vito.tanzi@ametek.com

Uri Zaks

MicroPoint Tools

uriz@mpptools.com

 




Thank you to our Corporate Sponsor:
Corporate Sponsor: Hesse Mechatronics
See wire bonding in action

Wire Bonding Workshop Focus:
The objective of Focused Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to Wire Bonding.

Tuesday, January 21, 2014

Registration: 7:00 am - 6:00 pm

Continental Breakfast: 7:15 am - 7:50 am

Exhibits Open: 10:00 am - 7:00 pm (Breaks, Lunch & Reception in the Exhibit area)

Opening Remarks: 7:50 am
Lee Levine - General Chair

Session 1: Market Outlook
Session Chairs: Lee Levine, Process Solutions Consulting; Jack Belani, Heraeus Thick Film Division
8:00 am - 10:15 am

KEYNOTE: Rich Rice, ASE US KEYNOTE:
The Way Forward for Wirebond Packaging
(45 min.)

Interconnection is a critical process that ultimately enables our industry to churn out devices, ranging from the most standard to the most sophisticated. Wire bond is the mother of all interconnection, whose future growth has been challenged as interconnection schemes evolve towards flip chip, TSV, and other new interconnect technologies, widely considered viable alternatives. So how will wire bond packaging sustain its vitality and continue to satisfy increasingly complex technology requirements? Rich Rice will deliver a broad perspective on wire bond packaging technology and market by considering the historic, analyzing the current, and exploring the future. Through referencing specific technology examples, Rice will endeavor to show that wire bond packaging is alive and well, and through dedicated innovation and collaborative engineering, will continue to play a key role long into the future.

Rich Rice, Senior Vice President, Business Development, ASE US, Inc.
Rich Rice currently serves as Senior Vice President of Business Development at ASE, a role in which he manages new business development activities, and leads a team focused on strategic business and portfolio management initiatives. Mr. Rice previously served as Senior Vice President of Sales, with responsibility for the North America region.

Previously, Mr. Rice held various engineering and business development positions at Amkor Technology and National Semiconductor Corporation. He serves in advisory roles on the iMAPS Global Business Council, MEPTEC, as well as SEMI’s Advanced Packaging Committee. He holds a BS degree in Agricultural Engineering from the University of Illinois.

Semiconductor Market Update & Outlook: From Bonding Wire Perspective (45 min.)
Bud Crockett Jr., Tanaka Denshi Group Saga

The Future of Packaging - The Relevance of Wire Bonding (45 min.)
Bob Chylak, Kulicke & Soffa

Break in Exhibits: 10:15 am - 11:00 am

PANEL DISCUSSION & Question/Answer Session
Moderator: Lee Levine, Process Solutions Consulting
11:00 am - 12:00 pm

Panelists: Rich Rice, ASE US, Inc.; Bud Crockett Jr., Tanaka Denshi Group Saga; Bob Chylak, Kulicke & Soffa

Lunch in Exhibits: 12:00 pm - 1:00 pm

Session 2: Fine Wire
Session Chairs: David Rasmussen, Palomar Technologies; Bud Crockett Jr., Tanaka Denshi Group Saga
1:00 pm - 6:00 pm

Proliferation of Bonding-Wire Types for IC Interconnect
Jack Belani, Heraeus Thick Film Division

Predicting Optimal Material Combinations for Copper Wire Bond Processes Through Finite Element Analysis Models
Aditi Malik, ON Semiconductor (Harold Anderson, Roger Stout)

Ball Bond Reliability: Simulation of Pull and Shear Test
Stevan Hunter, ON Semiconductor (Levi Hill, Tiago Rodrigues, Dustin Whittaker, Aditi Mallik)

Capillary Selection for Challenging Wire Bonding
Mark Greenwell, CoorsTek Inc. / GAISER (Cesar Alfaro, CoorsTek Inc. / GAISER; Lee Levine, Process Solutions Consulting)

Break in Exhibits: 3:00 pm - 3:30 pm

Transforming Wire Bond Eco System
Leroy Christie, ASM Pacific Technology, Ltd.

Increasing the Lifetime of Power Modules by Smaller Bond Wire Diameters
Aaron Hutzler, Fraunhofer IISB (Alan Wright, Andreas Schletz)

Introduction of Copper Alloy Bonding Wire for the Semiconductor Industry
Bud Crockett Jr., Tanaka Denshi Group Saga

Practical Ball Bump Techniques
Mark Greenwell, CoorsTek Inc. / GAISER

ENIG and ENEPIG as Wire Bondable Surface Finishes
George Milad, Uyemura International Corp. (Gerard O'Brien)

Networking & Exhibitor Reception: 6:00 pm - 7:00 pm


Wednesday, January 22, 2014

Registration: 7:00 am - 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibits Open: 10:00 am - 3:00 pm (Breaks and Lunch in the Exhibit area)

Session 3: Wedge Bonding - Fine and Heavy
Session Chairs: Mike McKeown, Hesse Mechatronics, Inc.; Mark Greenwell, CoorsTek Inc. / GAISER
8:00 am - 12:00 pm

Wedge Tool Design Considerations
Uri Zaks, Micro Point Pro Ltd.

