Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.
Thursday, July 14, 2011
Registration: 7:00 am - 5:30 pm
Continental Breakfast: 7:00 am - 7:55 am
Opening Remarks: 7:55 am - 8:00 am
Session 1: BALL BONDING: AU AND CU
Session Chair: Michael McKeown, Materion Technical Materials
8:00 am - 12:00 pm
More than 90% of all chip interconnections are produced by wire bonding either fine gold or copper wire. Gold is still the dominant wire material but the use of copper wire is increasing rapidly and represents the highest growth segment of the market. This session will focus on the use of fine wire (<0.05mm diameter) for chip interconnection.
Getting the Most Out of Gold in Wire Bonding in Semiconductor Packaging
Charles J. Vath, III, Richard Holliday, ComSol Consulting Pte. Ltd.
Multipurpose Wire Bonding - Wires, Bumps, and Combination Interconnects
Daniel D. Evans, Jr., David Rasmussen, Palomar Technologies, Inc.
Physically Robust Interconnect Design n BOAC for Cu Wire Bond
Stevan Hunter, Troy Ruud, Bryce Rasmussen, Diann Dow, Harald Anderson, Jim Mohr, ON Semiconductor
Ball Bond Aging with Integrated Under-Pad Microheater
Michael Mayer, Michael McCracken, Samuel Kim, John Persic, University of Waterloo
Break: 10:00 am - 10:30 am
Fine Pitch Cu Wire Bonding Reaching Maturity
Bernd K. Appelt, Andy Tseng, William T. Chen, ASE Group
The Growth of Copper Ball Bonding
Lee Levine, Process Solutions Consulting, Inc.
Enabling Ultra Fine Pitch Copper Wire Bonding: FAB Formation
John Foley, Bob Chylak, Ivy Qin, Tom Rockey, Kulicke and Soffa Industries, Inc.
Lunch: 12:00 pm - 1:00 pm
Session 2: WEDGE BONDING: AL, AU AND CU
Session Chair: Charles Vath III, ComSol Consulting Pte. Ltd.
1:00 pm - 4:30 pm
Wedge bonding is a versatile process often used for heavy wire and ribbon applications but today, because of significant advancements in speed, placement accuracy, and process control it is finding more usage in fine pitch applications. This year’s program will cover both heavy and fine wire applications.
Why Wedge Bond?
Lee Levine, Process Solutions Consulting, Inc.
A New Look at Fine Wire Aluminum Bonding for Molded Packages
K. Pham, A. Prabhu, L. Nguyen, A. Poddar, National Semiconductor Corporation
The Effect of Force and Power Ramping of the Bonding of Large Packages for Heavy Aluminum Wire Bonds
Mario Marin, Delphi Automotive Systems
Evaluation of Al-Cu Intermetallic Growth at High Temperatures used in PowerClad Ribbon & Leadframe Bonding Applications
Mike McKeown, Barry Njoes, Robert Willis, Materion Technical Materials
Break: 3:00 pm - 3:30 pm
The Use of Ultrasonic Bond Waveforms as an Alternative Low-Cost Method for Process Control for High Volume Automotive Electronic Modules
Mario Marin, Delphi Automotive Systems
Multifilament Tether for Electric Solar Wind Sail
Henri Seppänen, Sergiy Kiprich, Risto Kurppa, Jukka Ukkonen, Tuomo Ylitalo, Pekka Janhunen, Edward Hæggström, University of Helsinki
Round Table Discussion
Moderator:
Lee Levine, Process Solutions Consulting, Inc.
4:30 pm - 5:30 pm
This year’s panel will discuss the future of wire bonding: materials, processes, devices.
Panelist:
Bob Chylak, Kulicke & Soffa Industries, Inc.
Leroy Christie, ASM Pacific Technology, Ltd.
Dan Evans, Palomar Technologies, Inc.
Bernd Appelt, ASE Group
Flynn Carson, STATS ChipPAC Ltd.
Closing Remarks: 5:30 pm
