Device Packaging Conference

Agenda Hotel Speaker Planning Exhibitor & Sponsors

Conference Chairs

General Chair:
Nokibul Islam, JCET Group

General Chair-Elect:
Scott Hayes, NXP Semiconductors

Past General Chairs:
Prasad Dhond, Amkor Technology
Eric Huenger, DuPont Electronic & Imaging

The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events.

Full Conference registrations include: (excludes exhibit only, pdc only, or visitor pass registration types)

3-track program with 80+ speakers
Poster presentations
4 keynote speakers from Qualcomm, Samsung, General Motors, and Lightmatter
Panels covering both business and social value topics
GBC Business plenary session: Building the Ecosystem: Transitioning from Research to Manufacturing
Sold-out exhibit hall with 66 booths
Networking opportunities: welcome reception, exhibit hall reception, poster session happy hour, and group lunches
Post-conference golf scramble and guided hike fund raisers

First day add-ons: 12 Professional Development Courses, a great learning opportunity for those new to the industry or looking to enhance their skills and knowledge.

In 2022, DPC was held in person with more than 500 participants, despite continued pandemic restrictions at that time. Given the strength of the technical program and exhibition this year, it is anticipated that the 2023 DPC will welcome a record number of participants!

Get registered and book your hotel before January 16!

KEYNOTE SPEAKERS

Challenges for the Next Generation of Package Technology and Integration
Ahmer Syed, Qualcomm Technologies, Inc.

Advanced Package Solutions in Ai/ML and Data Era
Seungwook "Stewart" Yoon, Samsung Electronics

Silicon Photonics
Nick Harris, Lightmatter

Driving Adoption of Advanced IC Packaging in Automotive Applications
Bassam Ziadeh, General Motors

PROFESSIONAL DEVELOPMENT COURSES

Attendees must register for each course as an add-on to their overall symposium registration at $325 each for early registration or $425 after February 1. Attendees may select up to one course in each time slot.

Make sure to review your preferred course's date and time slot before registration. Course fees are non-refundable.

Monday, March 13, 2023

Course Fees and Inclusions

Course Fees: $325 per course on or before February 1/$425 per course after February 1.

Fees include access to the 2-hour course led by reputable industry leaders.
These fees are non-refundable but may be transferred to another registrant prior to the start of the course. No transfers will be accepted once the course has begun.

Click here for complete descriptions of PDCs.

Featuring 3 Technical Tracks and an Interactive Poster Session

Click here for the full program and listing of presentations.

Heterogeneous
2D & 3D Integration

Track Chairs:

Lars Boettcher, Fraunhofer IZM
Mike Kelly, Amkor Technology
Marco Del Sarto, STMicroelectronics

Fan-Out, Wafer Level Packaging & Flip Chip

Track Chairs:

Craig Bishop, Deca
Amy Lujan, SavanSys
Curtis Zwenger, Amkor Technology

Next Gen Applications
(Automotive, 5G/6G...)

Track Chairs:

Vik Chaudhry, Amkor Technology
Jason Rouse, Taiyo America
Tu-Anh Tran, NXP

Interactive
Poster Session

Track Chairs:

Pui Leng Low, onsemi
Hongbin Yu, Arizona State Univ.

SPONSORS AND EXHIBITORS

**EXHIBITS ARE NOW SOLD OUT**

Exhibit sales open to renewing 2022 Exhibitors/Sponsors - October 12
Exhibit sales open to new companies (or those missing earlier phases) - November 1

Click here for the DPC 2023 Exhibitor/Sponsor Prospectus.

DPC 2023 Floorplan

Exhibits have sold out for the past 17 years!

REGISTRATION

Early registration discounts end February 1, 2023.

Registration Type	Early (on or before FEB 1)	after FEB 1
Member	$825	$925
Nonmember	$1095	$1195
Speaker/Chair	$595	$695
Student	$250	$400
PDC Courses (separate fee)	$325	$425

Cancellations are due in writing to IMAPSHQ@gmail.com. Full refunds from cancellations will be made if cancellation request is received by email on/before February 15, 2023. Cancellations made after February 15, 2023, will be handled as IMAPS credit, not subject to a processing fee, toward a future IMAPS event. Neither refunds nor credits will be issued for cancellations after March 1, 2023.

