Device Packaging Conference

Interconnects for Tomorrow’s Applications



Conference Chairs


General Chair:
Prasad Dhond, Amkor Technology

General Chair-Elect:
Nokibul Islam, JCET Group

Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science

The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.


IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of DPC 2022. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best event in March and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Conference are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all. Speakers that cannot attend to present in person will have virtual options for delivering their technical presentations at Device Packaging. 



KEYNOTE SPEAKERS

Hybrid Bonding for the Next Generation of High Performance Devices

Laura Mirkarimi
VP of Engineering, 3D Portfolio and Bonding Technology
Xperi Corp.

Future of Packaging

Rao Tummala
Emeritus Professor
Georgia Tech

Advanced Packaging: Enabling
Moore's Law's Next Frontier
through Heterogeneous

Integration

Raja Swaminathan
Senior Fellow
AMD

Intelligent Power and Sensing Solutions for a Sustainable Future 

Jerome Teysseyre
VP – Head of onsemi package development and engineering
ON Semiconductor

  GBC PLENARY SESSION

Device Packaging 2022 will also feature a GBC Plenary Session on:


US DOMESTIC CAPABILITIES FOR ON-SHORING
OF IC PACKAGING AND ASSEMBLY FOR DoD ACCESS


A Plenary Session of the IMAPS Global Business Council (GBC) at the 18th Annual Device Packaging Conference (DPC 2022). Speaker details and agenda available soon. Date: Wednesday, March 9, 2022  Time: 08:00 to 12:00

   

Featuring 3 Technical Tracks and an Interactive Poster Session

Interactive
Poster Session

Organizations presenting as of October 20:

3M

Deca Technologies

Optomec

Advanced Micro Devices, Inc.

DuPont - Electronics & Industrial Materials

Osaka Univ.

Amkor Technology, Inc.

Electroninks inc.

Qualdiamond High Tech Inc.

Ansys

ERS Electronic GmbH

Salmon Engineering

ASE Group

Fraunhofer AZM-ASSID

SavanSys Solutions LLC

Atotech Deutchland GmbH

Georgia Tech

Schrodinger Inc.

Auburn Univ.

Indium Corporation

Siemens DISW

Brewer Science

Integra Technologies, LLC

Siemens EDA

Cadence Design Systems

Intel Corp.

Siliconware Precision Industries Co., Ltd.

City of Jamestown ND

International Test Solutions,
a CMC Materials Company

STMicroelectronics

Corning Inc.

MacDermid Alpha Electronics Solutions

SUSS MicroTec

Dai Nippon Printing

Meco Equipment Engineers B.V.

 Univ. of Texas at El Paso

nScrypt, Inc.

      

PROFESSIONAL DEVELOPMENT COURSES (PDCs)

DPC 2022 will offer supplementary classroom style education in the form of two-hour short courses taught by industry leaders

Monday, March 7, 2022

  • 10:00AM-12:00PM
    • PDC1: Introduction to Fan-Out Wafer Level Packaging, Beth Keser, Intel Corp.
    • PDC2: The Evolution of Flip Chip Package Technology, Mark Gerber, ASE US, Inc.
    • PDC3: Failure Analysis in Semiconductor Package Assembly, Tom Dory, Fujifilm Electronic Materials USA
  • 1:00PM-3:00PM
    • PDC4: 5G mmWave Package Development Requirements and SolutionsUrmi Ray, Consultant 
    • PDC5: Chip Packaging Processes and Materials, Syed Sajid Ahmad
    • PDC6: Flip Chip Tutorial, Richard McKee, Integra Technologies, LLC
  • 3:30PM-5:30PM
    • PDC7: Advances in Fan-Out Wafer Level Packaging (FOWLP), Beth Keser, Intel Corp.
    • PDC8: System-in-Package (SiP) - System Solutions Through Miniaturization, Mark Gerber, ASE US, Inc.
    • PDC9: 3D Package Assembly Processes and Technology, Tom Dory, Fujifilm Electronic Materials USA

SPONSORS AND EXHIBITORS


DPC 2022 Exhibitor Prospectus Available Now!

