Device Packaging Conference

Interconnects for Tomorrow’s Applications



Conference Chairs


General Chair:
Prasad Dhond, Amkor Technology

General Chair-Elect:
Nokibul Islam, JCET Group

Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science

The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

We are planning a safe and successful event to welcome you back in-person to IMAPS 2022 Device Packaging Conference, March 7-10 in Fountain Hills, AZ! For complete COVID Safety Protocols information, please click here.

Device Packaging Final Program
We look forwarding to seeing you all in Arizona for Device Packaging 2022!

Be sure to review the FINAL PROGRAM to prepare for the conference. 

Listen to the new 3D InCites podcast: 
A Conversation about What's Happening at the IMAPS Device Packaging Conference
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! It’s been two years since the event took place in person. In fact, it was the last event I attended before the world shut down – literally two weeks later. Even then, the buzz was about COVID 19, elbow bumping and hand sanitizing. Masks weren’t even a thing yet. It was also the last time we held the 3D InCites Awards Ceremony in person. Last year, we went virtual. So we thought it would be great to kick things off and generate some excitement by inviting Beth Keser, IMAPS new President, and Jim Haley, VP of Marketing, to talk about what’s in store for attendees. We talk about the programming, the exhibits, networking opportunities, the collaboration between 3D InCites and IMAPS to bring you future podcast episodes and more. 



Hybrid Bonding for the Next Generation of High Performance Devices

Laura Mirkarimi
VP of Engineering, 3D Portfolio and Bonding Technology
Xperi Corp.

Future of Packaging

Rao Tummala
Emeritus Professor
Georgia Tech

Advanced Packaging: Enabling
Moore's Law's Next Frontier
through Heterogeneous

Integration

Raja Swaminathan
Senior Fellow
AMD

Intelligent Power and Sensing Solutions for a Sustainable Future 

Jerome Teysseyre
VP – Head of onsemi package development and engineering
onsemi

TUESDAY EVENING PANEL SESSION

PANEL DISCUSSION:
So Many High Performance Packages:  Is There a Winner?

Moderator:

Jan Vardaman
E. Jan Vardaman, President and Founder
TechSearch International, Inc.


Panelists:

Calvin Cheung, ASE Group
Mike Kelly, Amkor Technology
Suresh Ramalingam, Xilinx
Islam (Sam) Salama, Hyperion Technologies
Raja Swaminathan, AMD


New packaging solutions are being adopted to achieve the economic advantages that were previously met with silicon scaling.  Heterogeneous integration, especially chiplets, is pivotal in this new era.  The difficulty is making a package choice from the sea of options.  This panel examines the drivers for different options with proponents of different packages, including Silicon Interposer, Fan-out on Substrate, and Embedded Bridge. Advantages of sided-by-side and 3D configurations will be debated. 

GBC PLENARY SESSION - ON-SHORING FOR DoD

Welcome to the Global Business Council (GBC) Keynote & Plenary Session on

US DOMESTIC CAPABILITIES FOR ON-SHORING
OF IC PACKAGING AND ASSEMBLY FOR DoD ACCESS

View the Full Wednesday GBC Program

GBC Plenary Session Sponsored by:

   
8:00am-8:15am

8:15am-9:00am

GBC OPENING COMMENTS
GBC Chairs:  Rich Rice, ASE Group; Chris Riso, Booz Allen Hamilton Inc.

KEYNOTE PRESENTATION:

DoD‘S STATE OF THE ART (SOTA) HETEROGENEOUS INTEGRATED
PACKAGING (SHIP) PROGRAM

The DoD‘s State Of The Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program is designed to increase the level of access to SOTA microelectronics for DoD and the Defense Industrial Base.  The SHIP program is focused on developing a sustainable business and operational model to provide access to domestic sources of SOTA digital and radio frequency packaging. Sustained access to SOTA packaging will foster significant system performance increases, which will enable military system modernization and support next generation capabilities.

Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics
Dr. Crum began his career with the Department of the Navy (DoN) at Naval Surface Warfare Center, Crane Division.  Early in his career he managed three microelectronics focused engineering branches, including the Component Engineering Branch, the Obsolescence Management Branch, and the Electronics Design Branch. 

In 2006, Dr. Crum became the Naval Sea Systems (NAVSEA) Command Anti-Tamper Technical Warrant Holder, and then in 2009 he became the DoN Anti-Tamper Technology Coordinator.  In this role, he focused on identifying technical gaps and leading the development of new technologies to protect microelectronics.

In 2021, Dr. Crum became the Microelectronics Advanced Packaging & Test Lead and the Technical Lead of the SOTA Heterogeneous Integrated Packaging (SHIP) program for OUSD(R&E) – Modernization Microelectronics.  In this role, he is responsible for executing technology development efforts to support the DoD Microelectronics Roadmap.

Dr. Crum has a BSEE (1990) from the University of Kentucky, a MA (2000) in Public Administration from Indiana University, and a doctorate (2006) in Organization & Management from Capella University.

9:00am-9:30am

SHIP DIGITAL

John Sotir, Intel Corp. Programmable Solutions Group - Director of the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Organization
John started his career as an analog research engineer in the R&D division of Dynamics Research Corporation where he holds patents on sensor technology and products.

He joined Lucent Microelectronics (later a spin-out called Agere), where John led several product line management roles within the communication and networking space and holds a patent on networking architecture. He joined multiple incubator divisions with a focus on building operational and business models from corporate R&D‘s break through advancements including those related to LDMOS Power Amplifiers and high-speed and QoS scheduling and switching technologies. 

John joined Altera Corporation in 2006, later acquired by Intel Corporation, where he served multiple leadership roles in the Communications, Medical/Test & Measurement business units and business management organizations. John is deeply involved in both Leadership and Diversity and Inclusion task forces withing Intel helping to unleash the potential of both individuals and teams.

9:30am-10:00am

SHIP RF

Ted Jones, Qorvo Inc. - Sr. Product Line Director for High Performance Solutions Services within Infrastructure and Defense Products (IDP)
Ted Jones is Sr. Product Line Director for High Performance Solutions Services within Infrastructure and Defense Products (IDP) at Qorvo.  The Services product line includes Foundry, Advanced Packaging, Silicon Services, and Spatium® (wide band solid state power amplifiers) .  He has experience in both the defense and commercial industries covering RF Systems and Program/Business management.  His product experience includes Sensors, Subsystems, Advanced Packaging, and Manufacturing.   Ted has BSEE degree from University of Colorado and an MSEE degree University of Texas Arlington.

10:00am-10:20am
SHIP PANEL
Question & Answer Session with the SHIP Program Speakers  
11:00am-11:30am

STATE OF THE ART HETEROGENEOUS INTEGRATED COMPUTING ENABLING WARFARE MODERNIZATION CAPABILITIES

Tom Smelker, Mercury Systems – VP& GM, Microsystems
Mr. Smelker is the Vice President and General Manager of Mercury‘s Microsystems business. In this business, he is responsible for the programmatic and technical execution of the latest 2/2.5 and 3D microelectronics for rugged defense applications. These capabilities are aimed at accelerating mission critical applications at the tactical edge. Tom Smelker leads a highly innovative Mercury Systems team focused on delivering high-performance processing and memory solutions at the sensor edge for major defense and intelligence programs across air, ground, sea, and space platforms. Mr. Smelker has over 25 years of experience leading and designing high assurance microelectronics for defense sensors and weapons applications. In his previous role, he was a Senior Fellow at a defense prime and was the Chief Architect and Chief Technologist for secure processing.

