Advancing Microelectronics Magazine


IMAPS Advancing Microelectronics Magazine 


IMAPS revealed an exciting new facelift to our hallmark member magazine Advancing Microelectronics! After decades of mailbox delivery, the magazine has moved to a purely interactive digital format starting in 2020.

The print publication of Advancing Microelectronics has already been complemented by publication in the exclusive IMAPSource digital archives for several years. The archived version of each issue will remain accessible to members and nonmembers alike, but the primary delivery of the magazine is shifting to a new, highly interactive platform with enhanced tools for authors, readers, and advertisers.

This long overdue change is timely for our signature publication, but the value of IMAPS membership is rooted in connections. We believe that the enhancements ushered in by this format will improve the quality of our members’ connections to the industry, only adding to the member experience. We look forward to hearing your impressions of the new Advancing Microelectronics.


  • Opportunities to share your voice and opinions via surveys and direct comments on our content
  • Expanded technical content no longer subject to the restraint of page limitations
  • More cost-effective marketing and product promotions for our corporate members
  • Interactive content such as videos, event registration links, and direct connections to advertisers
  • Enhanced electronic readability

Browse the Issues

2023 Issues (Volume 50):
Advancing Microelectronics

Device Packaging "Show Issue"
Vol. 50,  No. 1

Inside the Issue:

A Novel 2D/3D X-ray Microscopy...
Advanced Glass Carriers...
Incorporating Hierarchical Construction...
Addressing Advanced IC Substrate...

2022 Issues (Volume 49):


Advancing Microelectronics

Vol. 49 No. 6

Inside the Issue:

State-of-the-Art and Outlooks for 2.3D IC Integration...
Why the Packaging Community Needs to Embrace Assembly Design Kits...
The Evolution of Moore’s Law Through Chipletized Architectures...

Advancing Microelectronics

Advanced Packaging Processes and Materials
Vol. 49 No. 5

Inside the Issue:

How to Tailor Immersion Tin Plating for IC Substrate Applications..
Electrochemical Plating System Development of Nanotwinned Cu...
Build-Up Materials with Low Insertion Loss/Fine Pitch Wiring...
Photo-Imageable Dielectrics Enabling Structured MEMS...

Advancing Microelectronics

IMAPS 2022 Boston - Show Issue
Vol. 49 No. 4

Inside the Issue:

Implementation of Trusted Manufacturing & AI-based Process...
Ultrasonic Wire Bond Outlier Classification...

Advancing Microelectronics

On-shoring of Packaging and Assembly
Vol. 49 No. 3

Inside the Issue:

State-of-the-Art Heterogeneous...
Transforming the Supply Chain...
Bridging Domestic Supply and Performance...
Heterogeneous Integration Manufacturing...

Click here to read the On-shoring Issue!

Advancing Microelectronics

SPECIAL ISSUE: Optical Technology Integration
Vol. 49 Special Issue (Spring 2022)

Inside the Issue:

Sustainable Bandwidth Scaling...
Optical Interconnect Challenges...
3D Sensing Package...

Click here to read the Optical Special Issue!

Advancing Microelectronics

Vol. 49 No. 2

Inside the Issue:
Advanced Fanout...
Heterogeneous Chiplet Design...
3D-IC Design Challenges...
Warpage Simulation...
Empowering Front-End Cellular Innovations...

Click here to read the SiP Issue!

Advancing Microelectronics

Device Packaging
Vol. 49 No. 1

Inside the Issue:
Heterogeneous IC Packaging...
Effect of Silicon BEOL...
Thermal Interface Materials...

Click here to read the Device Packaging Issue!

2021 Issues (Volume 48):

Advanced Materials
Vol. 48 No. 5 (September-October 2021)

Inside the Issue:
Advanced Low Df Dry Film...
Advanced No-Clean Solder Paste...
Design of Undeerfill Materials...

Click here to read the Advanced Materials Issue!

Advancing Microelectronics Show Issue

IMAPS 2021 Show Issue
Vol. 48 No. 4 (July-August 2021)

Inside the Issue:
Technical Program and PDCs
Keynote Presentations
In-Person Live Agenda
On-Demand Presentations

Click here to read the IMAPS 2021 Show Issue!

Medical Device Technology
Vol. 48 No. 3 (May-June 2021)

Featured Articles:
Fine-Volume Adhesive Jetting - Trends, Applications, and Capability in Medical Electronics
Medical Implants - Getting Smaller but Going Further
RF Technology in a Complete Glass Package

Click here to read the Medical Device Technology Issue!

Advancing Microelectronics, Volume 28, Number 2

Advanced System-in-Package (SiP)
Vol. 48 No. 2 (March-April 2021)

Featured Articles:
Advanced Packaging and its Characterization for 5G mmWave Antenna in Package
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
2-High Stacked Heterogeneous System-in-Package (HSIP) Modules Using Solder Assembly
Solder Paste Attributes for System-in-Package (SiP) Assembly

Click here to read the SiP Issue!

Advancing Microelectronics, Volume 28, Number 1

Device Packaging "Show Issue"
Vol. 48 No. 1 (January-February 2021)

Featured Articles:
Adaptive High Density RDL Technologies for Panel Level Packaging
Fluxless Bonding Via In-Situ Oxide Reduction
Advancements and Integration of Thin Glass Solutions

Click here to read the Device Packaging Issue!

2020 Issues (Volume 47):

Heterogeneous Integration Issue
Vol. 47 No. 6 (November-December 2020)

48V Ecosystem and Power Packaging Trends
High-Density Heterogeneous Integration for Implantable Electronic Systems
An Ultra-Compact Transit Module through Additive Manufacturing

Click here to read the Heterogenous Integration Issue!

Advanced Materials Issue
Vol. 47 No. 5 (September-October 2020)

Challenges in Fine Feature Solder Paste
Solder Paste for SiP
Thermal Materials for Packaging Power

Click here to read the Advanced Materials Issue!

IMAPS 2020 Show Issue
Vol. 47 No. 4 (July-Aug 2020)

Semi-additive Process-based Cu Wirings
Ferrites in Transfer Molded Power SiPs
A Flexible Down-Converter for Satellite Communication

Click here to read the Show Issue!

Advanced SiP Special Issue 
Vol. 47 No. 3 (Summer 2020)

How AiP Technology Helps Enable 5G
Heterogeneous Integration Technologies

Click here to read the Advanced SiP special issue!


Managing Editor
Please contact the Managing Editor with any questions or comments about the magazine.

Brian Schieman
Executive Director, IMAPS

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