Device Packaging Conference
Interconnects for Tomorrow’s Applications
Prasad Dhond, Amkor Technology
Nokibul Islam, JCET Group
Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
We are planning a safe and successful event to welcome you back in-person to IMAPS 2022 Device Packaging Conference, March 7-10 in Fountain Hills, AZ! For complete COVID Safety Protocols information, please click here.
A Conversation about What's Happening at the IMAPS Device Packaging Conference
Hybrid Bonding for the Next Generation of High Performance Devices
Future of Packaging
Intelligent Power and Sensing Solutions for a Sustainable Future
So Many High Performance Packages: Is There a Winner?
E. Jan Vardaman, President and Founder
TechSearch International, Inc.
Calvin Cheung, ASE Group
Mike Kelly, Amkor Technology
Suresh Ramalingam, Xilinx
Islam (Sam) Salama, Hyperion Technologies
Raja Swaminathan, AMD
New packaging solutions are being adopted to achieve the economic advantages that were previously met with silicon scaling. Heterogeneous integration, especially chiplets, is pivotal in this new era. The difficulty is making a package choice from the sea of options. This panel examines the drivers for different options with proponents of different packages, including Silicon Interposer, Fan-out on Substrate, and Embedded Bridge. Advantages of sided-by-side and 3D configurations will be debated.
Welcome to the Global Business Council (GBC) Keynote & Plenary Session on
US DOMESTIC CAPABILITIES FOR ON-SHORING
OF IC PACKAGING AND ASSEMBLY FOR DoD ACCESS
GBC Plenary Session Sponsored by:
GBC OPENING COMMENTS
GBC Chairs: Rich Rice, ASE Group; Chris Riso, Booz Allen Hamilton Inc.
DoD‘S STATE OF THE ART (SOTA) HETEROGENEOUS INTEGRATED
PACKAGING (SHIP) PROGRAM
The DoD‘s State Of The Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program is designed to increase the level of access to SOTA microelectronics for DoD and the Defense Industrial Base. The SHIP program is focused on developing a sustainable business and operational model to provide access to domestic sources of SOTA digital and radio frequency packaging. Sustained access to SOTA packaging will foster significant system performance increases, which will enable military system modernization and support next generation capabilities.
Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics
Dr. Crum began his career with the Department of the Navy (DoN) at Naval Surface Warfare Center, Crane Division. Early in his career he managed three microelectronics focused engineering branches, including the Component Engineering Branch, the Obsolescence Management Branch, and the Electronics Design Branch.
In 2006, Dr. Crum became the Naval Sea Systems (NAVSEA) Command Anti-Tamper Technical Warrant Holder, and then in 2009 he became the DoN Anti-Tamper Technology Coordinator. In this role, he focused on identifying technical gaps and leading the development of new technologies to protect microelectronics.
In 2021, Dr. Crum became the Microelectronics Advanced Packaging & Test Lead and the Technical Lead of the SOTA Heterogeneous Integrated Packaging (SHIP) program for OUSD(R&E) – Modernization Microelectronics. In this role, he is responsible for executing technology development efforts to support the DoD Microelectronics Roadmap.
Dr. Crum has a BSEE (1990) from the University of Kentucky, a MA (2000) in Public Administration from Indiana University, and a doctorate (2006) in Organization & Management from Capella University.
John Sotir, Intel Corp. Programmable Solutions Group - Director of the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Organization
John started his career as an analog research engineer in the R&D division of Dynamics Research Corporation where he holds patents on sensor technology and products.
He joined Lucent Microelectronics (later a spin-out called Agere), where John led several product line management roles within the communication and networking space and holds a patent on networking architecture. He joined multiple incubator divisions with a focus on building operational and business models from corporate R&D‘s break through advancements including those related to LDMOS Power Amplifiers and high-speed and QoS scheduling and switching technologies.