Register Today

POST-CONFERENCE FUNDRAISING EVENTS

2023 David Virissimo Spring Charity Golf Outing
benefiting the Microelectronics Foundation

Thursday, March 16, 2023

4-Person Scramble | 1:00 PM Shotgun Start
Check-in: 12:00-1:00 PM

Shuttle from hotel starting at 11:30 AM to arrive for 1:00 PM Shotgun Start

SunRidge Canyon Golf Club

Rental Clubs are paid directly to the Clubhouse – Call 480-837-5100

Cost: $235 per golfer or $950 for foursome

The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, and awards reception/dinner following your round. All proceeds from this event will benefit the IMAPS Microelectronics Foundation.

Click here for complete information.

3D InCites Hike For DEI

If you’re not participating in the golf tournament, why not join us for a guided, afternoon hike in the nearby McDowell Sonoran Preserve? All proceeds benefit the 3D InCites DEI Fund, established to help tech start-ups owned by women and under-represented minorities grow and thrive.

When: Thursday, March 16 from 12:30pm-4pm

Cost: $75 (includes transportation from We ko Pa Resort)

All proceeds benefit the 3D InCites DEI Fund

STUDENT COMPETITION

IMAPS DPC Student Design Challenge

Call for Submissions

REGISTER FOR CHALLENGE

Calling on student teams to expand the possibilities of package design using additive manufacturing. As part of this design challenge you will be asked to design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba. The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below. All packaging components, except the devices, should be additively manufactured.

After an initial registration period, you will be sent detailed scoring criteria and manufacturing constraints. You will need first to prepare a white paper that justifies your design, materials selection, and qualification test plan. This can be done with preliminary multi-physics modeling. The top three papers will be selected for protoype manufacture and testing. These top teams will be supported such that one member can travel to the IMAPS Symposium in Boston in October, where they will defend their design using the actual prototype and a video presentation in front of industry leaders. From those oral presentations, the champion will be crowned! Good luck!

Metrics:

- The packaged circuit not the full product must be less than 15 cm³ and less than 0.5 kg in weight.
- No breadboarding of circuit – must be actual functioning package
- Must withstand short exposure (24 hrs) to high temperature (150C), and to humidity (60C, 85%RH)
- Must withstand a drop of 1 m
- Must avoid obstacles on a track

Judging Criteria:

Size and Weight of Packaged Circuit
Successful Completion of the Metrics
Time needed to successfully complete the course

Timeline:

Call for Papers and Registration: December 16, 2022
Design Phase and White Paper: January 13, 2023
White Paper Judging: January 16-27, 2023
Prototyping, Testing, and Presentation Preparation: January 30 – March 10, 2023
DPC: March 13-16, 2023

Call for Sponsors

IMAPS is starting a student packaging competition to expand the possibilities of package design using additive manufacturing. In this design challenge, teams will design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba. The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below. All packaging components, except the devices, should be additively manufactured.

In order to make this competition a reality, we are looking for sponsors for the following items:

Donation of the Arduino’s and components for three teams - $1500
Donation of the Autonomous Vehicle for three teams - $ 2000
Donation of 3D Printing Services to make the packages
Co-Sponsorship of the Awards - $2000

We look forward to your participation in this exciting new event. Contact Brian Schieman (bschieman@imaps.org) to sponsor.

Hotel & Booking Information

We-Ko-Pa Resort & Conference Center
10438 WeKoPa Way | Fort McDowell, Arizona 85264

Hotel deadline: February 1, 2023

Single/Double: $199/night + taxes and fees

ONLINE RESERVATIONS

Phone Reservations: 480-789-5300
You must mention IMAPS or Device Packaging

HOTEL IS FULL. Keep checking daily to see if more rooms become available. We recommend calling the reservation desk directly: 1-480-789-4957.

There is a Comfort Inn Fountain Hills nearby - 17105 E Shea Blvd., Fountain Hills, AZ 85268 - 480-837-5343 that may have availability. Also, there is Fountain Park Hotel - 12800 N Saguaro Blvd., Fountain Hills, AZ 85268 - 480-837-6565 that may have availability.

Reservations must be made before the cutoff date.
Cancellations within 72-hours will be charged.