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IMAPS and SEMI proudly announce an
Advanced Technology Workshop on |
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Wire Bonding
Monday, July 14, 2008
Intercontinental Hotel, San Francisco
Co-located with SEMICON West 2008
Hotel Cut-off is June 27, 2008
Monday, July 14, 2008
Registration: 7:00am - 5:00pm
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Session 1: Applications and Ultrasonics
Co-Chairs: Lee Levine, Process Solutions Consulting & Daniel Evans, Palomar Technologies, Inc.
8:00 AM - 12:00 PM
Wire Bonding of a RF-SOE Package using a Gold Ball Bonder
Daniel D. Evans, Jr., Alberto Perez, Palomar Technologies, Inc.
Overview of Fine Pitch Wire Bonding Development on Low k/Cu Wafers for High Reliability Performance
Chu-Chung (Stephen) Lee, TuAnh Tran, Freescale Semiconductor, Inc.
High Resolution Failure Analysis Comparing Au Wire Thermosonic Bonding and Ultrasonic Bonding using an Al-Coated Au Wire for IC Interconnection
Robert Klengel, L. Berthold, M. Petzold, E. Milke, T. Müller, Fraunhofer Institute for Mechanics of Materials |
Session 2: Heavy Wire Wedge & Ribbon Bonding
Co-Chairs: Mike Mckeown, Orthodyne Electronics Corporation & Jovy Michael G. Sena, Oerlikon ESEC USA Inc.
8:00 AM - 11:00 AM
Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination to Improve Wire Bonding
Scott D. Szymanski, March Plasma Systems
Ribbon Bonding for High Frequency Applications
Roberto Gilardoni, Hesse & Knipps GmbH
PowerRibbon – An Alternative Power Interconnect for Hybrid DC-DC Converter Multi-Chip Packages
Christoph Luechinger, Orthodyne Electronics Corporation |
Break: 9:30 am - 10:00 am
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Frequency Interactions with Semiconductor Packaging using Thermosonic Wire Bond Interconnects
Jon W. Brunner, Gary Schulze, Dominic DeAngelis, Bob Chylak, Kulicke and Soffa Industries, Inc.
The Effects of 120KHz Ultrasonic Frequency on the Reliability of Fine Pitch Gold Wire Bonding
Minh-Nhat Le, Jianbiao (John) Pan, Cuong Van (C.V.) Pham, California Polytechnic State University
Process Integrated Quality Control for Wire Bonding
Roberto Gilardoni, Hesse & Knipps GmbH
The Characteristics of Copper Bonding Wire for Standard IC Package Marcus Goh, Tanaka Electronics Singapore Pte. Ltd. |
Wire Bond Comparison of Different Aluminum Alloys and Thicknesses
Barry Njoes, Technical Materials Inc.; Mike McKeown, Orthodyne Electronics Corporation; Alex Marralaw, Jason Hibbert, Farmingdale State University
Large Diameter Wedge & PowerRibbon™ Bumping Technology
Mike Mckeown, Orthodyne Electronics Corporation
Automatic Optical Inspection of Wire Bonds
Wolf Rüdiger Pennuttis, Viscom Inc. |
Lunch: 12:00 noon – 1:00 pm
Session 3: Stacked Die, Copper, Reliability
Co-Chairs: Jianbiao (John) Pan, California Polytechnic State University & Chu-Chung (Stephen) Lee, Freescale Semiconductor, Inc.
1:00 PM - 5:00 PM
Die-Breakage and Ultra-Low-Loop Wire Bond Mechanisms for Very Thin Overhang Stacked Die
Jovy Michael G. Sena, Marcelino Buenaflor, Ireneo Villavert, Oerlikon ESEC USA Inc.
Addressing Challenges of Stacked Die Wire Bonding
Shinichi Nishiura, Shinkawa Ltd.
Wire Bond Challenges of Stacked Dice Devices
Charles J. Vath, III, J. Premkumar, M. Sivakumar, M. Kumar, ASM Tech Singapore, Pte. Ltd.
Break: 2:30 pm - 3:00 pm
Copper Wire Bonding for Mid to High I/O Count Packages
Bob Chylak, Kulicke and Soffa Industries Inc.
Investigation on Copper Wire Bonding Reliability on TQFP Package
Hong Meng Ho, Sutiono Sylvia, Jamin Ling, Kulicke & Soffa (S.E.A.) Pte., Ltd.; Spencer Chew, Andrea Soriano, Alvin Seah, Cookson Semiconductor Packaging Materials
Bondability and Reliability of X-WireTM Insulated Wire for Advanced Packaging Applications
William Crockett, Y. K. Song, Microbonds Inc.; H. T. Lee, G. S. Yun, STATSChipPAC Ltd.
Converting Au Stud Bumps to a Non-Embrittling Surface for Sn Based Solders
Terence Q. Collier, CV Inc.
Closing Remarks: 5:05 pm |
Register On-line | Hotel Reservations
Housing: Hotel Cut-off is June 27, 2008
The IMAPS ATW is being run at the Intercontinental San Francisco Hotel, in conjunction with SEMICON West.
To book online, Please visit the official housing site: https://www.cmrhousing.com/SEMI_S4/Welcome.aspx
Or call the SEMICON West Housing Office
Monday - Friday, 9am - 9pm (Eastern Time)
1.800.421.2499 (US & Canada)
1.415.979.2287 (International)
Room Rate: Single/Double: $245/night
Please reference SEMICON West when making reservations by phone.
InterContinental San Francisco Hotel
888 Howard Street
San Francisco, CA 94103
Speaker Dates/Information:
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Abstract(s) due to IMAPS: April 25, 2008
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Speaker Notification/Confirmation emailed: April 30, 2008
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Extended Abstract or Presentation Material due: June 13, 2008
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Powerpoint/Presentation file for CD-Rom due not later than: July 14, 2008
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Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
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