CICMT - April 18-20
IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023)
www.cicmt.org
Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE,
Albuquerque, NM 87109 USA
A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!
General Chair:
Ammar Kouki, ETS (École de technologie supérieure)
Past General Chair:
Ulrich Schmid, TU Wien
Organizing Committee:
Steve Dai, Sandia National Laboratories | Markus Eberstein, ASML | Heli Jantunen, University of Oulu | Daniel Krueger, Honeywell |
Jens Müller, Technische Universität Ilmenau | Uwe Partsch, Fraunhofer IKTS | Peter Uhlig, IMST
KEYNOTE SPEAKERS
Eric Forsythe, US Army Research Laboratory
PROFESSIONAL DEVELOPMENT COURSES
Attendees must register for each course as an add-on to their overall symposium registration at $325 each for early registration or $425 after March 24. Attendees may select up to one course in each time slot.
Make sure to review your preferred course's date and time slot before registration. Course fees are non-refundable.
Monday, April 17, 2023
- 11:00AM-1:00PM
- PDC1: ADDITIVE MANUFACTURING FUNDAMENTALS WITH APPLICATIONS TO CHIP PACKAGING
Brian English, Engenius Micro
- PDC1: ADDITIVE MANUFACTURING FUNDAMENTALS WITH APPLICATIONS TO CHIP PACKAGING
- 1:30PM-3:30PM
- PDC2: FUNDAMENTALS OF HIGH TEMPERATURE ELECTRONICS
Patrick McCluskey, University of Maryland
- PDC2: FUNDAMENTALS OF HIGH TEMPERATURE ELECTRONICS
- 4:00PM-6:00PM
- PDC3: PACKAGING AND INTEGRATION OF WIDE-BANDGAP POWER SEMICONDUCTORS
Christina DiMarino, Virginia Polytechnic and State University
- PDC3: PACKAGING AND INTEGRATION OF WIDE-BANDGAP POWER SEMICONDUCTORS
TECHNICAL PRESENTATIONS
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.
A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!
CERAMIC INTERCONNECT AND CERAMIC MICROSYSTEMS TECHNOLOGIES CONFERENCE (CICMT)
- Advanced Manufacturing Technologies
- Emerging Materials
- RF and Microwave Applications
- Hybrid and Multichip Packages (Joint Session with APPE)
HIGH TEMPERATURE ELECTRONICS CONFERENCE (HiTEC)
- Passive Devices
- Active Devices and Circuits
- Packaging for High Temp
- Attach & Interconnection
- High Temperature Power Electronics (Joint Session with APPE)
ADVANCED PACKAGING FOR POWER ELECTRONICS CONFERENCE (APPE)
- WBG Package Design and Reliability
- Modeling and Simulation
- Assembly and Thermal Solutions
- Hybrid and Multichip Packages (Joint Session with CICMT)
- High Temperature Power Electronics (Joint Session with HiTEC)
EXHIBITORS & SPONSORS
There will be a joint tabletop exhibition featuring companies from the HiTEC, CICMT and Power Packaging Conferences and extensive networking opportunities with the attendees from each Conference. There will be 30 total tabletops available at this conference, and the space is expected to sell out quickly. For companies wishing for broader exposure and additional benefits, we have a variety of sponsorships available with a range of options and price points. These spots are also very limited for this event. View the exhibit/sponsor prospectus. When you are ready book reserve your space, you can use the online registration or contact bschieman@imaps.org if you need assistance or a custom package.
Be Sure to visit all of the tabletop exhibitors at HiTEC, CICMT and Power Packaging during exhibit hours on April 18 & 19:
Advanced Packaging Solutions LLC
Advanced Test Equipment Corp.
Haiku Tech, Inc.
Henkel Corporation -- POWER CONFERENCE SPONSOR
Heraeus Electronics
Indium Corp.
Materion Corporation -- HiTEC CONFERENCE SPONSOR
NTK Technologies, Inc.
Optomec
Presidio Components -- HiTEC CONFERENCE SPONSOR
Q-Tech Corp.
Stellar Industries Corp.
StratEdge Corporation
Torrey Hills Technologies, LLC
Universal Instruments
Win Source Electronic Technology limited
Zestron Americas
REGISTRATION
Early registration discounts end March 24, 2023. Registration for the conferences includes access to technical sessions across all 3 conferences (HiTEC, CICMT, Power), so attendees can attend any sessions or speakers they wish at this event. The only additional fee is for add-on professional development courses which will be held Monday, April 17 before the full technical conferences begin Tuesday. All registrants also have access to visit the exhibit hall, participate in breakfasts, lunches and breaks and other networking activities, as noted in the program.
| Registration Type | Early (thru Mar. 24) | After Mar. 24 |
| Member | $825 | $925 |
| Nonmember | $1025 | $1125 |
| Speaker/Chair | $595 | $745 |
| Student | $150 | $300 |
| Tabletop Exhibit (includes 1 six-foot tabletop, with 1 booth personnel or full badge; additional discounted full badges at $500/person or booth personnel at $150/person) | $900 member $1050 nonmember | $1000 member $1150 nonmember |
| Premier Sponsorship (includes 2 six-foot tabletops, with 2 full badges and 2 exhibit badges, advertisements, flyer or giveaway distributed to attendees, additional discounted full badges at $500/person or booth personnel at $150/person) | $6000 | $6000 |
| HiTEC Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person) | $3000 | $3000 |
| CICMT Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person) | $3000 | $3000 |
| Power Packaging Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person) | $3000 | $3000 |
| Coffee Break Sponsorship (includes logo recognition and signage, discounted full badges at $500/person) | $1500 | $1500 |
| Professional Development Courses (PDCs announced soon - each course is an additional fee, per course per person - this is in addition to the regular conference registration) | $325 | $425 |
HOTEL RESERVATIONS
IMAPS has arranged for a discounted hotel block at the:
Albuquerque Marriott Pyramid North
5151 San Francisco Road NE
Albuquerque, New Mexico 87109
$179 USD/night + taxes and fees (single/double)
Hotel block closes APRIL 10 and will not be extended
Just 10 miles from the ABQ airport
