CICMT - April 18-20
IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023)
Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE,
Albuquerque, NM 87109 USA
A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!
Ammar Kouki, ETS (École de technologie supérieure)
Past General Chair:
Ulrich Schmid, TU Wien
Steve Dai, Sandia National Laboratories | Markus Eberstein, ASML | Heli Jantunen, University of Oulu | Daniel Krueger, Honeywell |
Jens Müller, Technische Universität Ilmenau | Uwe Partsch, Fraunhofer IKTS | Peter Uhlig, IMST
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.
Planned Session and Paper Topics Include:
1. Advanced materials for passive/active devices and their properties
2. Material processing and device manufacturing technologies
3. Design, modeling, simulation, characterization and reliability
4. Devices and systems for emerging applications
Those wishing to present at the CICMT Conference must submit a ~250 word abstract electronically immediately using the online submission form at: www.cicmt.org. A Final OPTIONAL Manuscript of 4-8pages, two-column format is due February 15, 2023, for all accepted abstracts. Please contact Brian Schieman by email at firstname.lastname@example.org if you have questions. A Proceedings DOWNLOAD containing the conference papers will be distributed to all attendees during the Conference. Speakers are required to pay a reduced registration fee.
Notice of Acceptance: January 6, 2023
There will be a joint tabletop exhibition featuring companies from the HiTEC, CICMT and Power Packaging Conferences and extensive networking opportunities with the attendees from each Conference. There will be 30 total tabletops available at this conference, and the space is expected to sell out quickly. For companies wishing for broader exposure and additional benefits, we have a variety of sponsorships available with a range of options and price points. These spots are also very limited for this event. View the exhibit/sponsor prospectus. When you are ready book reserve your space, you can use the online registration or contact email@example.com if you need assistance or a custom package.
Early registration discounts end March 24, 2023. Registration for the conferences includes access to technical sessions across all 3 conferences (HiTEC, CICMT, Power), so attendees can attend any sessions or speakers they wish at this event. The only additional fee is for add-on professional development courses which will be held Monday, April 17 before the full technical conferences begin Tuesday. All registrants also have access to visit the exhibit hall, participate in breakfasts, lunches and breaks and other networking activities, as noted in the program.
|Registration Type||Early (thru Mar. 24)||After Mar. 24|
|Tabletop Exhibit (includes 1 six-foot tabletop, with 1 booth personnel or full badge; additional discounted full badges at $500/person or booth personnel at $150/person)||$900 member|
|Premier Sponsorship (includes 2 six-foot tabletops, with 2 full badges and 2 exhibit badges, advertisements, flyer or giveaway distributed to attendees, additional discounted full badges at $500/person or booth personnel at $150/person)||$6000||$6000|
|HiTEC Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)||$3000||$3000|
|CICMT Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)||$3000||$3000|
|Power Packaging Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)||$3000||$3000|
|Coffee Break Sponsorship (includes logo recognition and signage, discounted full badges at $500/person)||$1500||$1500|
|Professional Development Courses (PDCs announced soon - each course is an additional fee, per course per person - this is in addition to the regular conference registration)||$325||$425|
IMAPS has arranged for a discounted hotel block at the:
Albuquerque Marriott Pyramid North
5151 San Francisco Road NE
Albuquerque, New Mexico 87109
$179 USD/night + taxes and fees (single/double)
Hotel block closes APRIL 10 and will not be extended
Just 10 miles from the ABQ airport