Advancing Microelectronics Magazine
IMAPS Advancing Microelectronics Magazine Moves from Mailbox to Inbox
IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics! After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue.
The print publication of Advancing Microelectronics has already been complemented by publication in the exclusive IMAPSource digital archives for several years. The archived version of each issue will remain accessible to members and nonmembers alike, but the primary delivery of the magazine is shifting to a new, highly interactive platform with enhanced tools for authors, readers, and advertisers.
This long overdue change is timely for our signature publication, but the value of IMAPS membership is rooted in connections. We believe that the enhancements ushered in by this format will improve the quality of our members‘ connections to the industry, only adding to the member experience. We look forward to hearing your impressions of the new Advancing Microelectronics.
YOU CAN EXPECT:
- Opportunities to share your voice and opinions via surveys and direct comments on our content
- Expanded technical content no longer subject to the restraint of page limitations
- More cost-effective marketing and product promotions for our corporate members
- Interactive content such as videos, event registration links, and direct connections to advertisers
- Enhanced electronic readability
Browse the Issues
2021 Issues (Volume 48):
Medical Device Technology
Vol. 48 No. 3 (May-June 2021)
Featured Articles:
Fine-Volume Adhesive Jetting - Trends, Applications, and Capability in Medical Electronics
Medical Implants - Getting Smaller but Going Further
RF Technology in a Complete Glass Package
Advanced System-in-Package (SiP)
Vol. 48 No. 2 (March-April 2021)
Featured Articles:
Advanced Packaging and its Characterization for 5G mmWave Antenna in Package
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
2-High Stacked Heterogeneous System-in-Package (HSIP) Modules Using Solder Assembly
Solder Paste Attributes for System-in-Package (SiP) Assembly
Device Packaging "Show Issue"
Vol. 48 No. 1 (January-February 2021)
Featured Articles:
Adaptive High Density RDL Technologies for Panel Level Packaging
Fluxless Bonding Via In-Situ Oxide Reduction
Advancements and Integration of Thin Glass Solutions
2020 Issues (Volume 47):
Heterogeneous Integration Issue
Vol. 47 No. 6 (November-December 2020)
Inside:
48V Ecosystem and Power Packaging Trends
High-Density Heterogeneous Integration for Implantable Electronic Systems
An Ultra-Compact Transit Module through Additive Manufacturing
Advanced Materials Issue
Vol. 47 No. 5 (September-October 2020)
Inside:
Challenges in Fine Feature Solder Paste
Solder Paste for SiP
Thermal Materials for Packaging Power
IMAPS 2020 Show Issue
Vol. 47 No. 4 (July-Aug 2020)
Inside:
Semi-additive Process-based Cu Wirings
Ferrites in Transfer Molded Power SiPs
A Flexible Down-Converter for Satellite Communication
Advanced SiP Special Issue
Vol. 47 No. 3 (Summer 2020)
Inside:
How AiP Technology Helps Enable 5G
Heterogeneous Integration Technologies
Click here to read the Advanced SiP special issue!
Contact
Managing Editor
Please contact the Managing Editor with any questions or comments about the magazine.
Brian Schieman
Executive Director, IMAPS
bschieman@imaps.org
Advertising
Click here to learn more about advertising opportunities, including new video ads!
IMAPS Staff
info@imaps.org