GBC OPENING COMMENTS
GBC Chairs:  Rich Rice, ASE Group; Chris Riso, Booz Allen Hamilton Inc.

KEYNOTE PRESENTATION:

DoD‘S STATE OF THE ART (SOTA) HETEROGENEOUS INTEGRATED
PACKAGING (SHIP) PROGRAM
The DoD‘s State Of The Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program is designed to increase the level of access to SOTA microelectronics for DoD and the Defense Industrial Base.  The SHIP program is focused on developing a sustainable business and operational model to provide access to domestic sources of SOTA digital and radio frequency packaging. Sustained access to SOTA packaging will foster significant system performance increases, which will enable military system modernization and support next generation capabilities.

Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics
Dr. Crum began his career with the Department of the Navy (DoN) at Naval Surface Warfare Center, Crane Division.  Early in his career he managed three microelectronics focused engineering branches, including the Component Engineering Branch, the Obsolescence Management Branch, and the Electronics Design Branch. 

In 2006, Dr. Crum became the Naval Sea Systems (NAVSEA) Command Anti-Tamper Technical Warrant Holder, and then in 2009 he became the DoN Anti-Tamper Technology Coordinator.  In this role, he focused on identifying technical gaps and leading the development of new technologies to protect microelectronics.

In 2021, Dr. Crum became the Microelectronics Advanced Packaging & Test Lead and the Technical Lead of the SOTA Heterogeneous Integrated Packaging (SHIP) program for OUSD(R&E) – Modernization Microelectronics.  In this role, he is responsible for executing technology development efforts to support the DoD Microelectronics Roadmap.

Dr. Crum has a BSEE (1990) from the University of Kentucky, a MA (2000) in Public Administration from Indiana University, and a doctorate (2006) in Organization & Management from Capella University.

SHIP DIGITAL

John Sotir, Intel Corp. Programmable Solutions Group - Director of the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Organization
John started his career as an analog research engineer in the R&D division of Dynamics Research Corporation where he holds patents on sensor technology and products.

He joined Lucent Microelectronics (later a spin-out called Agere), where John led several product line management roles within the communication and networking space and holds a patent on networking architecture. He joined multiple incubator divisions with a focus on building operational and business models from corporate R&D‘s break through advancements including those related to LDMOS Power Amplifiers and high-speed and QoS scheduling and switching technologies. 

John joined Altera Corporation in 2006, later acquired by Intel Corporation, where he served multiple leadership roles in the Communications, Medical/Test & Measurement business units and business management organizations. John is deeply involved in both Leadership and Diversity and Inclusion task forces withing Intel helping to unleash the potential of both individuals and teams.

SHIP RF

Ted Jones, Qorvo Inc. - Sr. Product Line Director for High Performance Solutions Services within Infrastructure and Defense Products (IDP)
Ted Jones is Sr. Product Line Director for High Performance Solutions Services within Infrastructure and Defense Products (IDP) at Qorvo.  The Services product line includes Foundry, Advanced Packaging, Silicon Services, and Spatium® (wide band solid state power amplifiers) .  He has experience in both the defense and commercial industries covering RF Systems and Program/Business management.  His product experience includes Sensors, Subsystems, Advanced Packaging, and Manufacturing.   Ted has BSEE degree from University of Colorado and an MSEE degree University of Texas Arlington.

STATE OF THE ART HETEROGENEOUS INTEGRATED COMPUTING ENABLING WARFARE MODERNIZATION CAPABILITIES

Tom Smelker, Mercury Systems – VP& GM, Microsystems
Mr. Smelker is the Vice President and General Manager of Mercury‘s Microsystems business. In this business, he is responsible for the programmatic and technical execution of the latest 2/2.5 and 3D microelectronics for rugged defense applications. These capabilities are aimed at accelerating mission critical applications at the tactical edge. Tom Smelker leads a highly innovative Mercury Systems team focused on delivering high-performance processing and memory solutions at the sensor edge for major defense and intelligence programs across air, ground, sea, and space platforms. Mr. Smelker has over 25 years of experience leading and designing high assurance microelectronics for defense sensors and weapons applications. In his previous role, he was a Senior Fellow at a defense prime and was the Chief Architect and Chief Technologist for secure processing.

DOMESTIC ADVANCED PACKAGING FOR HI-REL MICROELECTRONICS – THE FUTURE IS NOW

Dr. John Lannon, Micross Advanced Interconnect Technology - General Manager

Dr. John Lannon (’91 BS WVU/’96 PhD WVU in Physics) is the General Manager of Micross Advanced Interconnect Technology.  Over the course of his career, he has been involved in process improvements related to fabrication of MEMS-like devices and assisted with the development of high density interconnects (sub-20 m pitch) for die stacking and detector hybridization.  More recently, he contributed to the development of wafer-level vacuum packaging (WLVP) solutions for MEMS devices.  As part of Micross, he continues to be focused on the development and implementation of 3D integration and advanced packaging solutions for government and commercial applications.  John is an active member of AVS and member of the WLPS technical committee.

KEYS TO SUCCESSFUL AND STABLE ON-SHORE PACKAGING AND ADVANCED PACKAGING DEFENSE INDUSTRIAL BASE

Jim Will, SkyWater Technology - A&D BU Director

Jim Will is the A&D BU Director at SkyWater Technology Foundry.  He leads the iMAPS US Government and Defense Committee, and is also co-lead of the NDIA, Electronics Division, DIB & Policy Subcommittee. Jim has engaged USG and Defense Electronics Programs in both USG Contractor and Commercial roles. As DOE NNSA contractor at the Kansas City National Security Campus (KCNSC), Jim supported semiconductor products industrial base development, Trusted Foundry, product realization, and enterprise assurance interests.  Jim‘s career spans thirty years in the semiconductor industry with Motorola and Infineon in roles from Engineer to Engineering Management. Jim‘s education includes BSEE with Microelectronic Engineering focus and MS Material Science and Engineering degrees from Rochester Institute of Technology.