Advanced System-in-Packaging (SiP) Conference 2022
June 20-23, 2022
DoubleTree by Hilton Sonoma - Wine Country
The top global event for Advanced System-in-Package technologies!
Combining the 3D ASIP and IMAPS SiP events into an exciting, comprehensive program:
One event covering SiP technology developments, solutions and business trends.
IMAPS has established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2022 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2022 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, computing and networking market segments.
"Advanced SiP technology" is an umbrella term to cover a variety of SiP subsets, such as laminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP and modules. Advanced SiP 2022 covers two major segments: microelectronic system design and system integration in a package.
The current trend is to integrate a full system or subsystem in an extremely miniaturized, smaller volume package structure with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.
Registration for Advanced SIP Conference 2022 is now open, including sponsorship and exhibit opportunities.
SiP speaker opportunities are by invitation-only from the technical committee.
Wednesday, June 22 6:30PM-8PM
Wine Tasting, Education & Networking
Thank you to our sponsor:
Appetizers and Snacks provided
Sip at SiP participants will enjoy a wine education experience led by Brian Schmaltz, tasting five delicious and unique wines, coupled with delicious food (artesian cheeses, vegetable crudite, various pastas, tri-tip steak, and more), all while networking with fellow conference attendees! Brian and Robin have hand-selected five incredible wines for you to enjoy:
- AC Rosé made from 100% Pinot Noir Sangiacomo Vineyards
- 2021 Chardonnay Sangiacomo Vineyard (Barrel Sample, to be bottled this Summer)
- 2021 Pinot Noir Signal Ridge Vineyard (Barrel Sample, to be bottled this Summer)
- 2018 Volume VI Napa Cabernet Sauvignon
- Special Vintage Napa Cabernet Sauvignon
Advanced SiP Conference General Chair
Mark Gerber, ASE
Advanced SiP Conference General Chair-Elect
Steven Kummerl, Texas Instruments
Advanced SiP Conference Technical Committee
|Jon Aday, IMAPS VP Technology||Christo Bojkov, Qorvo||Mark Scannell, CEA LETI|
|Eelco Bergman, ASE||Habib Hichri, Ajinomoto||Jan Vardaman, TechSearch International|
|Tarak Railkar, Qorvo||Curtis Zwenger, Amkor|
Tuesday, June 21
- 8:15am - 9:00am - System-level Optimization Opportunities and Challenges in the Era of Slowing Silicon Process Technology - Chidi Chidambaram, Qualcomm
- 9:00am - 9:45am - Silicon SiPs for the Metaverse - Ron Ho, Meta
Wednesday, June 22
- 8:00am - 8:45am - Trends and Reliability Challenges in Advanced Driving Assistance System (ADAS) - Khai Nguyen, nVidia
- 8:45am - 9:30am - Automotive Packaging Ecosystem - Anindya Poddar, Texas Instruments
Thursday, June 23
- 8:15am - 9:00am - Conducting the Semiconductors: The Role of Design in the SysMoore Era - Ming Zhang, Synopsys
The Heterogeneous Integration Roadmap (HIR) is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress.
9:00am - 12:15pm
HIR Session Introduction: Mark Gerber, General Chair and Bill Chen HIR Introduction
Featured HIR Speakers on:
HIR Overview: Bill Chen, ASE
Integrated Photonics: Bill Bottoms, 3MTS
Automotive Electronics: Vikas Gupta, ASE
Thermal Management: Mehdi Asheghi, Stanford Univ.
Supply Chain: Thomas Gregorich, Infinera
HIR Workshop Final Question & Closing Remarks: Bill Chen, ASE
12:15pm - 1:00pm
HIR Workshop Lunch
1:00pm - 2:45pm
3D Package Assembly Processes and Technology
System-in-Package (SiP) - System Solutions Through Miniaturization
3:15pm - 5:00pm
Chiplet Design and Heterogeneous Integration Packaging
2 Keynotes from Meta & Qualcomm
Panel Session on 5G/Mobile
2 Keynotes from nVidia & Texas Instruments
Panel Session on Chiplets/HPC
Sip at SiP - Wine Tasting
(tickets are $50 per person)
|Automotive & Power|
1 Keynote from Synopsys
|Materials, Test, Inspection|
DoubleTree by Hilton Sonoma - Wine Country
One Doubletree Drive | Rohnert Park, CA 94928
Transportation to the hotel:
Attendees can access the shuttle at either OAK or SFO airports at the Airporter Shuttle Bay outside of baggage claim. You can either reserve and pay online beforehand and print out your boarding passes or you can pay with cash on board. Fares are collected when the shuttle stops in Petaluma right before getting to the hotel. Cost is $41 per person each way. There is another shuttle that comes through the shuttle bay as well, which goes to Marin County, so make sure you get on the Sonoma County Airport Express shuttle.
IMAPS Advanced SiP Sponsorship & Exhibit Opportunities
Limited event sponsorship opportunities are available and won’t last long. Contact Brian Schieman at email@example.com to secure your organization’s sponsorship for SiP 2022 before they are filled. Click here for the full Exhibitor/Sponsor Prospectus detailing all of the package options, pricing, and more.