Device Packaging Conference

Conference Chairs

General Chair:
Eric Huenger, DuPont Electronic and Imaging

General Chair-Elect:
Prasad Dhond, Amkor Technology

Past General Chairs:
Rama Puligadda, Brewer Science
Jon Aday, Amkor Technology

Did you miss the Live Show?  Don't worry...

DPC Registration will remain OPEN through May 14, 2021 

Full conference registration After April 15 will give the attendee access to: 

  • ALL LIVE CONTENT including Keynote presentations, panels, sessions, etc. are already recorded and available for viewing 
    through the Virtual Conference Portal until May 14, 2021. 
    • (with the exception of PDCs)
  • Extended Abstracts one download sent to the registrant by email.  Provided by April 21. 
    • (Presentations pending presenter submission and authorization) 
  • Corporate Partner profile pages can still be viewed but will not be actively monitored/ live chat disabled.
    • You can still reach out to the company using the Contact Us form. 
  • IMAPS individual membership extension or membership renewal.
    • Does not apply to Corporate Level or Affiliates. 

Click HERE for Post-Live Conference Registration

  1. Select your registration type from the available options.  (Member, Non-Member, Student, etc.) 
  2. Make payment online with a credit card. 
  3. Receive a confirmation via email. This will NOT include your login details for the conference. 
    1. You will receive this from and there will be a slight delay between your registration and receiving your login credentials.
    2. Please email Shelby Moirano Gonzalez with any questions.

The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.


 Monday - Thursday | April 12 - 15, 2021 

Professional Development Courses (PDCs)
2-Hour Courses Led by Industry Professionals 

 Tuesday - Thursday | April 13 - 15, 2021 

Full Conference | Presentations | Panels | Partner Profiles | Round Rooms 
New LIVE Content Each Day! 

 Monday, April 12 

Live Conference Portal Opens!
PDCs Only

4 Course Options
Download Partner "Swag"!

 Tuesday, April 13 

2 Keynotes
Technical Panel Session

 Wednesday, April 14 

GBC Plenary Session
iNEMI 5G Invited Session

 Thursday, April 15 

2 Keynotes
Industry-sponsored Panel on 5G
3 Technology Track Round Rooms
(3D, FOWLP/FC, Automotive)

A Hit LIVE Keynote Speaker Lineup

Seung Wook Yoon
Samsung Electronics

Ram Viswanath
Intel Corporation

Thorsten Meyer
Infineon Technologies     

Dr. Brij Singh
John Deere

Mark Chaney
John Deere

Dr. Scott Johnson
John Deere

Live Technical Panel Discussion

Tuesday, April 13, 2021 | 3:00PM - 4:30PM EST

Chair and Moderator: E. Jan Vardaman, TechSearch International, Inc. 


Ivor Barber, AMD - Corporate VP Packaging

Veer Dhandapani, NXP Semiconductors - Sr. Director Automotive Package Innovation

Devan Iyer, Technology Management - Educator and Executive Advisor

Rebeca Jimenez, Amkor Technology - Corporate Vice President, Advanced SiP Business Unit

Paul Mescher, Microsoft - Senior Director IC Packaging Technology

Demand for electronic products and services remain strong.  Work-from-home, video conferencing, and remote learning are driving datacenter growth and laptop and tablet demand.  5G infrastructure rollout is underway and smartphone sales are returning to normal levels.  Automotive sales are increasing.  At the same time the industry is experiencing acute shortages of 200mm fab capacity, components, equipment such as wire bonders, substrates, and leadframes. Is the supply chain broken and what can we do to resolve these issues?

Led by Moderator: Eric Gongora 
Global Director, Semiconductor Product Market  MacDermid Alpha

Meet the Experts – Virtual Happy Hour 

A MacDermid Alpha hosted event!

Tuesday, April 13, 2021 | 5:00PM - 6:30PM EST

Grab your favorite beverage and virtually meet our industry experts and discuss any questions you may have regarding your semiconductor processes. A brief presentation highlighting our latest offerings from our Alpha, Kester, Compugraphics and MacDermid Enthone brand, will be presented, followed by a Q&A session. Click here for complete information.

Interested parties please contact Deanna Cullen –

Virtual Global Business Council (GBC) Live Plenary Session
Wednesday, April 14, 2021 | 11AM - 2PM EST

Friends in HI Places...
Enabling the Transition to Heterogeneous Integration

Advancements in substrates and interconnection will be a key requirement in enabling heterogeneous integration (HI) and the gap between device IO or pad densities and substrate interconnect capabilities is expanding.  Substrate technology must transition towards the levels of scaling that the semiconductor industry continues to demonstrate which will require both high levels of innovation and investment.

The industry has been addressing these issues and the urgency for new technologies, solutions and supply chains.  These have been highlighted due to ABF and advanced substrate supply shortages.  This has created major issues for the industry and the cost / availability and yields for the most advanced fcBGA substrates has become a critical issue.  As these applications transition to HI, the substrate size and density requirements can pose major obstacles.

This Live Virtual Session will Feature 5 Expert GBC Speakers: 

Bill Chen, ASE Group

Bryan Black, AMD

John Lau, Unimicron Technology Corp.

