Ulrich Schmid, TU Wien
Vice General Chair:
Markus Eberstein, TDK Sensors
Heli Jantunen, University of Oulu
Eung Soo Kim, Kyonggi University
Soshu Kirihara, Joining and Welding Research Institute Osaka University
Daniel Krueger, Honeywell
Zhifu Liu, Shanghai Institute of Ceramics of the Chinese Academy of Sciences
Jens Müller, Technische Universität Ilmenau
Uwe Partsch, Fraunhofer IKTS
Steve Dai, Sandia National Laboratories
Michael Schneider, TU Wien
VOLUMETRIC 3D PRINTING OF HIGH PERFORMANCE CERAMICS
Ceramic materials have numerous industrial applications thanks to their high chemical, mechanical, and thermal resistances. Precisely because of these reasons, producing parts with these materials is technically challenging with conventional subtractive manufacturing methods. Additive manufacturing is a promising alternative to fabricate ceramic parts with complex geometries. For example, pre-ceramic polymer resins are used in commercial light based Stereolithography printers (e.g https://www.lithoz.com/).
We developed a volumetric printing technique that solidifies all layers simultaneously instead of the traditional layer by layer deposition. This opens us new avenues to print complex geometries without support structures. In particular, we applied volumetric printing to the fabrication of ceramic parts. During the talk, we will review recent Volumetric additive Manufacturing (VAM) methods and in particular describe the working principle of VAM by tomographic backprojection. We will show examples of fabricated complex centimeter scale Silicon Oxycarbide ceramics with excellent performance in terms of heat and chemical resistance.
Andrés F. Lasagni, Technische Universität Dresden, Institute of Manufacturing Technology, Fraunhofer Institute for Material and Beam Technology IWS
STRUCTURED GLASS SUBSTRATES FOR PACKAGING OF ELECTRONIC COMPONENTS
The semiconductor industry is gradually approaching the end of Moore’s law. Which means that reducing the structure size on the silicon chip will stop to be the largest leverage to shrink the size of electronic components. Instead, heterogeneous packaging of active and passive components is becoming a major focus to maximize performance, optimize yield and shrink the size of electronic components. There are several material platforms for packaging like epoxy moulds, silicon wafers, advanced PCB materials or LTCC. But also, glass based packages are of interest for the industry and have a number of advantages. Glasses form a stiff substrate, which allows redistribution layers (RDL’s) with single micrometer accuracy. Glasses, adjusted with their thermal expansion, enable packages, which handle high thermal loads. Glasses can be structured with thousands of cut-outs for fan-out embedding of semiconductor components of passive components. Glasses are available at panel size, which can bring in a large cost advantages for larger packages. The dielectric properties of glasses allow building conductive connections with short delay times, low parasitic capacitances and good high frequency properties. Also, special glasses can be developed with minimized losses and with particular low dielectric constants for GHz applications like antenna in package concepts where even antenna arrays have to be integrated. In the current work we review the state of glass panel based packaging including industrial readiness over the whole process chain and show examples where glass has already shown its usefulness in packaging.
Martin Letz, SCHOTT AG
- Emerging Materials - Wednesday, July 13, 2022 - 2:15pm-4:45pm
- Applications - Wednesday, July 13, 2022 - 2:15pm-4:45pm
- Integrated Passive Devices - Thursday, July 14, 2022 - 10:30am-12:00pm
- Conductor Technology - Thursday, July 14, 2022 - 10:30am-12:00pm
- Advance Materials - Thursday, July 14, 2022 - 1:30pm-3:00pm
- Process Technology - Thursday, July 14, 2022 - 1:30pm-3:00pm
- Si-/LTCC-Compound Substrate Technology - Thursday, July 14, 2022 - 3:30pm-5:30pm
- RF & Microwave - Thursday, July 14, 2022 - 3:30pm-5:30pm
- Metallization Pastes - Friday, July 15, 2022 - 10:30am-1:00pm
- Additive Manufacturing - Friday, July 15, 2022 - 10:30am-1:00pm
CICMT 2022 is expected to return as an on-site event. As an exhibitor, you will have the unique opportunity to market your products and services to a captive audience of buyers, designers, and influential researchers.
Our opening hours are arranged to give exhibitors maximum exposure, and coffee breaks are planned in the exhibition space to encourages all delegates to meet and mingle formally and informally. Spaces are available on a first-come-first-served basis. We will try to accommodate all of your special needs and requests.
Details about options and fees will be available shortly.
The prices for the conference tickets are as follows. The early registration fees end on June 8, 2022.
|Member early||630,00 €|
|Member late||750,00 €|
|Non-Member early||730,00 €|
|Non-Member late||840,00 €|
|Exhibitors 6qm)||1.900,00 €|
Every Exhibition Space comes with a table, two chairs and if necessary a power supply and pin board.Hotels:
Novotel Suites Wien City Donau
Radingerstraße 2, 1020 Wien, Österreich (17 minutes with the subway U1)
50 suites for single use at the price of 152,50€ including breakfast have been reserved for conference guests. Please find the booking form here and use the code CICMT 2022 to reserve a room.
Ibis Budget Wien Messe
Lassallestraße 7, 1020 Wien, Österreich (19 miniutes with the subway U1)
50 rooms for single or double use at the price of 89,00€ – 97,50€ including breakfast have been reserved for conference guests. Please find the booking form here and use the code CICMT 2022 to reserve a room.
Post Hotel Wien
Fleischmarkt 24, 1010 Wien, Österreich (14 minutes with the subway U1)
14 rooms for single or double use at the price of 139,00€ – 149,00€ including breakfast have been reserved for conference guests.
Bassena Wien Prater
Messestraße 2, 1020 Wien, Österreich (27 minutes with the subway U2 and the Tram 1)
A self demand number of rooms for single use has been reserved the price of 150,00€ including breakfast have been reserved for conference guests. Please use the link here to reserve a room at this price.
Photos courtesy of WienTourismus