Device Packaging Conference

Submit Abstract / PDC Hotel Speaker Planning Exhibitor & Sponsors

Conference Chairs

General Chair:
Nokibul Islam, JCET Group

General Chair-Elect:
Scott Hayes, NXP Semiconductors

Past General Chairs:
Prasad Dhond, Amkor Technology
Eric Huenger, DuPont Electronic & Imaging

The 19th Annual Device Packaging Conference (DPC 2023) will be held at the WeKoPa Resort and Conference Center, from March 13-16, 2023. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Submit Abstracts & PDCs Proposals Here

We look forwarding to seeing you all in Arizona for Device Packaging 2023! Full details available soon.

Be sure to review the DPC 2022 FINAL PROGRAM and listen to the 3D InCites podcast:
A Conversation about What's Happening at the IMAPS Device Packaging Conference

IMAPS Device Packaging Conference 2022 took place March 8-10, here in our home state of Arizona, and we at 3D InCites were very excited and busy at DPC 2022! So we thought it would be great to kick things off and generate some excitement by inviting Beth Keser, IMAPS new President, and Jim Haley, VP of Marketing, to talk about what to expect at the 2022 conference. Listen to all the "from the conference" podcasts here as well.

KEYNOTE SPEAKERS

details soon

Featuring 3 Technical Tracks and an Interactive Poster Session

Call for abstracts now open - submit your abstract today!

New abstract submission software this year. Contact bschieman@imaps.org with any questions.

Heterogeneous
2D & 3D Integration

Fan-Out, Wafer Level Packaging & Flip Chip

Next Gen Applications
(Automotive, 5G/6G, Photonics, HiSpeed RF)

Interactive
Poster Session

New abstract submission software this year. Contact bschieman@imaps.org with any questions.

Abstract Deadline: September 15, 2022
Abstract Acceptance: November 1, 2022
Extended Abstract Deadline: February 1, 2023
- Extended Abstracts are short papers - 2/3 pages minimum, images/charts/tables/references should be included. no copyright exchange and no peer review - will not be published/archived, just shared with conference attendees.
- Authors can submit their papers to be published via IMAPS Journal for full peer review and archival publication.
Speaker Conference Registration Deadline: February 1, 2023
- Speakers not registered to attend the conference on/before February 1 could risk being removed from the program agenda.
Bio Due: March 1, 2023
- 2-3 sentences explaining current position, employment history and education/background.
Speaker Presentation Finalized: March 12, 2023
- Powerpoint is the preferred format for speaker presentations.
- Poster presenters do not need to prepare a slide presentation, but should plan on printed posters (one large poster in horizontal format, no larger than 4ft high by 8ft wide) or printed slides tacked up sequentially.
- There is no required powerpoint conference template. All speakers may use their own organizational templates.
- Regular session speakers should plan on 25 minute presentations (plus 5 minutes of questions). Keynote speakers should prepare slides to allow 40 minutes of presenation (plus 5 minutes for questions).

SPONSORS AND EXHIBITORS

Exhibit sales opening this summer. details soon.

Exhibits are sold out each year!

REGISTRATION

Early registration discounts end February 1, 2023.

Registration fees and online registration available soon.

Cancellations are due in writing to IMAPSHQ@gmail.com. Full refunds from cancellations will be made if cancellation request is received by email on/before February 15, 2023. Cancellations made after February 15, 2023, will be handled as IMAPS credit, not subject to a processing fee, toward a future IMAPS event. Neither refunds nor credits will be issued for cancellations after March 1, 2023.

POST-CONFERENCE FUNDRAISING EVENTS

2023 David Virissimo Spring Charity Golf Outing
benefiting the Microelectronics Foundation

Details soon

3D InCites Hike For DEI

If you’re not participating in the golf tournament, why not join us for a guided, afternoon hike in the nearby McDowell Sonoran Preserve? All proceeds benefit the 3D InCites DEI Fund, established to help tech start-ups owned by women and under-represented minorities grow and thrive.

Details soon.