John joined Altera Corporation in 2006, later acquired by Intel Corporation, where he served multiple leadership roles in the Communications, Medical/Test & Measurement business units and business management organizations. John is deeply involved in both Leadership and Diversity and Inclusion task forces withing Intel helping to unleash the potential of both individuals and teams.
Ted Jones, Qorvo Inc. - Sr. Product Line Director for High Performance Solutions Services within Infrastructure and Defense Products (IDP)
Ted Jones is Sr. Product Line Director for High Performance Solutions Services within Infrastructure and Defense Products (IDP) at Qorvo. The Services product line includes Foundry, Advanced Packaging, Silicon Services, and Spatium® (wide band solid state power amplifiers) . He has experience in both the defense and commercial industries covering RF Systems and Program/Business management. His product experience includes Sensors, Subsystems, Advanced Packaging, and Manufacturing. Ted has BSEE degree from University of Colorado and an MSEE degree University of Texas Arlington.
Question & Answer Session with the SHIP Program Speakers
STATE OF THE ART HETEROGENEOUS INTEGRATED COMPUTING ENABLING WARFARE MODERNIZATION CAPABILITIES
Tom Smelker, Mercury Systems – VP& GM, Microsystems
Mr. Smelker is the Vice President and General Manager of Mercury‘s Microsystems business. In this business, he is responsible for the programmatic and technical execution of the latest 2/2.5 and 3D microelectronics for rugged defense applications. These capabilities are aimed at accelerating mission critical applications at the tactical edge. Tom Smelker leads a highly innovative Mercury Systems team focused on delivering high-performance processing and memory solutions at the sensor edge for major defense and intelligence programs across air, ground, sea, and space platforms. Mr. Smelker has over 25 years of experience leading and designing high assurance microelectronics for defense sensors and weapons applications. In his previous role, he was a Senior Fellow at a defense prime and was the Chief Architect and Chief Technologist for secure processing.
DOMESTIC ADVANCED PACKAGING FOR HI-REL MICROELECTRONICS – THE FUTURE IS NOW
Dr. John Lannon, Micross Advanced Interconnect Technology - General Manager
Dr. John Lannon (’91 BS WVU/’96 PhD WVU in Physics) is the General Manager of Micross Advanced Interconnect Technology. Over the course of his career, he has been involved in process improvements related to fabrication of MEMS-like devices and assisted with the development of high density interconnects (sub-20 m pitch) for die stacking and detector hybridization. More recently, he contributed to the development of wafer-level vacuum packaging (WLVP) solutions for MEMS devices. As part of Micross, he continues to be focused on the development and implementation of 3D integration and advanced packaging solutions for government and commercial applications. John is an active member of AVS and member of the WLPS technical committee.
KEYS TO SUCCESSFUL AND STABLE ON-SHORE PACKAGING AND ADVANCED PACKAGING DEFENSE INDUSTRIAL BASE
Jim Will, SkyWater Technology - A&D BU Director
Jim Will is the A&D BU Director at SkyWater Technology Foundry. He leads the iMAPS US Government and Defense Committee, and is also co-lead of the NDIA, Electronics Division, DIB & Policy Subcommittee. Jim has engaged USG and Defense Electronics Programs in both USG Contractor and Commercial roles. As DOE NNSA contractor at the Kansas City National Security Campus (KCNSC), Jim supported semiconductor products industrial base development, Trusted Foundry, product realization, and enterprise assurance interests. Jim‘s career spans thirty years in the semiconductor industry with Motorola and Infineon in roles from Engineer to Engineering Management. Jim‘s education includes BSEE with Microelectronic Engineering focus and MS Material Science and Engineering degrees from Rochester Institute of Technology.
Monday, March 7, 2022
- PDC1: Introduction to Fan-Out Wafer Level Packaging, Beth Keser, Intel Corp.
- PDC2: The Evolution of Flip Chip Package Technology, Mark Gerber, ASE US, Inc.
