Advancing Microelectronics Magazine
IMAPS Advancing Microelectronics Magazine
IMAPS revealed an exciting new facelift to our hallmark member magazine Advancing Microelectronics! After decades of mailbox delivery, the magazine has moved to a purely interactive digital format starting in 2020.
The print publication of Advancing Microelectronics has already been complemented by publication in the exclusive IMAPSource digital archives for several years. The archived version of each issue will remain accessible to members and nonmembers alike, but the primary delivery of the magazine is shifting to a new, highly interactive platform with enhanced tools for authors, readers, and advertisers.
This long overdue change is timely for our signature publication, but the value of IMAPS membership is rooted in connections. We believe that the enhancements ushered in by this format will improve the quality of our members’ connections to the industry, only adding to the member experience. We look forward to hearing your impressions of the new Advancing Microelectronics.
YOU CAN EXPECT:
- Opportunities to share your voice and opinions via surveys and direct comments on our content
- Expanded technical content no longer subject to the restraint of page limitations
- More cost-effective marketing and product promotions for our corporate members
- Interactive content such as videos, event registration links, and direct connections to advertisers
- Enhanced electronic readability
Browse the Issues
IMAPS 2022 Boston - Show Issue
Vol. 49 No. 4 (July-August 2022)
Inside the Issue:
Ultrasonic Wire Bond Outlier Classification...
2021 Issues (Volume 48):
Vol. 48 No. 5 (September-October 2021)
Advanced Low Df Dry Film...
Medical Device Technology
Vol. 48 No. 3 (May-June 2021)
Fine-Volume Adhesive Jetting - Trends, Applications, and Capability in Medical Electronics
Medical Implants - Getting Smaller but Going Further
RF Technology in a Complete Glass Package
Heterogeneous Integration Issue
Vol. 47 No. 6 (November-December 2020)
48V Ecosystem and Power Packaging Trends
High-Density Heterogeneous Integration for Implantable Electronic Systems
An Ultra-Compact Transit Module through Additive Manufacturing
Advanced SiP Special Issue
Vol. 47 No. 3 (Summer 2020)
How AiP Technology Helps Enable 5G
Heterogeneous Integration Technologies
Please contact the Managing Editor with any questions or comments about the magazine.
Executive Director, IMAPS