Device Packaging Conference

Technical Presentations Profess. Dev. Courses (PDCs) Speaker Planning Corporate Partner Planning Registration Details

Click here to view highlights from DPC 2020.

Conference and Live
Presentations & Panels
April 13-15, 2021

Professional Development Courses
April 12-15, 2021

GBC Plenary Session
April 14, 2021

Conference Chairs

General Chair:
Eric Huenger, DuPont Electronic and Imaging

General Chair-Elect:
Prasad Dhond, Amkor Technology

Past General Chairs:
Rama Puligadda, Brewer Science
Jon Aday, Amkor Technology

The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

GET REGISTERED TODAY!

What to Expect

Program details are now available through this website and will continued to be updated in the days ahead. Stay tuned for the release of the official "final program" in the coming weeks! At the 2021 DPC Virtual Conference, attendees can expect...

A hit LIVE keynote speaker lineup:
- Seung Wook Yoon, Samsung Electronics - Corporate VP / Package Technology Planning, Test & System Package
- Ram Viswanath, Intel Corporation - VP of Package Architecture
- Thorsten Meyer, Infineon
- TBD , John Deere Co.
More than 65 on-demand session speakers across 3 technical tracks and 16 sessions
A full slate of 12 LIVE professional development courses from the industry's best instructors
An interactive poster session
A LIVE Global Business Council plenary session featuring speakers from across the industry on: Friends in HI Places Enabling the Transition to Heterogeneous Integration
A LIVE technical panel session moderated by Jan Vardaman, TechSearch International, on: ELECTRONICS INDUSTRY SUPPLY CHAIN: IS IT BROKEN?
A LIVE iNEMI Invited Session on: 5G Electronics Challenges: High Frequency Materials Characterization
An ALL NEW LIVE Industry-Sponsored Panel Discussion on: 5G MATERIALS CHARACTERIZATION/TEST CHALLENGES -- Sponsor Seats Still Available!
And more to come!

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Corporate Partnership Opportunities

The new and improved DPC 2021 Corporate Partnership Guide is now available! Early commitments are already flooding in. Download the guide to review the partnership opportunities and secure your involvement now. Click here to learn more...

Technical Program

In addition to the daily LIVE technical presentations from our Keynotes, PDCs, Panel Discussion, Invited Sessions, and more, attendees will have access to more than 65 technical presentations which will be delivered on-demand for attendees beginning the week of April 12th (and available for 30 days). Presentations will be delivered across the following topical tracks: 3D Integrations, FO-WLP & Flip Chip and Advanced Packaging. Plus a Poster Session!