Device Packaging Conference

Interconnects for Tomorrow‘s Applications



Conference Chairs


General Chair:
Prasad Dhond, Amkor Technology

General Chair-Elect:
Nokibul Islam, JCET Group

Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science

The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.


IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of DPC 2022. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best event in March and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Conference are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all. Speakers that cannot attend to present in person will have virtual options for delivering their technical presentations at Device Packaging. 



KEYNOTE SPEAKERS

Hybrid Bonding for the Next Generation of High Performance Devices

Laura Mirkarimi
VP of Engineering, 3D Portfolio and Bonding Technology
Xperi Corp.

Future of Packaging

Rao Tummala
Emeritus Professor
Georgia Tech

Advanced Packaging: Enabling
Moore's Law's Next Frontier
through Heterogeneous

Integration

Raja Swaminathan
Senior Fellow
AMD


  GBC PLENARY SESSION


Device Packaging 2022 will also feature a GBC Plenary Session on:

The Global Impact of On-shoring of Microelectronics Manufacturing


A Plenary Session of the IMAPS Global Business Council (GBC) at the 18th Annual Device Packaging Conference (DPC 2022). Speaker details and agenda available soon. Date: Wednesday, March 9, 2022  Time: 08:00 to 12:00

Featuring 3 Technical Tracks and an Interactive Poster Session


Click Here to Submit an Abstract or PDC

Last Chance to submit!


Interactive
Poster Session

Organizations presenting as of October 20:

3M

Deca Technologies

Optomec

Advanced Micro Devices, Inc.

DuPont - Electronics & Industrial Materials

Osaka Univ.

Amkor Technology, Inc.

Electroninks inc.

Qualdiamond High Tech Inc.

Ansys

ERS Electronic GmbH

Salmon Engineering

ASE Group

Fraunhofer AZM-ASSID

SavanSys Solutions LLC

Atotech Deutchland GmbH

Georgia Tech

Schrodinger Inc.

Auburn Univ.

Indium Corporation

Siemens DISW

Brewer Science

Integra Technologies, LLC

Siemens EDA

Cadence Design Systems

Intel Corp.

Siliconware Precision Industries Co., Ltd.

City of Jamestown ND

International Test Solutions,
a CMC Materials Company

STMicroelectronics

Corning Inc.

MacDermid Alpha Electronics Solutions

SUSS MicroTec

Dai Nippon Printing

Meco Equipment Engineers B.V.

 Univ. of Texas at El Paso

nScrypt, Inc.

      

PROFESSIONAL DEVELOPMENT COURSES (PDCs)


DPC 2022 will offer supplementary classroom style education in the form of two-hour short courses taught by industry leaders. 

Submit your PDC Proposal here!


SPONSORS AND EXHIBITORS


DPC 2022 Exhibitor Prospectus Available Now!

Phase 1: Major Sponsors - sill available

Phase 2: Returning Exhibitors DPC 2020-2021 - Sept. 1 thru Oct. 15

Phase 3: Open Application Period - Oct. 16 thru Show Date

Organizations exhibiting as of November 9:

Only 10 booth spaces left!

3DIncites

F&K Delvotec, Inc.

Macdermid Alpha Electronics Solutions

Siemens

AI Technology, Inc.

Gel-Pak

Metalor

Sikama

A.L.M.T. Corp.

Golden Altos Corp.

Micro Systems Technologies

Silitronics

Amkor Technology, Inc.

Heidelberg Instruments Co.

MRSI Systems, Mycronic Group

SPTS Technologies Ltd, A KLA Company

ASE Group
Henkel Corp.NAMICS Technologies, Inc.
StratEdge Corp.

ASM Pacific Technology

Hesse Mechatronics, Inc.

Oneida Research Services, Inc.

SUSS MicroTec

Axus Technologies
Integra Technologies, LLCPacTech USA Packaging Technologies, Inc.
Technic

 Besi North America, Inc.

IMAT Inc.

Palomar Technologies

TechSearch International

Cadence Design Systems

JCET Group

Practical Components

Teikoku Taping System, Inc.

Deca Technologies Inc.

JIACO Instruments

QP Technologies

Universal Instruments Corp.

DeWeyl Tool Company

JSR Micro


Xperi

EV Group
Kulicke & Soffa Inc.
XYZTEC, Inc.

Evatec

Lintec of America, Inc.


Zymet, Inc.


Lulicke & Soffa Inc.






Hotel & Booking Information 


We-Ko-Pa Resort & Conference Center
Fountain Hills, Arizona

Single/Double is $179 per night + taxes/fees

Hotel deadline: January 26, 2022

Click here for hotel reservations at the discounted rate.


Click here to take a Virtual Tour of the newly renovated resort! 

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