CICMT 2022

CICMT 2022

Technical Sponsors:

IMAPS Germany

IMAPS

                      

General Chair:
Ulrich Schmid, TU Wien


Vice General Chair:
Markus Eberstein, TDK Sensors

Technical Organizing Committee:
Heli Jantunen, University of Oulu
Eung Soo Kim, Kyonggi University  
Soshu Kirihara, Joining and Welding Research Institute Osaka University  
Daniel Krueger, Honeywell  
Zhifu Liu, Shanghai Institute of Ceramics of the Chinese Academy of Sciences
Jens Müller, Technische Universität Ilmenau 
Uwe Partsch, Fraunhofer IKTS
Steve Dai, Sandia National Laboratories
Michael Schneider, TU Wien

Venue:
Austrian Economic Chambers
Vienna, Austria


Contact:
Local Conference Committee
cicmt2022@mcc-events.de

                                          

                              

     Submit an Abstract      Planned Sessions       Exhibition       Registration    

                    

ABSTRACT SUBMISSION DEADLINE: MARCH 18, 2022


      


Call For Papers:

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost-effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities. 

Planned sessions and paper topics include:    
   
  • Functional materials for passive/active devices and their properties
    • Microwave/mm-wave LTCC/ULTCC dielectric materials

    • Ferroelectric/piezoelectric/pyroelectric/ferrite/multiferroic materials

    • Sensitive ceramics/thermoelectric/electrocaloric materials

    • Dielectric/ferroelectric/piezoelectric composites

    • Pastes/inks/slurries for electronics

  • Material processing and device manufacturing technologies
    • LTCC/HTCC and multilayer ceramic and glass processing
    • Emerging ultralow temperature, room temperature processing, and cold sintering processing
    • Additive manufacturing /3D printing/ direct writing
    • Advanced thick film processing
    • Fine structuring technologies
    • Emerging embedding/integration technologies.
  • Design, modeling, simulation, characterization and reliability
    • Metamaterials design, realization and characterization
    • High frequency devices design/modeling/simulation
    • Materials and devices characterization
    • Material and device reliability, lifetime, and failure estimation
    • Thermal management/thermal transfer simulation
  • Devices and systems for emerging applications 
    • Circuits, antennas, and filters for MHz, GHz and THz for communications
    • Automotive/aerospace/medical electronics/optoelectronics
    • Flexible/wearable electronics
    • Integrated physical/chemical/biological sensors and actuators
    • Packaging and integration issues for MEMS and BioMEMS devices
    • Batteries/fuel cells/ energy conversion systems
    • Micro-reactors/micro-fluidic devices

   

Please submit your 500+ word abstract electronically by March 18, 2022 using the online system. 


Full papers are due by May 15, 2022 and should be uploaded separately after it has been determined whether the abstract has been accepted. All papers will be presented and published in English. If you have problems with the online system, please email the conference office: cicmt2022@mcc-events.de.

   

    

Exhibition:    
   

CICMT 2022 is expected to return as an on-site event. As an exhibitor, you will have the unique opportunity to market your products and services to a captive audience of buyers, designers, and influential researchers.

Our opening hours are arranged to give exhibitors maximum exposure, and coffee breaks are planned in the exhibition space to encourages all delegates to meet and mingle formally and informally. Spaces are available on a first-come-first-served basis. We will try to accommodate all of your special needs and requests.

Details about options and fees will be available shortly.