Advancing Microelectronics Magazine

IMAPS Advancing Microelectronics Magazine Moves from Mailbox to Inbox

IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics! After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue.

The print publication of Advancing Microelectronics has already been complemented by publication in the exclusive IMAPSource digital archives for several years. The archived version of each issue will remain accessible to members and nonmembers alike, but the primary delivery of the magazine is shifting to a new, highly interactive platform with enhanced tools for authors, readers, and advertisers.

You can expect:

• Opportunities to share your voice and opinions via surveys and direct comments on our content
• Expanded technical content no longer subject to the restraint of page limitations
• More cost-effective marketing and product promotions for our corporate members
• Interactive content such as videos, event registration links, and direct connections to advertisers
• Enhanced electronic readability

This is a timely and long overdue change for our signature publication, but the value of IMAPS membership is rooted in connections. We believe that the enhancements ushered in by this format will improve the quality of our members‘ connections to the industry, only adding to the member experience. We look forward to hearing your impressions of the new Advancing Microelectronics.

Browse the Issues

          2021 Issues (Volume 48):

Device Packaging "Show Issue"
Vol. 48 No. 1 (January-February 2021)

Featured Articles:
Adaptive High Density RDL Technologies for Panel Level Packaging
Fluxless Bonding Via In-Situ Oxide Reduction
Advancements and Integration of Thin Glass Solutions

Click here to read the Device Packaging Issue!

          2020 Issues (Volume 47):

Heterogeneous Integration Issue
Vol. 47 No. 6 (November-December 2020)

Inside:
48V Ecosystem and Power Packaging Trends
High-Density Heterogeneous Integration for Implantable Electronic Systems
An Ultra-Compact Transit Module through Additive Manufacturing

Click here to read the Heterogenous Integration Issue!

Advanced Materials Issue
Vol. 47 No. 5 (September-October 2020)

Inside:
Challenges in Fine Feature Solder Paste
Solder Paste for SiP
Thermal Materials for Packaging Power

Click here to read the Advanced Materials Issue!

IMAPS 2020 Show Issue
Vol. 47 No. 4 (July-Aug 2020)

Inside:
Semi-additive Process-based Cu Wirings
Ferrites in Transfer Molded Power SiPs
A Flexible Down-Converter for Satellite Communication

Click here to read the Show Issue!

Advanced SiP Special Issue 
Vol. 47 No. 3 (Summer 2020)

Inside:
How AiP Technology Helps Enable 5G
Heterogeneous Integration Technologies

Click here to read the Advanced SiP special issue!

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