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IMAPS and SEMI proudly announce a
Topical Workshop on |
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Wire Bonding
Thursday, July 15, 2010
Moscone Center, San Francisco, CA
This event will be co-located with SEMICON West 2010
Abstract Deadline: April 30, 2010
Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.
- Copper Ball Bonding and Bumping
- Cu/Low-K Processes and Materials
- Stacked Die and 3D Packaging
- Wire Bonding and Bumping
- Novel Packaging and Design
- Heavy Wire Bonding
- Failure Analysis and Reliability
- Electromigration and Interfacial Adhesion
- Testing and Probing Challenges
- Simulation and Modeling
Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically by April 30, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 18, 2010.
Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
All Speakers are required to pay a reduced registration fee and are required to attend the entire event.
Submit Abstract(s)
Housing: Hotel Details Available Soon
Speaker Dates/Information:
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Abstract(s) due to IMAPS: April 30, 2010
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Speaker Notification/Confirmation emailed: May 10, 2010
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Extended Abstract or Presentation Material due: June 18, 2010
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Powerpoint/Presentation file for CD-Rom due not later than: July 15, 2010
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Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
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