Advanced System-in-Package (SiP) Conference
A GLOBAL VIRTUAL CONFERENCE!
August 9 - 12, 2021
The top global virtual event for Advanced System-in-Package technologies!
Combining the 3D ASIP and IMAPS SiP events into an exciting, comprehensive program:
One event covering SiP technology developments, solutions and business trends.
Advanced SiP 2021 will feature three days of LIVE virtual technical content (keynote speakers, panel discussions, and professional development courses) as well as on-demand access to 18 technical presentations. The LIVE conference will run August 9-12. On-demand presentations will be available that week as well, and IMAPS will capture/record all of the LIVE presentations and make those replay videos available for 30 days (along with the on-demand speakers as well). The Virtual Conference will provide dynamic learning and technology updates on SiP trends and new engineering innovations from the industry's global SiP leaders.
Thank you to the 2021 SiP Conference Committee
Nozad Karim (Amkor); Jan Vardaman (Tech Search Intl.); Eelco Bergman (ASE); Curtis Zwenger (Amkor); Mark Scannell (CEA Leti - Auto); Christo Bojkov (Qorvo)
HIR Workshop | Monday, August 9, 2021
Presentations from Infineon, 3MTS, ASE, NXP, IZM, Analog Deices, Soft MEMS, Univ. of Maryland, North Carolina State Univ., Greenwich Univ., Lamar Univ., Inphi, and Intel.
Available to all full conference registrants at no additional cost!
- SiP Solutions for 5G/IOT
- SiP for Automotive, Industrial & Power
- SiP EDA/Design/Modeling
- HPC/SiPh, Chiplet Integration
- SiP Test & Yield Enablement
Mark Gerber, ASE US
Tom Dory, Fujifilm
Urmi Ray, Consultant
John Lau, Unmicron Technology Corp.
August 10 - 12-1PM Eastern
SiP Challenges for 5G
The 5G rollout is underway for both sub 6GHz and mmWave. The design, fabrication, and test of SiPs, especially to support mmWave 5G applications, present challenges. This panel will discuss issues including design, materials, and test.
Michael Liu, Director, JCET Group; Nozad Karim, Amkor Technology; Mark Gerber, ASE; Tanja Braun, Fraunhofer; John Park, Cadence
Moderator: Jan Vardaman, TechSearch International
August 11 - 12-1PM Eastern
Solving Complex Design Challenges in HI and SiP
Moderator: Urmi Ray, Consultant
August 12 - 12-1PM Eastern
Moderator: Eelco Bergman, ASE Group
IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2021 combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2021 offers cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, computing and networking market segments.
"Advanced SiP technology" is an umbrella term to cover a variety of SiP subsets, such as laminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP and modules. Advanced SiP 2021 covers two major segments: microelectronic system design and system integration in a package.
The current trend is to integrate a full system or subsystem in an extremely miniaturized, smaller volume package structure with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.
IMAPS is planning a return of the Advanced SiP Conference as an in-person event in Sonoma, CA, USA!
Advanced SiP 2022 will be held June 21-23, 2022, at the DoubleTree by Hilton Sonoma - Wine Country.