Device Packaging Conference
Conference Chairs
General Chair:
Prasad Dhond, Amkor Technology
General Chair-Elect:
Nokibul Islam, JCET Group
Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Featuring 3 Technical Tracks and an Interactive Poster Session
Click Here to Submit an Abstract or PDC | Deadline September 1, 2021
Heterogeneous
3D Integration
Fan-Out, Wafer Level Packaging & Flip Chip
Automotive, 5G & Next Gen Applications
Interactive
Poster Session
Professional Development Courses (PDCs)
DPC 2022 will offer supplementary classroom style education in the form of two-hour short courses taught by industry leaders.
Sponsors & Exhibitors
Packages and opportunities coming soon!
Hotel & Booking Information
We-Ko-Pa Resort & Conference Center
Fountain Hills, Arizona
IMAPS Room Block - Booking link coming soon*
Click here to take a Virtual Tour of the newly renovated resort!
- CASINO - RECREATION - SPA - GOLF -
