Advanced System-in-Packaging (SiP) Conference 2022

June 21-23, 2022

www.advancedsip.org

DoubleTree by Hilton Sonoma - Wine Country



The top global event for Advanced System-in-Package technologies!
Combining the 3D ASIP and IMAPS SiP events into an exciting, comprehensive program:

One event covering SiP technology developments, solutions and business trends.


IMAPS has established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2022 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2022 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, computing and networking market segments.

"Advanced SiP technology" is an umbrella term to cover a variety of SiP subsets, such as laminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP and modules. Advanced SiP 2022 covers two major segments: microelectronic system design and system integration in a package.

The current trend is to integrate a full system or subsystem in an extremely miniaturized, smaller volume package structure with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.

Registration for Advanced SIP Conference 2022 is now open, including sponsorship and exhibit opportunities.


SiP speaker opportunities are by invitation-only from the technical committee. 


   

ADVANCED SiP COMMITTEE

Advanced SiP Conference General Chair

Mark Gerber, ASE

Advanced SiP Conference General Chair-Elect

Steven Kummerl, Texas Instruments

Advanced SiP Conference Technical Committee

Jon Aday, IMAPS VP Technology  Christo Bojkov, QorvoMark Scannell, CEA LETI
Eelco Bergman, ASEHabib Hichri, AjinomotoJan Vardaman, TechSearch International

Tarak Railkar, QorvoCurtis Zwenger, Amkor

KEYNOTE SPEAKERS

Tuesday, June 21

  • 8:15am - 9:00am - Silicon SiPs for the Metaverse - Ron Ho, Meta
  • 9:00am - 9:45am - System-level Optimization Opportunities and Challenges in the Era of Slowing Silicon Process Technology - Chidi Chidambaram, Qualcomm

Wednesday, June 22

  • 8:00am - 8:45am - Trends and Reliability Challenges in Advanced Driving Assistance System (ADAS) - Khai Nguyen, nVidia
  • 8:45am - 9:30am - Automotive Packaging Ecosystem - Chris Manack, Texas Instruments

Thursday, June 23

  • 8:15am - 9:00am - Conducting the Semiconductors: The Role of Design in the SysMoore Era - Ming Zhang, Synopsys

PROGRAM AND SCHEDULE

Monday, June 20, 2022

HIR Workshop

8:00am - 8:15am

HIR Session Introduction: Mark Gerber, General Chair and Bill Chen HIR Introduction

8:15am - 9:00am

Keynote: TBD

9:00am - 9:25am

Workshop Intro & HIR Overview

9:25am - 9:50am

Automotive Electronics

9:50am - 10:15am

Break

10:15am - 10:40am

SiP & Module

10:40am - 11:05am

MEMS & Sensor Integration

11:05am - 11:30am

Integrated Power Electronics

11:30am - 11:55am

Workshop Q&A and Completion

12:00pm - 1:00pm

Lunch

PDC Courses

1:00pm - 2:45pm

PDC 1

3D Package Assembly Processes and Technology 
Tom Dory, Fujifilm Electronic Materials USA

PDC 2

System-in-Package (SiP) - System Solutions Through Miniaturization 
Mark Gerber, ASE US, Inc.

3:15pm - 5:00pm

PDC3

Chiplet Design and Heterogeneous Integration Packaging 
John H. Lau, Unimicron Technology Corporation

PDC 4

System-in-Package (SiP) Reliability (TBD) 
Pradeep Lall, Auburn University



l

Tuesday, June 21

Wednesday, June 22

Thursday, June 23

Special Activities
Exhibits Open
Start-up Competition
Welcome Reception
General Sessions
5G/Mobile
10:30-11:00am  Warpage Simulation and Measurement of a SIP Module for Laptop CPU Applications 
Pouya Talebbeydokhti, Intel Corp.
11:00-11:30am
TBD

Matthew Poulton, Qorvo

11:30-12:00pm
Multi-terminal thin Silicon Capacitors enabling best in-package decoupling strategy for Mobile and HPC

Mohamed Jatlaoui, Murata

Wearables/IoT
1:30-2:00pmEmpowering Front-End Cellular Innovations with Advanced SiP Solutions Curtis Zwenger, Amkor Technology
2:00-2:30pm
Flexing, Bending and Stretching to the Future of Wearable Medical Devices

Mark Poliks, Binghamton Univ.

2:30-3:00pmInnovative Materials for Advanced Packaging and System in Package (SiP)
Dongkai Shangguan, Indium Corp.

Tuesday Panel Session on 5G/Mobile
Moderator: Jan Vardaman, TechSearch International

Special Activities
Exhibits Open
General Sessions
HPC/SiP
10:15-10:45amThe Path to a Sub fJ/bit Interconnect
Daniel Graf, Zero EC
10:45-11:15amAdvanced Fanout Embedded Bridge Packaging Technology for Chiplets Integration 
Lihong Cao, ASE Group
11:15-11:45amHybrid Bonding – A Key to the Future
Robert Patti, Nhanced Semi.
Automotive & Power
1:15-2:45pmSpeakers TBD
Start-up Competition

Moderator: Jan Vardaman, TechSearch International

Panel Session on Chiplets & HPC

Moderator: Eelco Bergman, ASE Group

Special Activities
Panel Discussion on SiP Challenges & Solutions
General Sessions
EDA/Design
9:00-9:30amDesign and Analysis Challenges for Multi-chiplet 3D Integration
John Park, Cadence
9:30-10:00amEnabling a Chiplet based Ecosystem
Anthony Mastroianni, Siemens
Materials, Test, Inspection
10:45am-11:45am

Title Soon
Amkor Technology

Other Speakers TBD

HOTEL

   

DoubleTree by Hilton Sonoma - Wine Country
One Doubletree Drive | Rohnert Park, CA 94928

Single/Double is $188 per night + taxes/fees

Hotel deadline: May 27, 2022

Click here for hotel reservations at the discounted rate.


Reservations must be made before the cutoff date.
Cancellations must be made not later than 48-hours prior to arrival or the guests will be charged in full.

 

Doubletree Sonoma


THANK YOU SPONSORS AND EXHIBITORS

IMAPS Advanced SiP Sponsorship & Exhibit Opportunities

Limited event sponsorship opportunities are available and won’t last long. Contact Brian Schieman at bschieman@imaps.org to secure your organization’s sponsorship for SiP 2022 before they are filled. Click here for the full Exhibitor/Sponsor Prospectus detailing all of the package options, pricing, and more.

   REGISTER FOR A TABLETOP/SPONSORSHIP   

PREMIER SPONSORS

WINE EVENT SPONSOR


COFFEE BREAK SPONSOR


STARTUP SESSION SPONSOR


OFFICIAL INDUSTRY PARTNER


OFFICIAL MEDIA SPONSOR


EXHIBITORS

3D InCites
ASE Group
Indium Corp.
JCET

NAMICS
Promex
TechSearch International