Phase 1: Major Sponsors - sill available

Phase 2: Returning Exhibitors DPC 2020-2021 - Sept. 1 thru Oct. 15

Phase 3: Open Application Period - Oct. 16 thru Show Date

Organizations exhibiting as of January 6:

Exhibits are sold out!

3DIncites

F&K Delvotec, Inc.

Macdermid Alpha Electronics Solutions

Siemens

AdTech CeramicsFinetechMaterionSikama
AI Technology, Inc.Geib RefiningMetalorSilitronics
A.L.M.T. Corp.Gel-PakMetallix Refining, Inc.SPTS Technologies Ltd, A KLA Company

Amkor Technology, Inc.

Golden Altos Corp.

Micro Systems Technologies

StratEdge Corp.

ASE GroupHeidelberg Instruments Co.MicrossSUSS MicroTec

ASM Pacific Technology

MRSI Systems, Mycronic Group

Technic

Axus Technology

Hesse Mechatronics, Inc.

NAMICS Technologies, Inc.

TechSearch International

Besi North America, Inc.Integra Technologies, LLCNano OPS, Inc.Teikoku Taping System, Inc.
Cactus Materials, Inc.IMAT Inc.Okamoto Corp.Universal Instruments Corp.
Cadence Design SystemsJCET GroupOneida Research Services, Inc.Xperi

Deca Technologies Inc.

JIACO Instruments

PacTech USA Packaging Technologies, Inc.

XYZTEC, Inc.

DeWeyl Tool CompanyJSR MicroPalomar TechnologiesZuken
EV GroupKulicke & Soffa Inc.Plasma-ThermZymet, Inc.
EvatecLintec of America, Inc.Practical Components

QP Technologies

Sales & Service, Inc.

REGISTRATION

Early registration discounts end January 26, 2022. Register online today.   

   REGISTER ONLINE   

Registration TypeEarly (by Jan. 26)Jan. 27 and after
Member$825$925
Nonmember$925$1,025
Speaker/Chair$595$695
Student$300$400
PDC Courses (separate fee)$325$425



  

2022 David Virissimo Spring Charity Golf Outing
benefiting the Microelectronics Foundation


Thursday, March 10, 2022
4-Person Scramble | 1:15 PM Shotgun Start
Check-in: 12:00-1:00 PM
SunRidge Canyon Golf Club
13100 N Sunridge Dr.
 Fountain Hills, AZ
http://www.sunridgegolf.com/

   REGISTER   

3D InCites Hike For DEI, Sponsored by KLA


If you‘re not participating in the golf tournament, why not join us for a guided, afternoon hike in the nearby McDowell Sonoran Preserve? All proceeds benefit the 3D InCites DEI Fund, established to help tech start-ups owned by women and under-represented minorities grow and thrive.

The hike is limited to 30 participants. For a minimum donation of $75, you‘ll enjoy a two-hour hike, which includes:

  • KLA- branded backpack with assorted hiking accessories
  • Transportation to and from the trailhead
  • Hotel escort(s)
  • WFA & CPR certified guides
  • Iced bottled water, and snacks
  • Insurance, permit, and entry fees

   REGISTER   


Hotel & Booking Information 

   
We-Ko-Pa Resort & Conference Center
Fountain Hills, Arizona

Single/Double is $199 per night + taxes/fees

Hotel deadline: January 26, 2022

Click here for hotel reservations at the discounted rate.


Click here to take a Virtual Tour of the newly renovated resort! 

   -    CASINO   -    RECREATION   -    SPA   -    GOLF   -    

                   

PLATINUM SPONSOR


GOLD SPONSORS


 

SILVER SPONSORS


   

    

   

    

   

    


CORPORATE SPONSORS






ADDITIONAL SPONSORS

   

OFFICIAL INDUSTRY PARTNER


3DInCites

3DInCites Podcast

OFFICIAL MEDIA SPONSOR

Chip Scale Review