Jan Vardaman, TechSearch International 

Santosh Kumar, Yole 

Live iNEMI Invited Session
Wednesday, April 14, 2021 | 3PM - 5:45PM EST

5G Electronics Challenges: High Frequency Materials Characterization 

Next-generation 5G communications solutions require ultra-low loss laminate materials and PCBs/substrates for efficient design and manufacturing. However, these materials pose challenges. For example, there is no consistent methodology for measuring transmission loss or Df/Dk, especially for higher frequencies (e.g., >30 GHz). Many different approaches are currently used, requiring different fixtures and test methods, sample preparation, and/or data analysis/extraction. In response, iNEMI members organized the 5G/mmWave Materials Assessment and Characterization project to develop guidelines and best practices for a standardized measurement and test methodology that can be shared with industry and relevant standards organizations.

This session will provide 5 presentations:

Urmi Ray, iNEMI | Challenges for High Dk/Df Measurements

Richard Stephenson, EMD Electronics | Benchmarking Resonator based Low Dk/Df Material Measurements

Magorzata Celuch & Marzena Olszewska-Placha , QWED | Recent Developments of Resonator Measurements for Emerging Materials and Technologies

Nathan Orloff, NIST | High Frequency Measurements Using Wafer Level Techniques

Say Phommakesone, Keysight | Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements

Live Industry-Sponsored Panel
Thursday, April 15, 2021 | 1PM - 2PM EST

5G MATERIALS Roadmap : Industry Voices
Moderator: Urmi Ray, iNEMI, Experienced Semiconductor Consultant

A partner representative will participate in a moderated interactive panel connecting attendees with supply chain solutions and highlights of key technologies their organization can solve. 

Industry Panelists

Brewer Science | Dongshun Bai
"Innovation in materials for overcoming technology challenges for heterogenous integration of 5G devices"

MacDermid Alpha | Jim Watkowski
"Copper Adhesion Promotion for 5G" 

EMD Electronics | Richard Stephenson
"Connection Digital Living" 

Live Technology Track Round Rooms | Tech Brainstorm / Q&A
Thursday, April 15, 2021 | 3:15PM - 6:45PM EST

 Ask the HI / 3D Experts
3:15pm - 4:15pm

Mike Kelly | Amkor Technology

H.I. / 3D Experts: 

  • Dave Hiner, Amkor Technology
  • Max Min, Samsung
  • John Park, Cadence
  • Wolfgang Sauter, Marvell

Ask the Fan-out & Flip Chip Experts
4:30pm - 5:30pm

Suresh Jayaraman | Amkor Technology
Nokibul Islam | JCET Group

FOWLP/FC Experts: 

  • Craig Bishop, Deca
  • Rameen Hadizadeh, Cirrus logic
  • Amy Lujan, SavanSys
  • Luke Prenger, Brewer Science
  • Philip Tyler, Veeco

Ask the Automotive Packaging Experts
5:45pm - 6:45pm

Tu-Ahn Tran | NXP
Vik Chaundhry | Amkor Technology

Automotive Experts: 

  • Ken Araujo, NAMICS
  • Burton Carpenter, NXP
  • Nokibul Islam, JCET Group
  • Ajay Kumar Sattu, Amkor Technology
  • Jerry Wu, Dexerials

What to Expect

At the 2021 DPC Virtual Conference, attendees can expect...

More than 65 on-demand session speakers across 3 technical tracks and 16 sessions 

Recorded technical presentations will be available for on-demand viewing through the Virtual Conference Portal starting April 12

In cased you missed anything ... the Portal will remain open for up to 30 days! 

 3D Integration 

 Fo-WLP/ Flip Chip 

 Automotive / 5G 
 Advanced Packaging 

 Poster Session 

A hit LIVE keynote speaker lineup:

  • Seung Wook YoonSamsung Electronics
  • Ram ViswanathIntel Corporation
  • Thorsten MeyerInfineon Technologies
  •  Dr. Brij Singh, Mark Chaney and Dr. Scott JohnsonJohn Deere Co. 


Panel Discussions & Invited Sessions

  • LIVE Global Business Council plenary session featuring speakers from across the industry on: Friends in HI Places Enabling the Transition to Heterogeneous Integration
  • LIVE technical panel session moderated by Jan Vardaman, TechSearch International, on: ELECTRONICS INDUSTRY SUPPLY CHAIN:  IS IT BROKEN? 
  • A LIVE iNEMI Invited Session on: 5G Electronics Challenges: High Frequency Materials Characterization
  • An ALL NEW LIVE Industry-Sponsored Panel Discussion on: 5G MATERIALS CHARACTERIZATION/TEST CHALLENGES -- Sponsor Seats Still Available!


 A full slate of 7 LIVE professional development courses from the industry's best instructors

Supplemental two-hour classroom-style tutorials with a narrow educational focus

Professional Development Courses

DPC 2021 will offer supplementary classroom-style education in the form of two-hour short courses taught by industry leaders virtually. 

View courses and descriptions

Corporate Partnership Opportunities

The new and improved DPC 2021 Corporate Partnership Guide is now available! Early commitments are already flooding in. Download the guide to review the partnership opportunities and secure your involvement now. Click here to learn more...

NEW! Would you like to visit the Corporate Partners without registering for the entire conference?
Now you can register for a complimentary Partner Profile Only Badge!

This $0 badge will give you access to the Partner Profiles and  ability to communicate with them via the chat. 
This does not include access to the presentations or any technical content. 

Click here to view highlights from DPC 2020.

Corporate Partners

Platinum Hosting Partner


Gold Hosting Partners



Silver Hosting Partner


Presenting Partners


Kulicke & Soffa


QP Technologies



            Supporting Partners                    





JSR Micro

ECI Technology





IBM Canada


Yield Engineering

Universal Instruments

Pac Tech

MacDermid Alpha

MST Micro Systems Technologies

Media Partners


Semiconductor Digest