CICMT - April 18-20

IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023)

April 18-20, 2023
Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE,

Albuquerque, NM 87109 USA

Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!

Submit your Abstract on/before December 15, 2022

General Chair:
Ammar Kouki, ETS (École de technologie supérieure)

Past General Chair:
Ulrich Schmid, TU Wien

Organizing Committee:
Steve Dai, Sandia National Laboratories | Heli Jantunen, University of Oulu | Daniel Krueger, Honeywell |
Jens Müller, Technische Universität Ilmenau | Uwe Partsch, Fraunhofer IKTS | Peter Uhlig, IMST 

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.  

           Planned Session and Paper Topics Include:          

1. Advanced materials for passive/active devices and their properties
• Microwave/mm-wave LTCC/ULTCC dielectric materials
• Ferroelectric/piezoelectric/pyroelectric/ferrite/multiferroic materials
• Sensitive ceramics/thermoelectric/electrocaloric materials
• Dielectric/ferroelectric/piezoelectric composites
• Pastes/inks/slurries for electronics

2. Material processing and device manufacturing technologies
• LTCC/HTCC and multilayer ceramic and glass processing
• Emerging ultralow temperature, room temperature processing, and cold sintering processing
• Additive manufacturing /3D printing/ direct writing
• Advanced thick film processing
• Thin film
• Fine structuring technologies
• Emerging embedding/integration technologies

3. Design, modeling, simulation, characterization and reliability
• Metamaterials design, realization and characterization
• High frequency devices design/modeling/simulation
• Materials and devices characterization
• Material and device reliability, lifetime, and failure estimation
• Thermal management/thermal transfer simulation

4. Devices and systems for emerging applications
• Circuits, antennas, and filters for MHz, GHz and THz for communications
• Automotive/aerospace/medical electronics/optoelectronics
• Flexible/wearable electronics
• Sensors and actuators (Integrated physical/chemical/biological)
• Packaging and integration issues for MEMS and BioMEMS devices
• Batteries/fuel cells/ energy conversion systems
• Micro-reactors/micro-fluidic devices

Those wishing to present at the CICMT Conference must submit a ~250 word abstract electronically no later DECEMBER 15, 2022, using the online submission form at: A Final OPTIONAL Manuscript of 4-8pages, two-column format is due February 15, 2023, for all accepted abstracts. Please contact Brian Schieman by email at if you have questions. A Proceedings DOWNLOAD containing the conference papers will be distributed to all attendees during the Conference. Speakers are required to pay a reduced registration fee.

Abstracts Deadline Extended: December 15, 2022

Notice of Acceptance: December 23, 2022


There will be a joint tabletop exhibition featuring companies from the HiTEC, CICMT and Power Packaging Conferences and extensive networking opportunities with the attendees from each Conference. There will be 30 total tabletops available at this conference, and the space is expected to sell out quickly. For companies wishing for broader exposure and additional benefits, we have a variety of sponsorships available with a range of options and price points. These spots are also very limited for this event. View the exhibit/sponsor prospectus. When you are ready book reserve your space, you can use the online registration or contact if you need assistance or a custom package. 



Early registration discounts end March 24, 2023. Registration for the conferences includes access to technical sessions across all 3 conferences (HiTEC, CICMT, Power), so attendees can attend any sessions or speakers they wish at this event. The only additional fee is for add-on professional development courses which will be held Monday, April 17 before the full technical conferences begin Tuesday. All registrants also have access to visit the exhibit hall, participate in breakfasts, lunches and breaks and other networking activities, as noted in the program. 

Registration TypeEarly (thru Mar. 24)After Mar. 24
Tabletop Exhibit (includes 1 six-foot tabletop, with 1 booth personnel or full  badge; additional discounted full badges at $500/person or booth personnel at $150/person)$900 member
$1050 nonmember
$1000 member
$1150 nonmember
Premier Sponsorship (includes 2 six-foot tabletops, with 2 full badges and 2 exhibit badges, advertisements, flyer or giveaway distributed to attendees, additional discounted full badges at $500/person or booth personnel at $150/person)$6000$6000
HiTEC Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)$3000$3000
CICMT Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)$3000$3000
Power Packaging Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)$3000$3000
Coffee Break Sponsorship (includes logo recognition and signage, discounted full badges at $500/person)$1500$1500
Professional Development Courses (PDCs announced soon - each course is an additional fee, per course per person - this is in addition to the regular conference registration)$325$425


IMAPS has arranged for a discounted hotel block at the:

Albuquerque Marriott Pyramid North
5151 San Francisco Road NE
Albuquerque, New Mexico 87109

$179 USD/night + taxes and fees (single/double)

Marriott online reservation link

Hotel block closes APRIL 10 and will not be extended

Marriott Pyramid North

Just 10 miles from the ABQ airport

Albuquerque, New Mexico