11:30am-12:00pm

DOMESTIC ADVANCED PACKAGING FOR HI-REL MICROELECTRONICS – THE FUTURE IS NOW

Dr. John Lannon, Micross Advanced Interconnect Technology - General Manager

Dr. John Lannon (’91 BS WVU/’96 PhD WVU in Physics) is the General Manager of Micross Advanced Interconnect Technology.  Over the course of his career, he has been involved in process improvements related to fabrication of MEMS-like devices and assisted with the development of high density interconnects (sub-20 m pitch) for die stacking and detector hybridization.  More recently, he contributed to the development of wafer-level vacuum packaging (WLVP) solutions for MEMS devices.  As part of Micross, he continues to be focused on the development and implementation of 3D integration and advanced packaging solutions for government and commercial applications.  John is an active member of AVS and member of the WLPS technical committee.

12:00pm-12:30pm

KEYS TO SUCCESSFUL AND STABLE ON-SHORE PACKAGING AND ADVANCED PACKAGING DEFENSE INDUSTRIAL BASE

Jim Will, SkyWater Technology - A&D BU Director

Jim Will is the A&D BU Director at SkyWater Technology Foundry.  He leads the iMAPS US Government and Defense Committee, and is also co-lead of the NDIA, Electronics Division, DIB & Policy Subcommittee. Jim has engaged USG and Defense Electronics Programs in both USG Contractor and Commercial roles. As DOE NNSA contractor at the Kansas City National Security Campus (KCNSC), Jim supported semiconductor products industrial base development, Trusted Foundry, product realization, and enterprise assurance interests.  Jim‘s career spans thirty years in the semiconductor industry with Motorola and Infineon in roles from Engineer to Engineering Management. Jim‘s education includes BSEE with Microelectronic Engineering focus and MS Material Science and Engineering degrees from Rochester Institute of Technology.

Featuring 3 Technical Tracks and an Interactive Poster Session

View the Full Technical Program

Interactive
Poster Session

PROFESSIONAL DEVELOPMENT COURSES (PDCs)

DPC 2022 will offer supplementary classroom style education in the form of two-hour short courses taught by industry leaders

Monday, March 7, 2022

  • 10:00AM-12:00PM
    • PDC1: Introduction to Fan-Out Wafer Level Packaging, Beth Keser, Intel Corp.
    • PDC2: The Evolution of Flip Chip Package Technology, Mark Gerber, ASE US, Inc.
    • PDC3: Failure Analysis in Semiconductor Package Assembly, Tom Dory, Fujifilm Electronic Materials USA
  • 1:00PM-3:00PM
    • PDC4: 5G mmWave -- Cancelled
    • PDC5: Chip Packaging Processes and Materials, Syed Sajid Ahmad
    • PDC6: Flip Chip Tutorial, Richard McKee, Integra Technologies, LLC
  • 3:30PM-5:30PM
    • PDC7: Advances in Fan-Out Wafer Level Packaging (FOWLP), Beth Keser, Intel Corp.
    • PDC8: System-in-Package (SiP) - System Solutions Through Miniaturization, Mark Gerber, ASE US, Inc.
    • PDC9: 3D Package Assembly Processes and Technology, Tom Dory, Fujifilm Electronic Materials USA

SPONSORS AND EXHIBITORS

Organizations exhibiting:

Exhibits are sold out!

3DIncitesF&K Delvotec, Inc.Macdermid Alpha Electronics SolutionsSETNA

AdTech Ceramics

Finetech

Materion

Siemens

AI Technology, Inc.Geib RefiningMetalorSikama
A.L.M.T. Corp.Gel-PakMicro Systems TechnologiesSilitronics
Amkor Technology, Inc.Golden Altos Corp.MicrossSPTS Technologies Ltd, A KLA Company

ASE Group

Heidelberg Instruments Co.

MRSI Systems, Mycronic Group

StratEdge Corp.

