Device Packaging Conference

Submit Abstract / PDC Hotel Speaker Planning Exhibitor & Sponsors

Conference Chairs

General Chair:
Nokibul Islam, JCET Group

General Chair-Elect:
Scott Hayes, NXP Semiconductors

Past General Chairs:
Prasad Dhond, Amkor Technology
Eric Huenger, DuPont Electronic & Imaging

The 19th Annual Device Packaging Conference (DPC 2023) will be held at the WeKoPa Resort and Conference Center, from March 13-16, 2023. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Last call to submit abstracts & PDCs Proposals - Closing Soon

Exhibit Pre-sales opened October 12 at 12PM Eastern

We look forwarding to seeing you all in Arizona for Device Packaging 2023!

Be sure to review the DPC 2022 FINAL PROGRAM and listen to the 3D InCites podcast:
A Conversation about What's Happening at the IMAPS Device Packaging Conference

IMAPS Device Packaging Conference 2022 took place March 8-10, here in our home state of Arizona, and we at 3D InCites were very excited and busy at DPC 2022! So we thought it would be great to kick things off and generate some excitement by inviting Beth Keser, IMAPS new President, and Jim Haley, VP of Marketing, to talk about what to expect at the 2022 conference. Listen to all the "from the conference" podcasts here as well.

KEYNOTE SPEAKERS

details soon

Featuring 3 Technical Tracks and an Interactive Poster Session

Call for abstracts now open - submit your abstract today!

New abstract submission software this year. Contact bschieman@imaps.org with any questions.

Heterogeneous
2D & 3D Integration

Fan-Out, Wafer Level Packaging & Flip Chip

Next Gen Applications
(Automotive, 5G/6G, Photonics, HiSpeed RF)

Interactive
Poster Session

New abstract submission software this year. Contact bschieman@imaps.org with any questions.

Abstract Deadline Extended to: November 15, 2022 -- SUBMISSION FORM CLOSING SOON!
Abstract Acceptance: November 30, 2022
Extended Abstract Deadline: February 1, 2023
- Extended Abstracts are short papers - 2/3 pages minimum, images/charts/tables/references should be included. no copyright exchange and no peer review - will not be published/archived, just shared with conference attendees.
- Authors can submit their papers to be published via IMAPS Journal for full peer review and archival publication.
Speaker Conference Registration Deadline: February 1, 2023
- Speakers not registered to attend the conference on/before February 1 could risk being removed from the program agenda.
Bio Due: March 1, 2023
- 2-3 sentences explaining current position, employment history and education/background.
Speaker Presentation Finalized: March 12, 2023
- Powerpoint is the preferred format for speaker presentations.
- Poster presenters do not need to prepare a slide presentation, but should plan on printed posters (one large poster in horizontal format, no larger than 4ft high by 8ft wide) or printed slides tacked up sequentially.
- There is no required powerpoint conference template. All speakers may use their own organizational templates.
- Regular session speakers should plan on 25 minute presentations (plus 5 minutes of questions). Keynote speakers should prepare slides to allow 40 minutes of presentation (plus 5 minutes for questions).

SPONSORS AND EXHIBITORS

Exhibit sales open to renewing 2022 Exhibitors/Sponsors - October 12
Exhibit sales open to new companies (or those missing earlier phases) - November 1

Click here for the DPC 2023 Exhibitor/Sponsor Prospectus.

DPC 2023 Floorplan

Exhibits are sold out each year!

REGISTRATION

Early registration discounts end February 1, 2023.

Registration fees and online registration available soon.

Cancellations are due in writing to IMAPSHQ@gmail.com. Full refunds from cancellations will be made if cancellation request is received by email on/before February 15, 2023. Cancellations made after February 15, 2023, will be handled as IMAPS credit, not subject to a processing fee, toward a future IMAPS event. Neither refunds nor credits will be issued for cancellations after March 1, 2023.

POST-CONFERENCE FUNDRAISING EVENTS

2023 David Virissimo Spring Charity Golf Outing
benefiting the Microelectronics Foundation

Details soon

3D InCites Hike For DEI

If you’re not participating in the golf tournament, why not join us for a guided, afternoon hike in the nearby McDowell Sonoran Preserve? All proceeds benefit the 3D InCites DEI Fund, established to help tech start-ups owned by women and under-represented minorities grow and thrive.

Details soon.

STUDENT COMPETITION

IMAPS DPC Student Design Challenge

Call for Submissions

REGISTER FOR CHALLENGE

Calling on student teams to expand the possibilities of package design using additive manufacturing. As part of this design challenge you will be asked to design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba. The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below. All packaging components, except the devices, should be additively manufactured.

After an initial registration period, you will be sent detailed scoring criteria and manufacturing constraints. You will need first to prepare a white paper that justifies your design, materials selection, and qualification test plan. This can be done with preliminary multi-physics modeling. The top three papers will be selected for protoype manufacture and testing. These top teams will be supported such that one member can travel to the IMAPS Symposium in Boston in October, where they will defend their design using the actual prototype and a video presentation in front of industry leaders. From those oral presentations, the champion will be crowned! Good luck!

Metrics:

- The packaged circuit not the full product must be less than 15 cm³ and less than 0.5 kg in weight.
- No breadboarding of circuit – must be actual functioning package
- Must withstand short exposure (24 hrs) to high temperature (150C), and to humidity (60C, 85%RH)
- Must withstand a drop of 1 m
- Must avoid obstacles on a track

Judging Criteria:

Size and Weight of Packaged Circuit
Successful Completion of the Metrics
Time needed to successfully complete the course

Timeline:

Call for Papers and Registration: December 16, 2022
Design Phase and White Paper: January 13, 2023
White Paper Judging: January 16-27, 2023
Prototyping, Testing, and Presentation Preparation: January 30 – March 10, 2023
DPC: March 13-16, 2023

Call for Sponsors

IMAPS is starting a student packaging competition to expand the possibilities of package design using additive manufacturing. In this design challenge, teams will design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba. The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below. All packaging components, except the devices, should be additively manufactured.

In order to make this competition a reality, we are looking for sponsors for the following items: