Device Packaging Conference
Eric Huenger, DuPont Electronic and Imaging
Prasad Dhond, Amkor Technology
Past General Chairs:
Rama Puligadda, Brewer Science
Jon Aday, Amkor Technology
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
PROGRAM AT A GLANCE
Monday - Thursday | April 12 - 15, 2021
Professional Development Courses (PDCs)
2-Hour Courses Led by Industry Professionals
Tuesday - Thursday | April 13 - 15, 2021
Full Conference | Presentations | Panels | Partner Profiles | Round Rooms
New LIVE Content Each Day!
Monday, April 12
4 Course Options
Tuesday, April 13
Technical Panel Session
Wednesday, April 14
GBC Plenary Session
iNEMI 5G Invited Session
Thursday, April 15
Industry-sponsored Panel on 5G
3 Technology Track Round Rooms
(3D, FOWLP/FC, Automotive)
A Hit LIVE Keynote Speaker Lineup
Seung Wook Yoon
Dr. Brij Singh
Dr. Scott Johnson
Live Technical Panel Discussion
Tuesday, April 13, 2021 | 3:00PM - 4:30PM EST
ELECTRONICS INDUSTRY SUPPLY CHAIN: IS IT BROKEN?
Chair and Moderator: E. Jan Vardaman, TechSearch International, Inc.
Ivor Barber, AMD - Corporate VP Packaging
Veer Dhandapani, NXP Semiconductors - Sr. Director Automotive Package Innovation
Devan Iyer, Technology Management - Educator and Executive Advisor
Rebeca Jimenez, Amkor Technology - Corporate Vice President, Advanced SiP Business Unit
Paul Mescher, Microsoft - Senior Director IC Packaging Technology
Demand for electronic products and services remain strong. Work-from-home, video conferencing, and remote learning are driving datacenter growth and laptop and tablet demand. 5G infrastructure rollout is underway and smartphone sales are returning to normal levels. Automotive sales are increasing. At the same time the industry is experiencing acute shortages of 200mm fab capacity, components, equipment such as wire bonders, substrates, and leadframes. Is the supply chain broken and what can we do to resolve these issues?
Led by Moderator: Eric Gongora
Global Director, Semiconductor Product Market MacDermid Alpha
Meet the Experts – Virtual Happy Hour
A MacDermid Alpha hosted event!
Tuesday, April 13, 2021 | 5:00PM - 6:30PM EST
Grab your favorite beverage and virtually meet our industry experts and discuss any questions you may have regarding your semiconductor processes. A brief presentation highlighting our latest offerings from our Alpha, Kester, Compugraphics and MacDermid Enthone brand, will be presented, followed by a Q&A session. Click here for complete information.
Interested parties please contact Deanna Cullen – Deanna.Cullen@MacDermidAlpha.com
Virtual Global Business Council (GBC) Live Plenary Session
Wednesday, April 14, 2021 | 11AM - 2PM EST
Friends in HI Places...
Enabling the Transition to Heterogeneous Integration
Advancements in substrates and interconnection will be a key requirement in enabling heterogeneous integration (HI) and the gap between device IO or pad densities and substrate interconnect capabilities is expanding. Substrate technology must transition towards the levels of scaling that the semiconductor industry continues to demonstrate which will require both high levels of innovation and investment.
The industry has been addressing these issues and the urgency for new technologies, solutions and supply chains. These have been highlighted due to ABF and advanced substrate supply shortages. This has created major issues for the industry and the cost / availability and yields for the most advanced fcBGA substrates has become a critical issue. As these applications transition to HI, the substrate size and density requirements can pose major obstacles.
This Live Virtual Session will Feature 5 Expert GBC Speakers:
Bill Chen, ASE Group
Bryan Black, AMD
John Lau, Unimicron Technology Corp.
Jan Vardaman, TechSearch International
Santosh Kumar, Yole
Live iNEMI Invited Session
Wednesday, April 14, 2021 | 3PM - 5:45PM EST
5G Electronics Challenges: High Frequency Materials Characterization
Next-generation 5G communications solutions require ultra-low loss laminate materials and PCBs/substrates for efficient design and manufacturing. However, these materials pose challenges. For example, there is no consistent methodology for measuring transmission loss or Df/Dk, especially for higher frequencies (e.g., >30 GHz). Many different approaches are currently used, requiring different fixtures and test methods, sample preparation, and/or data analysis/extraction. In response, iNEMI members organized the 5G/mmWave Materials Assessment and Characterization project to develop guidelines and best practices for a standardized measurement and test methodology that can be shared with industry and relevant standards organizations.