ASM Pacific TechnologyHesse Mechatronics, Inc.NAMICS Technologies, Inc.SUSS MicroTec

AT&S Austria Technologie & Systemtechnik AG

Integra Technologies, LLC

Nano OPS, Inc.

Technic

Axus Technology

IMAT Inc.

Okamoto Corp.

TechSearch International

Besi North America, Inc.JCET GroupOneida Research Services, Inc.Teikoku Taping System, Inc.
Cadence Design SystemsJIACO InstrumentsOptomecUniversal Instruments Corp.
Deca Technologies Inc.JSR MicroPacTech USA Packaging Technologies, Inc.Xperi

DeWeyl Tool Company

JX Nippon Mining & Metals

Palomar Technologies

XYZTEC, Inc.

EMD ElectronicsKulicke & Soffa Inc.Plasma-ThermZymet, Inc.
EV GroupLintec of America, Inc.Practical Components
EvatecQP Technologies

Sales & Service, Inc.

REGISTRATION

Early registration discounts end January 26, 2022. Register online today.   

   REGISTER ONLINE   

Registration TypeEarly (by Jan. 26)Jan. 27 and after
Member$825$925
Nonmember$925$1,025
Speaker/Chair$595$695
Student$300$400
PDC Courses (separate fee)$325$425
Member Virtual$825
Nonmember Virtual$925
Speaker/Chair Virtual$595
Student Virtual$300


Cancellations are due in writing to IMAPSHQ@gmail.com. Full refunds from cancellations will be made if cancellation request is received by email on/before February 23, 2022. Cancellations made after February 23, 2022, will be handled as IMAPS credit, not subject to a processing fee, toward a future IMAPS event. Neither refunds nor credits will be issued for cancellations after March 4, 2022.


  

2022 David Virissimo Spring Charity Golf Outing
benefiting the Microelectronics Foundation

Sunridge Canyon Golf

Thursday, March 10, 2022
4-Person Scramble | 1:15 PM Shotgun Start
Check-in: 12:00-1:00 PM
SunRidge Canyon Golf Club
13100 N Sunridge Dr.
 Fountain Hills, AZ
http://www.sunridgegolf.com/

   REGISTER   

3D InCites Hike For DEI, Sponsored by KLA


If you‘re not participating in the golf tournament, why not join us for a guided, afternoon hike in the nearby McDowell Sonoran Preserve? All proceeds benefit the 3D InCites DEI Fund, established to help tech start-ups owned by women and under-represented minorities grow and thrive.

The hike will be held Thursday, March 10, departing the hotel around 1pm. This event is limited to 30 participants

For a minimum donation of $75, you‘ll enjoy a two-hour hike, which includes:


  • KLA- branded backpack with assorted hiking accessories
  • Transportation to and from the trailhead
  • Hotel escort(s)
  • WFA & CPR certified guides
  • Iced bottled water, and snacks
  • Insurance, permit, and entry fees

   REGISTER   

Hotel & Booking Information 

   
We-Ko-Pa Resort & Conference Center
Fountain Hills, Arizona

Single/Double is $199 per night + taxes/fees

Hotel deadline: January 26, 2022

Click here for hotel reservations at the discounted rate.

HOTEL IS FULL. Keep checking daily to see if more rooms become available. We recommend calling the reservation desk directly: 1-480-789-4957.

There is a Comfort Inn Fountain Hills nearby - 17105 E Shea Blvd., Fountain Hills, AZ 85268 - 480-837-5343 that may have availability.

Reservations must be made before the cutoff date.
Cancellations within 72-hours will be charged.


Click here to take a Virtual Tour of the newly renovated resort! 

   -    CASINO   -    RECREATION   -    SPA   -    GOLF   -    

                   

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CORPORATE SPONSORS






  

AT&S

  

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TechSearch International


Mask Sponsor

   

OFFICIAL INDUSTRY PARTNER


3DInCites

3DInCites Podcast

OFFICIAL MEDIA SPONSOR

Chip Scale Review