CICMT - April 18-20

IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023)

April 18-20, 2023
Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE,

Albuquerque, NM 87109 USA

Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!

Abstract Deadline:  October 14, 2022

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.  

           Planned Session and Paper Topics Include:          

1. Advanced materials for passive/active devices and their properties
• Microwave/mm-wave LTCC/ULTCC dielectric materials
• Ferroelectric/piezoelectric/pyroelectric/ferrite/multiferroic materials
• Sensitive ceramics/thermoelectric/electrocaloric materials
• Dielectric/ferroelectric/piezoelectric composites
• Pastes/inks/slurries for electronics

2. Material processing and device manufacturing technologies
• LTCC/HTCC and multilayer ceramic and glass processing
• Emerging ultralow temperature, room temperature processing, and cold sintering processing
• Additive manufacturing /3D printing/ direct writing
• Advanced thick film processing
• Add thin film
• Fine structuring technologies
• Emerging embedding/integration technologies

3. Design, modeling, simulation, characterization and reliability
• Metamaterials design, realization and characterization
• High frequency devices design/modeling/simulation
• Materials and devices characterization
• Material and device reliability, lifetime, and failure estimation
• Thermal management/thermal transfer simulation

4. Devices and systems for emerging applications
• Circuits, antennas, and filters for MHz, GHz and THz for communications
• Automotive/aerospace/medical electronics/optoelectronics
• Flexible/wearable electronics
• Sensors and actuators (Integrated physical/chemical/biological)
• Packaging and integration issues for MEMS and BioMEMS devices
• Batteries/fuel cells/ energy conversion systems
• Micro-reactors/micro-fluidic devices

Those wishing to present at the CICMT Conference must submit a ~250 word abstract electronically no later OCTOBER 14, 2022, using the online submission form at: A Final OPTIONAL Manuscript of 4-8pages, two-column format is due February 15, 2023, for all accepted abstracts. Please contact Brian Schieman by email at if you have questions. A Proceedings DOWNLOAD containing the conference papers will be distributed to all attendees during the Conference. Speakers are required to pay a reduced registration fee.

Abstracts Deadline: October 1, 2022

Notice of Acceptance: November 16, 2022