This session will provide 5 presentations:
Urmi Ray, iNEMI | Challenges for High Dk/Df Measurements
Richard Stephenson, EMD Electronics | Benchmarking Resonator based Low Dk/Df Material Measurements
Magorzata Celuch & Marzena Olszewska-Placha , QWED | Recent Developments of Resonator Measurements for Emerging Materials and Technologies
Nathan Orloff, NIST | High Frequency Measurements Using Wafer Level Techniques
Say Phommakesone, Keysight | Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements
Live Industry-Sponsored Panel
Thursday, April 15, 2021 | 1PM - 3PM EST
5G MATERIALS Roadmap : Industry Voices
Moderator: Urmi Ray, iNEMI, Experienced Semiconductor Consultant
A partner representative will participate in a moderated interactive panel connecting attendees with supply chain solutions and highlights of key technologies their organization can solve.
Brewer Science | Dongshun Bai
"Innovation in materials for overcoming technology challenges for heterogenous integration of 5G devices"
MacDermid Alpha | Jim Watkowski
"Copper Adhesion Promotion for 5G"
EMD Electronics | Richard Stephenson
"Connection Digital Living"
Live Technology Track Round Rooms | Tech Brainstorm / Q&A
Thursday, April 15, 2021 | 3:15PM - 6:45PM EST
Ask the 3D Experts
3:15pm - 4:15pm
Mike Kelly | Amkor Technology
- Dave Hiner, Amkor Technology
- Max Min, Samsung
- John Park, Cadence
- Wolfgang Sauter, Marvell
Ask the Fan-out & Flip Chip Experts
4:30pm - 5:30pm
Curtis Zwenger | Amkor Technology
Nokibul Islam | JCET Group
- Craig Bishop, Deca
- Rameen Hadizadeh, Cirrus logic
- Amy Lujan, SavanSys
- Luke Prenger, Brewer Science
- Philip Tyler, Veeco
Ask the Automotive Packaging Experts
5:45pm - 6:45pm
Tu-Ahn Tran | NXP
Vik Chaundhry | Amkor Technology
- Ken Araujo, NAMICS
- Burton Carpenter, NXP
- Nokibul Islam, JCET Group
- Ajay Kumar Sattu, Amkor Technology
- Jerry Wu, Dexerials
What to Expect
At the 2021 DPC Virtual Conference, attendees can expect...
Recorded technical presentations will be available for on-demand viewing through the Virtual Conference Portal starting April 12
In cased you missed anything ... the Portal will remain open for up to 30 days!
Fo-WLP/ Flip Chip
Automotive / 5G
A hit LIVE keynote speaker lineup:
- Seung Wook Yoon, Samsung Electronics
- Ram Viswanath, Intel Corporation
- Thorsten Meyer, Infineon Technologies
Dr. Brij Singh, Mark Chaney and Dr. Scott Johnson, John Deere Co.
Panel Discussions & Invited Sessions
- A LIVE Global Business Council plenary session featuring speakers from across the industry on: Friends in HI Places Enabling the Transition to Heterogeneous Integration
- A LIVE technical panel session moderated by Jan Vardaman, TechSearch International, on: ELECTRONICS INDUSTRY SUPPLY CHAIN: IS IT BROKEN?
- A LIVE iNEMI Invited Session on: 5G Electronics Challenges: High Frequency Materials Characterization
- An ALL NEW LIVE Industry-Sponsored Panel Discussion on: 5G MATERIALS CHARACTERIZATION/TEST CHALLENGES -- Sponsor Seats Still Available!
A full slate of 7 LIVE professional development courses from the industry's best instructors
Supplemental two-hour classroom-style tutorials with a narrow educational focus
Professional Development Courses
DPC 2021 will offer supplementary classroom-style education in the form of two-hour short courses taught by industry leaders virtually.
The new and improved DPC 2021 Corporate Partnership Guide is now available! Early commitments are already flooding in. Download the guide to review the partnership opportunities and secure your involvement now. Click here to learn more...
NEW! Would you like to visit the Corporate Partners without registering for the entire conference?
Now you can register for a complimentary Partner Profile Only Badge!
This $0 badge will give you access to the Partner Profiles and ability to communicate with them via the chat.
This does not include access to the presentations or any technical content.