Device Packaging Conference
Interconnects for Tomorrow’s Applications
Prasad Dhond, Amkor Technology
Nokibul Islam, JCET Group
Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Hybrid Bonding for the Next Generation of High Performance Devices
Future of Packaging
Intelligent Power and Sensing Solutions for a Sustainable Future
US DOMESTIC CAPABILITIES FOR ON-SHORING
OF IC PACKAGING AND ASSEMBLY FOR DoD ACCESS
A Plenary Session of the IMAPS Global Business Council (GBC) at the 18th Annual Device Packaging Conference (DPC 2022). Speaker details and agenda available soon. Date: Wednesday, March 9, 2022 Time: 08:00 to 12:00
Organizations presenting as of October 20:
Advanced Micro Devices, Inc.
DuPont - Electronics & Industrial Materials
Amkor Technology, Inc.
Qualdiamond High Tech Inc.
ERS Electronic GmbH
SavanSys Solutions LLC
Atotech Deutchland GmbH
Integra Technologies, LLC
Cadence Design Systems
Siliconware Precision Industries Co., Ltd.
City of Jamestown ND
International Test Solutions,
MacDermid Alpha Electronics Solutions
Dai Nippon Printing
Meco Equipment Engineers B.V.
Univ. of Texas at El Paso
Monday, March 7, 2022
- PDC1: Introduction to Fan-Out Wafer Level Packaging, Beth Keser, Intel Corp.
- PDC2: The Evolution of Flip Chip Package Technology, Mark Gerber, ASE US, Inc.
- PDC3: Failure Analysis in Semiconductor Package Assembly, Tom Dory, Fujifilm Electronic Materials USA
- PDC4: 5G mmWave Package Development Requirements and Solutions, Urmi Ray, Consultant
- PDC5: Chip Packaging Processes and Materials, Syed Sajid Ahmad
- PDC6: Flip Chip Tutorial, Richard McKee, Integra Technologies, LLC
- PDC7: Advances in Fan-Out Wafer Level Packaging (FOWLP), Beth Keser, Intel Corp.
- PDC8: System-in-Package (SiP) - System Solutions Through Miniaturization, Mark Gerber, ASE US, Inc.
- PDC9: 3D Package Assembly Processes and Technology, Tom Dory, Fujifilm Electronic Materials USA
Phase 1: Major Sponsors - sill available
Phase 2: Returning Exhibitors DPC 2020-2021 - Sept. 1 thru Oct. 15
Phase 3: Open Application Period - Oct. 16 thru Show Date
Exhibits are sold out!
F&K Delvotec, Inc.
Macdermid Alpha Electronics Solutions
|AI Technology, Inc.||Geib Refining||Metalor||Silitronics|
|A.L.M.T. Corp.||Gel-Pak||Metallix Refining, Inc.||SPTS Technologies Ltd, A KLA Company|
Amkor Technology, Inc.
Golden Altos Corp.
Micro Systems Technologies
|ASE Group||Heidelberg Instruments Co.||Micross||SUSS MicroTec|
ASM Pacific Technology
MRSI Systems, Mycronic Group
Hesse Mechatronics, Inc.
NAMICS Technologies, Inc.
|Besi North America, Inc.||Integra Technologies, LLC||Nano OPS, Inc.||Teikoku Taping System, Inc.|
|Cactus Materials, Inc.||IMAT Inc.||Okamoto Corp.||Universal Instruments Corp.|
|Cadence Design Systems||JCET Group||Oneida Research Services, Inc.||Xperi|
Deca Technologies Inc.
PacTech USA Packaging Technologies, Inc.
|DeWeyl Tool Company||JSR Micro||Palomar Technologies||Zuken|
|EV Group||Kulicke & Soffa Inc.||Plasma-Therm||Zymet, Inc.|
|Evatec||Lintec of America, Inc.||Practical Components|
Sales & Service, Inc.
Check-in: 12:00-1:00 PM
13100 N Sunridge Dr.
Fountain Hills, AZ
3D InCites Hike For DEI, Sponsored by KLA
If you‘re not participating in the golf tournament, why not join us for a guided, afternoon hike in the nearby McDowell Sonoran Preserve? All proceeds benefit the 3D InCites DEI Fund, established to help tech start-ups owned by women and under-represented minorities grow and thrive.
The hike is limited to 30 participants. For a minimum donation of $75, you‘ll enjoy a two-hour hike, which includes:
- KLA- branded backpack with assorted hiking accessories
- Transportation to and from the trailhead
- Hotel escort(s)
- WFA & CPR certified guides
- Iced bottled water, and snacks
- Insurance, permit, and entry fees
Single/Double is $199 per night + taxes/fees
Hotel deadline: January 26, 2022
Click here to take a Virtual Tour of the newly renovated resort!