Device Packaging Conference

17th International Conference and Exhibition on

DEVICE PACKAGING


April 12-15, 2021
Now An IMAPS Virtual Conference


IMPORTANT EVENT NOTICE!
Device Packaging 2021 will now be delivered virtually! IMAPS is welcoming the news of this change with an extended abstract submission deadline of December 18th. Corporate partnership opportunities will be shared soon. Click here to learn more about the shift to a virtual conference.




Conference and Technical Workshops
April 13-15, 2021
Exhibition and Technology Showcase
April 13-14, 2021
Professional Development Courses
April 12, 2021
GBC Plenary Session
April 14, 2021


Conference Chairs

General Chair:
Eric Huenger, DuPont Electronic and Imaging

General Chair-Elect:
Prasad Dhond, Amkor Technology

Past General Chairs:
Rama Puligadda, Brewer Science
Jon Aday, Illumina

Submit an Abstract
or PDC Proposal
 


Abstract & PDC Deadline Now: DECEMBER 18, 2020



2021 Conference Overview:

The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Click here to view highlights from DPC 2020.

Participate in the Program: Submit an Abstract

Abstract topical areas have been announced! Submit abstracts according to tracks and session areas below.

Fan-Out, Wafer Level Packaging & Flip Chip

Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Applications
View Full Track Details

The 2021 abstract submission topics and abstract submission portal is now live. Submit your abstracts online today!

Abstract & PDC Deadline Now: DECEMBER 18, 2020



What to Expect

The Device Packaging Conference packs a punch with four days of programming. Attendees can expect:

  • A hit keynote speaker lineup and more than 60 session speakers across 3 technical tracks
  • A full slate of professional development courses from the industry's best instructors
  • The most popular poster session of the year 
  • A Global Business Council session featuring speakers from across the industry
  • An evening panel session


Professional Development Courses

DPC 2021 will offer supplementary classroom-style education in the form of two-hour short courses taught by industry leaders. Expect more than ten PDC courses when the lineup is announced in early winter.

Interested in teaching a course? Course proposals can be submitted online.

Sponsorship and Exhibitor Opportunities

The Device Packaging exhibition and sponsorship opportunities are some of our most popular on the entire IMAPS calendar! Stay tuned for a corporate partnership prospectus release in late December 2020. The full sponsorship menu, commitment timeline, and pricing will be announced in the prospectus.