Advanced System-in-Packaging (SiP) Conference 2022

June 21-23, 2022

DoubleTree by Hilton Sonoma - Wine Country

The top global virtual event for Advanced System-in-Package technologies!
Combining the 3D ASIP and IMAPS SiP events into an exciting, comprehensive program:

One event covering SiP technology developments, solutions and business trends.

IMAPS has established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2022 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2022 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, computing and networking market segments.

"Advanced SiP technology" is an umbrella term to cover a variety of SiP subsets, such as laminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP and modules. Advanced SiP 2022 covers two major segments: microelectronic system design and system integration in a package.

The current trend is to integrate a full system or subsystem in an extremely miniaturized, smaller volume package structure with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.

Featuring two and a half days of technical sessions, panel discussions, exhibits and local networking activities, Advanced SiP 2022 will provide dynamic learning and technology updates on SiP trends and new engineering innovations from the industry‘s global SiP leaders. The conference will cover the following vital topics:

  1. Keynotes on marketing and technology trends
  2. SiP system integration and challenges for mobile, loT, 5G, automotive, computing and networking products
  3. 2.5D/3D and WLSiP applications, assembly and test challenges
  4. Material and substrate technology developments
  5. SiP test characterization and production test
  6. Advancements in SiP R&D

Registration for Advanced SIP Conference 2022 will open soon, including sponsorship and exhibit opportunities.

Speaking and presenting opportunities are by invitation from the technical committee. The program is currently in development and will be released this spring!   


Advanced SiP Conference General Chair

Mark Gerber, ASE

Advanced SiP Conference General Chair-Elect

Steven Kummerl, Texas Instruments

Advanced SiP Conference Technical Committee

Jon Aday, IMAPS VP Technology  Christo Bojkov, QorvoMark Scannell, CEA LETI
Eelco Bergman, ASEHabib Hichri, AjinomotoJan Vardaman, TechSearch International

Tarak Railkar, QorvoCurtis Zwenger, Amkor


IMAPS Advanced SiP Sponsorship & Exhibit Opportunities

Limited event sponsorship opportunities are available and won’t last long. Contact Brian Schieman at to secure your organization’s sponsorship for SiP 2022 before they are filled. The full Exhibitor/Sponsor Prospectus detailing all of the package options, pricing, and more will be available soon.