Nanoscale Bonding?
Henri Seppainen, Finnish Meteorological Institute

Active and Passive Vibration Control of Ultrasonic Bonding Transducers
Hans Hesse, Hesse Mechatronics, Inc. (Michael Broekelmann)

Small Wire Wedge Tip Geometries
Russell Bell, CoorsTek Inc. / GAISER

Break in Exhibits: 10:00 am - 11:00 am

Convertible Bond Head Enabling Advanced Interconnect
Tao Xu, Kulicke & Soffa Industries

High Speed Aluminum Wire Bonding for Molded Packages
Ken Pham, Texas Instruments Inc. (Yoshihito Hagiwara, Shinkawa Ltd.)

Lunch: 12:00 pm - 1:00 pm

Professional Development Course (PDC)
Instructor: Lee Levine, Process Solutions Consulting
1:00 pm - 5:00 pm

Break in Exhibits: 2:30 pm - 3:00 pm

Wire Bonding in Microelectronics: Materials, Processes, Reliability and Yield

Course Description: Wire bonding is the dominant method for chip interconnection. This year the semiconductor industry will produce over 1312(13 trillion) wire bonds. As a result of the increase in the cost of gold a significant portion (approximately 15%) of the entire market has already converted to copper ball bonding. A comparison of the costs, reliability, and difficulty of copper ball bonding will be included. The objective of the short course will be an understanding of the process from the metallurgy to process optimization and capillary selection.

  • The Ball Bond Process: Step by Step Wire Bonding
  • Welding
  • The effect of ultrasonics on weld formation and materials properties
  • Metallurgy and Intermetallics
  • A comparison of the welds associated with Au-Al and Al-Cu bonding
  • Au-Al failure mechanisms in ultra-fine pitch bonding
  • The effect of wire alloying on ultra-fine pitch reliability
  • Wire properties, testing and chemistry
  • Pull and shear testing wire bonds
  • Long term accelerated testing of wire bonds
  • Understanding wire stiffness and the effect on looping
  • Wire bond loop shapes
  • The second bond
  • Diffusion
  • The principal bonding variables
  • Capillary design and selection for optimized processes
  • Simple bond screening designed experiments
  • How to optimize the bonding process

Who Should Attend? Engineers and technical people involved in wire bonding and wafer interconnection at all levels from beginners to advanced.

Lee Levine's previous experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. He was awarded 4 patents, published more than 70 technical papers, and won both the 1999 John A. Wagnon Technical Achievement award and the 2012 Daniel C Hughes award from the International Microelectronics and Packaging Society, IMAPS. Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding assembly processes. He is a Fellow, a life member and previously was IMAPS V.P Technology.

Workshop Closing Remarks: 5:00 pm

Register On-Line




Registration Information:(Early Registration Deadline: December 20, 2013)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, access to the tabletop exhibition, meals, refreshment breaks, and one (1) CD-ROM of presentations; cd will contain the extended abstract and presentation as submitted by the presenter. CD will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 12/20/13
Advance/Onsite Fee
After 12/20/13
IMAPS Member
$375
$475
Non-Member
$475
$575
Speaker
$275
$325
Chair
$275
$325
Student
$100
$150
Chapter Officer
$275
$325
Tabletop Exhibit (Member)
$450
$500
Tabletop Exhibit (Non-Member)
$500
$550
Corporate Sponsorship (Includes Tabletop & 1 Attendee)
$1000
$1000

Register On-Line


Housing: Hotel Cut-off is December 20, 2013

The IMAPS Topical Workshop is being run at the San Jose Airport Hotel. Rooms must be booked directly with the hotel:

San Jose Airport Hotel
1471 N. Fourth Street
San Jose, California, 95112
Telephone: 408-452-0200

Room Rate: $121 + taxes

On-line Reservations: www.sanjoseairporthotel.com

Promo/Corporate code IMAP

Telephone Reservations: mention IMAPS Wire Bonding Workshop to receive the discounted room rates.

 



Speaker Dates/Information:

  • Abstract(s) due to IMAPS: November 1, 2013
  • Speaker Notification/Confirmation emailed: December 17, 2013
  • Early Registration Deadline: December 20, 2013
  • Hotel Deadline: December 20, 2013
  • Powerpoint/Presentation file for CD-Rom due not later than: January 22, 2013
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - unless otherwise noted

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.
The presentation file you load on the laptop will be used on the post-event CD-Rom.
If you have changes or omissions from the CD, please speak with Brian Schieman before leaving the event.
.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 

 


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611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001