Device Packaging Conference

Interconnects for Tomorrow‘s Applications

Program PDCs Speaker Planning Exhibitor & Sponsor Planning Registration Details

Conference Chairs

General Chair:
Prasad Dhond, Amkor Technology

General Chair-Elect:
Nokibul Islam, JCET Group

Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science

The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of DPC 2022. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best event in March and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Conference are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all. Speakers that cannot attend to present in person will have virtual options for delivering their technical presentations at Device Packaging.

KEYNOTE SPEAKERS

Hybrid Bonding for the Next Generation of High Performance Devices

Laura Mirkarimi

VP of Engineering, 3D Portfolio and Bonding Technology

Xperi Corp.

Future of Packaging

Rao Tummala

Emeritus Professor

Georgia Tech

Advanced Packaging: Enabling

Moore's Law's Next Frontier

through Heterogeneous

Integration

Raja Swaminathan

Senior Fellow

AMD

GBC PLENARY SESSION

Device Packaging 2022 will also feature a GBC Plenary Session on:

The Global Impact of On-shoring of Microelectronics Manufacturing

A Plenary Session of the IMAPS Global Business Council (GBC) at the 18th Annual Device Packaging Conference (DPC 2022). Speaker details and agenda available soon. Date: Wednesday, March 9, 2022 Time: 08:00 to 12:00

Featuring 3 Technical Tracks and an Interactive Poster Session

Click Here to Submit an Abstract or PDC

Last Chance to submit!

Heterogeneous
2D & 3D Integration

Fan-Out, Wafer Level Packaging & Flip Chip

Automotive, 5G & Next Gen Applications

Interactive
Poster Session

Organizations presenting as of October 20:

3M	Deca Technologies	Optomec
Advanced Micro Devices, Inc.	DuPont - Electronics & Industrial Materials	Osaka Univ.
Amkor Technology, Inc.	Electroninks inc.	Qualdiamond High Tech Inc.
Ansys	ERS Electronic GmbH	Salmon Engineering
ASE Group	Fraunhofer AZM-ASSID	SavanSys Solutions LLC
Atotech Deutchland GmbH	Georgia Tech	Schrodinger Inc.
Auburn Univ.	Indium Corporation	Siemens DISW
Brewer Science	Integra Technologies, LLC	Siemens EDA
Cadence Design Systems	Intel Corp.	Siliconware Precision Industries Co., Ltd.
City of Jamestown ND	International Test Solutions, a CMC Materials Company	STMicroelectronics
Corning Inc.	MacDermid Alpha Electronics Solutions	SUSS MicroTec
Dai Nippon Printing	Meco Equipment Engineers B.V.	Univ. of Texas at El Paso
	nScrypt, Inc.

PROFESSIONAL DEVELOPMENT COURSES (PDCs)

DPC 2022 will offer supplementary classroom style education in the form of two-hour short courses taught by industry leaders.

Submit your PDC Proposal here!

SPONSORS AND EXHIBITORS

DPC 2022 Exhibitor Prospectus Available Now!

Phase 1: Major Sponsors - sill available

Phase 2: Returning Exhibitors DPC 2020-2021 - Sept. 1 thru Oct. 15

Phase 3: Open Application Period - Oct. 16 thru Show Date

Organizations exhibiting as of November 9:

Only 10 booth spaces left!

3DIncites	F&K Delvotec, Inc.	Macdermid Alpha Electronics Solutions	Siemens
AI Technology, Inc.	Gel-Pak	Metalor	Sikama
A.L.M.T. Corp.	Golden Altos Corp.	Micro Systems Technologies	Silitronics
Amkor Technology, Inc.	Heidelberg Instruments Co.	MRSI Systems, Mycronic Group	SPTS Technologies Ltd, A KLA Company
ASE Group	Henkel Corp.	NAMICS Technologies, Inc.	StratEdge Corp.
ASM Pacific Technology	Hesse Mechatronics, Inc.	Oneida Research Services, Inc.	SUSS MicroTec
Axus Technologies	Integra Technologies, LLC	PacTech USA Packaging Technologies, Inc.	Technic
Besi North America, Inc.	IMAT Inc.	Palomar Technologies	TechSearch International
Cadence Design Systems	JCET Group	Practical Components	Teikoku Taping System, Inc.
Deca Technologies Inc.	JIACO Instruments	QP Technologies	Universal Instruments Corp.
DeWeyl Tool Company	JSR Micro		Xperi
EV Group	Kulicke & Soffa Inc.		XYZTEC, Inc.
Evatec	Lintec of America, Inc.		Zymet, Inc.
	Lulicke & Soffa Inc.

Hotel & Booking Information

We-Ko-Pa Resort & Conference Center
Fountain Hills, Arizona

Single/Double is $179 per night + taxes/fees

Hotel deadline: January 26, 2022

Click here for hotel reservations at the discounted rate.

Click here to take a Virtual Tour of the newly renovated resort!

- CASINO - RECREATION - SPA - GOLF -