Device Packaging Conference

Conference Chairs


General Chair:
Prasad Dhond, Amkor Technology

General Chair-Elect:
Nokibul Islam, JCET Group

Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science

The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.




Featuring 3 Technical Tracks and an Interactive Poster Session


Click Here to Submit an Abstract or PDC | Deadline September 1, 2021

Heterogeneous
3D Integration

Fan-Out, Wafer Level Packaging & Flip Chip

Automotive, 5G & Next Gen Applications

Interactive
Poster Session

           


      

Professional Development Courses (PDCs)


DPC 2022 will offer supplementary classroom style education in the form of two-hour short courses taught by industry leaders. 

Sponsors & Exhibitors 


Packages and opportunities coming soon! 



Hotel & Booking Information 


We-Ko-Pa Resort & Conference Center
Fountain Hills, Arizona

IMAPS Room Block - Booking link coming soon*



Click here to take a Virtual Tour of the newly renovated resort! 

   -    CASINO   -    RECREATION   -    SPA   -    GOLF   -