- PDC3: Failure Analysis in Semiconductor Package Assembly, Tom Dory, Fujifilm Electronic Materials USA
- PDC4: 5G mmWave -- Cancelled
- PDC5: Chip Packaging Processes and Materials, Syed Sajid Ahmad
- PDC6: Flip Chip Tutorial, Richard McKee, Integra Technologies, LLC
- PDC7: Advances in Fan-Out Wafer Level Packaging (FOWLP), Beth Keser, Intel Corp.
- PDC8: System-in-Package (SiP) - System Solutions Through Miniaturization, Mark Gerber, ASE US, Inc.
- PDC9: 3D Package Assembly Processes and Technology, Tom Dory, Fujifilm Electronic Materials USA
Exhibits are sold out!
|3DIncites||F&K Delvotec, Inc.||Macdermid Alpha Electronics Solutions||SETNA|
|AI Technology, Inc.||Geib Refining||Metalor||Sikama|
|A.L.M.T. Corp.||Gel-Pak||Micro Systems Technologies||Silitronics|
|Amkor Technology, Inc.||Golden Altos Corp.||Micross||SPTS Technologies Ltd, A KLA Company|
Heidelberg Instruments Co.
MRSI Systems, Mycronic Group
|ASM Pacific Technology||Hesse Mechatronics, Inc.||NAMICS Technologies, Inc.||SUSS MicroTec|
AT&S Austria Technologie & Systemtechnik AG
|Integra Technologies, LLC|
Nano OPS, Inc.
|Besi North America, Inc.||JCET Group||Oneida Research Services, Inc.||Teikoku Taping System, Inc.|
|Cadence Design Systems||JIACO Instruments||Optomec||Universal Instruments Corp.|
|Deca Technologies Inc.||JSR Micro||PacTech USA Packaging Technologies, Inc.||Xperi|
DeWeyl Tool Company
JX Nippon Mining & Metals
|EMD Electronics||Kulicke & Soffa Inc.||Plasma-Therm||Zymet, Inc.|
|EV Group||Lintec of America, Inc.||Practical Components|
|Sales & Service, Inc.|
Early registration discounts end January 26, 2022. Register online today.
|Registration Type||Early (by Jan. 26)||Jan. 27 and after|
|PDC Courses (separate fee)||$325||$425|
Cancellations are due in writing to IMAPSHQ@gmail.com. Full refunds from cancellations will be made if cancellation request is received by email on/before February 23, 2022. Cancellations made after February 23, 2022, will be handled as IMAPS credit, not subject to a processing fee, toward a future IMAPS event. Neither refunds nor credits will be issued for cancellations after March 4, 2022.
3D InCites Hike For DEI, Sponsored by KLA
If you‘re not participating in the golf tournament, why not join us for a guided, afternoon hike in the nearby McDowell Sonoran Preserve? All proceeds benefit the 3D InCites DEI Fund, established to help tech start-ups owned by women and under-represented minorities grow and thrive.
The hike will be held Thursday, March 10, departing the hotel around 1pm. This event is limited to 30 participants.
For a minimum donation of $75, you‘ll enjoy a two-hour hike, which includes:
- KLA- branded backpack with assorted hiking accessories
- Transportation to and from the trailhead
- Hotel escort(s)
- WFA & CPR certified guides
- Iced bottled water, and snacks
- Insurance, permit, and entry fees
Single/Double is $199 per night + taxes/fees
Hotel deadline: January 26, 2022
HOTEL IS FULL. Keep checking daily to see if more rooms become available. We recommend calling the reservation desk directly: 1-480-789-4957.
There is a Comfort Inn Fountain Hills nearby - 17105 E Shea Blvd., Fountain Hills, AZ 85268 - 480-837-5343 that may have availability.
Reservations must be made before the cutoff date.
Cancellations within 72-hours will be charged.
Click here to take a Virtual Tour of the newly renovated resort!