Device Packaging Conference
Interconnects for Tomorrow’s Applications
Conference Chairs
General Chair:
Prasad Dhond, Amkor Technology
General Chair-Elect:
Nokibul Islam, JCET Group
Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of DPC 2022. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best event in March and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Conference are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all. Speakers that cannot attend to present in person will have virtual options for delivering their technical presentations at Device Packaging.
KEYNOTE SPEAKERS
Hybrid Bonding for the Next Generation of High Performance Devices
Future of Packaging
Integration
Intelligent Power and Sensing Solutions for a Sustainable Future
GBC PLENARY SESSION
US DOMESTIC CAPABILITIES FOR ON-SHORING
OF IC PACKAGING AND ASSEMBLY FOR DoD ACCESS
A Plenary Session of the IMAPS Global Business Council (GBC) at the 18th Annual Device Packaging Conference (DPC 2022). Speaker details and agenda available soon. Date: Wednesday, March 9, 2022 Time: 08:00 to 12:00
Featuring 3 Technical Tracks and an Interactive Poster Session
Interactive
Poster Session
Organizations presenting as of October 20:
3M | Deca Technologies | Optomec |
Advanced Micro Devices, Inc. | DuPont - Electronics & Industrial Materials | Osaka Univ. |
Amkor Technology, Inc. | Electroninks inc. | Qualdiamond High Tech Inc. |
Ansys | ERS Electronic GmbH | Salmon Engineering |
ASE Group | Fraunhofer AZM-ASSID | SavanSys Solutions LLC |
Atotech Deutchland GmbH | Georgia Tech | Schrodinger Inc. |
Auburn Univ. | Indium Corporation | Siemens DISW |
Brewer Science | Integra Technologies, LLC | Siemens EDA |
Cadence Design Systems | Intel Corp. | Siliconware Precision Industries Co., Ltd. |
City of Jamestown ND | International Test Solutions, | STMicroelectronics |
Corning Inc. | MacDermid Alpha Electronics Solutions | SUSS MicroTec |
Dai Nippon Printing | Meco Equipment Engineers B.V. | Univ. of Texas at El Paso |
nScrypt, Inc. |
PROFESSIONAL DEVELOPMENT COURSES (PDCs)
Monday, March 7, 2022
- 10:00AM-12:00PM
- PDC1: Introduction to Fan-Out Wafer Level Packaging, Beth Keser, Intel Corp.
- PDC2: The Evolution of Flip Chip Package Technology, Mark Gerber, ASE US, Inc.
- PDC3: Failure Analysis in Semiconductor Package Assembly, Tom Dory, Fujifilm Electronic Materials USA
- 1:00PM-3:00PM
- PDC4: 5G mmWave Package Development Requirements and Solutions, Urmi Ray, Consultant
- PDC5: Chip Packaging Processes and Materials, Syed Sajid Ahmad
- PDC6: Flip Chip Tutorial, Richard McKee, Integra Technologies, LLC
- 3:30PM-5:30PM
- PDC7: Advances in Fan-Out Wafer Level Packaging (FOWLP), Beth Keser, Intel Corp.
- PDC8: System-in-Package (SiP) - System Solutions Through Miniaturization, Mark Gerber, ASE US, Inc.
- PDC9: 3D Package Assembly Processes and Technology, Tom Dory, Fujifilm Electronic Materials USA
SPONSORS AND EXHIBITORS
DPC 2022 Exhibitor Prospectus Available Now!
Phase 1: Major Sponsors - sill available
Phase 2: Returning Exhibitors DPC 2020-2021 - Sept. 1 thru Oct. 15
Phase 3: Open Application Period - Oct. 16 thru Show Date
Organizations exhibiting as of January 6:
Exhibits are sold out!
3DIncites | F&K Delvotec, Inc. | Macdermid Alpha Electronics Solutions | Siemens |
| AdTech Ceramics | Finetech | Materion | Sikama |
| AI Technology, Inc. | Geib Refining | Metalor | Silitronics |
| A.L.M.T. Corp. | Gel-Pak | Metallix Refining, Inc. | SPTS Technologies Ltd, A KLA Company |
Amkor Technology, Inc. | Golden Altos Corp. | Micro Systems Technologies | StratEdge Corp. |
| ASE Group | Heidelberg Instruments Co. | Micross | SUSS MicroTec |
ASM Pacific Technology | MRSI Systems, Mycronic Group | Technic | |
Axus Technology | Hesse Mechatronics, Inc. | NAMICS Technologies, Inc. | TechSearch International |
| Besi North America, Inc. | Integra Technologies, LLC | Nano OPS, Inc. | Teikoku Taping System, Inc. |
| Cactus Materials, Inc. | IMAT Inc. | Okamoto Corp. | Universal Instruments Corp. |
| Cadence Design Systems | JCET Group | Oneida Research Services, Inc. | Xperi |
Deca Technologies Inc. | JIACO Instruments | PacTech USA Packaging Technologies, Inc. | XYZTEC, Inc. |
| DeWeyl Tool Company | JSR Micro | Palomar Technologies | Zuken |
| EV Group | Kulicke & Soffa Inc. | Plasma-Therm | Zymet, Inc. |
| Evatec | Lintec of America, Inc. | Practical Components | |
QP Technologies | |||
Sales & Service, Inc. |
REGISTRATION
Early registration discounts end January 26, 2022. Register online today.
| Registration Type | Early (by Jan. 26) | Jan. 27 and after |
| Member | $825 | $925 |
| Nonmember | $925 | $1,025 |
| Speaker/Chair | $595 | $695 |
| Student | $300 | $400 |
| PDC Courses (separate fee) | $325 | $425 |
2022 David Virissimo Spring Charity Golf Outing
benefiting the Microelectronics Foundation
Thursday, March 10, 2022Check-in: 12:00-1:00 PM
3D InCites Hike For DEI, Sponsored by KLA
If you‘re not participating in the golf tournament, why not join us for a guided, afternoon hike in the nearby McDowell Sonoran Preserve? All proceeds benefit the 3D InCites DEI Fund, established to help tech start-ups owned by women and under-represented minorities grow and thrive.
The hike is limited to 30 participants. For a minimum donation of $75, you‘ll enjoy a two-hour hike, which includes:
- KLA- branded backpack with assorted hiking accessories
- Transportation to and from the trailhead
- Hotel escort(s)
- WFA & CPR certified guides
- Iced bottled water, and snacks
- Insurance, permit, and entry fees
REGISTER
Hotel & Booking Information
We-Ko-Pa Resort & Conference Center
Fountain Hills, Arizona
Single/Double is $199 per night + taxes/fees
Hotel deadline: January 26, 2022
Click here for hotel reservations at the discounted rate.
Click here to take a Virtual Tour of the newly renovated resort!
- CASINO - RECREATION - SPA - GOLF -
