Device Packaging Conference

  Agenda       Technical Presentations     Profess. Dev. Courses (PDCs) 

 Speaker Planning      Corporate Partner Planning      Registration Details

Conference Chairs

General Chair:
Eric Huenger, DuPont Electronic and Imaging

General Chair-Elect:
Prasad Dhond, Amkor Technology

Past General Chairs:
Rama Puligadda, Brewer Science
Jon Aday, Amkor Technology

Flip through the Device Packaging 2021 Final Program

The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

PROGRAM AT A GLANCE

A Hit LIVE Keynote Speaker Lineup

Live Technical Panel Discussion

Tuesday, April 13, 2021 | 3:00PM - 4:30PM EST

ELECTRONICS INDUSTRY SUPPLY CHAIN:  IS IT BROKEN?
Chair and Moderator: E. Jan Vardaman, TechSearch International, Inc. 

Panelists:

Ivor Barber, AMD - Corporate VP Packaging

Veer Dhandapani, NXP Semiconductors - Sr. Director Automotive Package Innovation

Devan Iyer, Technology Management - Educator and Executive Advisor

Rebeca Jimenez, Amkor Technology - Corporate Vice President, Advanced SiP Business Unit

Paul Mescher, Microsoft - Senior Director IC Packaging Technology

Demand for electronic products and services remain strong.  Work-from-home, video conferencing, and remote learning are driving datacenter growth and laptop and tablet demand.  5G infrastructure rollout is underway and smartphone sales are returning to normal levels.  Automotive sales are increasing.  At the same time the industry is experiencing acute shortages of 200mm fab capacity, components, equipment such as wire bonders, substrates, and leadframes. Is the supply chain broken and what can we do to resolve these issues?

Meet the Experts – Virtual Happy Hour 

A MacDermid Alpha hosted event!

Tuesday, April 13, 2021 | 5:00PM - 6:30PM EST

Grab your favorite beverage and virtually meet our industry experts and discuss any questions you may have regarding your semiconductor processes. A brief presentation highlighting our latest offerings from our Alpha, Kester, Compugraphics and MacDermid Enthone brand, will be presented, followed by a Q&A session. Click here for complete information.

Interested parties please contact Deanna Cullen – Deanna.Cullen@MacDermidAlpha.com

Virtual Global Business Council (GBC) Live Plenary Session
Wednesday, April 14, 2021 | 11AM - 2PM EST

Friends in HI Places...
Enabling the Transition to Heterogeneous Integration

Live iNEMI Invited Session
Wednesday, April 14, 2021 | 3PM - 5:45PM EST

5G Electronics Challenges: High Frequency Materials Characterization 

Next-generation 5G communications solutions require ultra-low loss laminate materials and PCBs/substrates for efficient design and manufacturing. However, these materials pose challenges. For example, there is no consistent methodology for measuring transmission loss or Df/Dk, especially for higher frequencies (e.g., >30 GHz). Many different approaches are currently used, requiring different fixtures and test methods, sample preparation, and/or data analysis/extraction. In response, iNEMI members organized the 5G/mmWave Materials Assessment and Characterization project to develop guidelines and best practices for a standardized measurement and test methodology that can be shared with industry and relevant standards organizations.

This session will provide 5 presentations:

Urmi Ray, iNEMI | Challenges for High Dk/Df Measurements

Richard Stephenson, EMD Electronics | Benchmarking Resonator based Low Dk/Df Material Measurements

Magorzata Celuch & Marzena Olszewska-Placha , QWED | Recent Developments of Resonator Measurements for Emerging Materials and Technologies

Nathan Orloff, NIST | High Frequency Measurements Using Wafer Level Techniques

Say Phommakesone, Keysight | Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements

Live Industry-Sponsored Panel
Thursday, April 15, 2021 | 1PM - 3PM EST

5G MATERIALS Roadmap : Industry Voices
Moderator: Urmi Ray, iNEMI, Experienced Semiconductor Consultant

A partner representative will participate in a moderated interactive panel connecting attendees with supply chain solutions and highlights of key technologies their organization can solve. 

Industry Panelists: 

Brewer Science | Dongshun Bai
"Innovation in materials for overcoming technology challenges for heterogenous integration of 5G devices"

MacDermid Alpha | Jim Watkowski
"Copper Adhesion Promotion for 5G" 

EMD Electronics | Richard Stephenson
"Connection Digital Living" 

Live Technology Track Round Rooms | Tech Brainstorm / Q&A
Thursday, April 15, 2021 | 3:15PM - 6:45PM EST

More than 65 on-demand session speakers across 3 technical tracks and 16 sessions 

Recorded technical presentations will be available for on-demand viewing through the Virtual Conference Portal starting April 12

In cased you missed anything ... the Portal will remain open for up to 30 days! 

 3D Integration 

 Fo-WLP/ Flip Chip 

 Automotive / 5G 
 Advanced Packaging 

  Interactive 
 Poster Session 

A hit LIVE keynote speaker lineup:

• Seung Wook Yoon, Samsung Electronics
• Ram Viswanath, Intel Corporation
• Thorsten Meyer, Infineon Technologies

•  Dr. Brij Singh, Mark Chaney and Dr. Scott Johnson, John Deere Co. 

Panel Discussions & Invited Sessions

• A LIVE Global Business Council plenary session featuring speakers from across the industry on: Friends in HI Places Enabling the Transition to Heterogeneous Integration
• A LIVE technical panel session moderated by Jan Vardaman, TechSearch International, on: ELECTRONICS INDUSTRY SUPPLY CHAIN:  IS IT BROKEN? 
• A LIVE iNEMI Invited Session on: 5G Electronics Challenges: High Frequency Materials Characterization
• An ALL NEW LIVE Industry-Sponsored Panel Discussion on: 5G MATERIALS CHARACTERIZATION/TEST CHALLENGES -- Sponsor Seats Still Available!
  
  

 A full slate of 7 LIVE professional development courses from the industry's best instructors

Supplemental two-hour classroom-style tutorials with a narrow educational focus

Professional Development Courses

DPC 2021 will offer supplementary classroom-style education in the form of two-hour short courses taught by industry leaders virtually. 

View courses and descriptions

Corporate Partnership Opportunities

The new and improved DPC 2021 Corporate Partnership Guide is now available! Early commitments are already flooding in. Download the guide to review the partnership opportunities and secure your involvement now. Click here to learn more...

NEW! Would you like to visit the Corporate Partners without registering for the entire conference?
Now you can register for a complimentary Partner Profile Only Badge!
This $0 badge will give you access to the Partner Profiles and  ability to communicate with them via the chat. 
This does not include access to the presentations or any technical content. 

Click here to view highlights from DPC 2020.

Corporate Partners

Platinum Hosting Partner

Gold Hosting Partners

Silver Hosting Partner

Presenting Partners

            Supporting Partners                    

Participating Partners

Media Partners