Advanced System-in-Package (SiP) Conference 2021
A GLOBAL VIRTUAL CONFERENCE!
August 9 - 12, 2021
The top global virtual event for
Advanced System-in-Package technologies!
One event covering SiP technology developments, solutions and business trends.
Advanced SiP 2021 featured three days of technical content (keynote speakers, panel discussions and 18 technical presentations. The conference recordings are available now through September 13, 2021. The Virtual Conference provides dynamic learning and technology updates on SiP trends and new engineering innovations from the industry's global SiP leaders.
Thank you to the 2021 SiP Conference Committee:
Nozad Karim (Amkor); Jan Vardaman (Tech Search Intl.); Eelco Bergman (ASE); Curtis Zwenger (Amkor); Mark Scannell (CEA Leti - Auto); Christo Bojkov (Qorvo)
Presentations from Infineon, 3MTS, ASE Group, NXP, IZM, Analog Devices, Tyndall, Greenwich Univ., and Lamar Univ.
Available to all full conference registrants at no additional cost!
- SiP Solutions for 5G/IOT
- SiP for Automotive, Industrial & Power
- SiP EDA/Design/Modeling
- HPC/SiPh, Chiplet Integration
- SiP Test & Yield Enablement
SiP Challenges for 5G
The 5G rollout is underway for both sub 6GHz and mmWave. The design, fabrication, and test of SiPs, especially to support mmWave 5G applications, present challenges. This panel will discuss issues including design, materials, and test.
Michael Liu, Director, JCET Group; Nozad Karim, Amkor Technology; Mark Gerber, ASE; Tanja Braun, Fraunhofer; David Vye, Cadence
Moderator: Jan Vardaman, TechSearch International
Solving Complex Design Challenges in HI and SiP
The emerging trend of complex HI packages, including 2.5D/3D, RFFEM exacerbates design and validation challenges. This panel will address solution strategies from R&D to execution.
Panelists: Javi DeLaCruz, ARM, George Harris, Amkor Technology, Madhavan Swaminathan, Georgia Tech, and Keith Felton, Siemens EDA
Moderator: Urmi Ray, Consultant
Chiplet Integration for HPC Applications - Enabling Mass Adoption
The industry shift to hetero/homogeneously integrated based chip design solutions has started and initial products have been introduced by several leading player who have the ability to vertically control the device and interface designs for all parts of the integrated solution. The topic we want to address is what are the challenges and opportunities that will enable broad based adoption of this new paradigm in the design of advanced server and network processors and SoC‘.
Panelists: Jeorge Hurtarte, Teradyne; Ravi Agarwal, Facebook; Kevin Quillen, ANSYS; Amit Marathe, Google
Moderator: Eelco Bergman, ASE Group
IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2021 combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2021 offers cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, computing and networking market segments.
"Advanced SiP technology" is an umbrella term to cover a variety of SiP subsets, such as laminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP and modules. Advanced SiP 2021 covers two major segments: microelectronic system design and system integration in a package.
The current trend is to integrate a full system or subsystem in an extremely miniaturized, smaller volume package structure with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.
IMAPS is planning a return of the Advanced SiP Conference as an in-person event in Sonoma, CA, USA!
Advanced SiP 2022 will be held June 21-23, 2022, at the DoubleTree by Hilton Sonoma - Wine Country.