Device Packaging Conference

17th International Conference and Exhibition on


March 1-4, 2021
WekoPa Resort
Fountain Hills, Arizona USA

Conference and Technical Workshops
March 2-4, 2021
Exhibition and Technology Showcase
March 2-3, 2021
Professional Development Courses
March 1, 2021
GBC Plenary Session
March 3, 2021

Conference Chairs

General Chair:
Eric Huenger, DuPont Electronic and Imaging

General Chair-Elect:
Prasad Dhond, Amkor Technology

Past General Chairs:
Rama Puligadda, Brewer Science
Jon Aday, Illumina

Submit an Abstract or PDC Proposal 

2021 Conference Overview:

The 17th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 1-4, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Click here to view highlights from DPC 2020.

Participate in the Program: Submit an Abstract

Abstract topical areas will be announced very soon. The 2020 conference featured presentations from the following topic areas. Tracks, sessions, poster presentation topics are subject to change for 2021. 

3D Integration

  • Application & Design
  • Technology - Organic & Silicon Based 3D
  • Technology - 3D Silicon and Glass
  • Bonding and Metrology
  • Application & Design
  • Technology - Organic & Silicon Based 3D
  • Technology - 3D Silicon and Glass
  • Bonding and Metrology


Fan-Out, Wafer Level Packaging & Flip Chip

  • Challenges in FOWLP
  • Advances in Process, Materials, and Equipment for FOWLP
  • Packaging Advances in High Performance Compute
  • Novel Concepts in Fan-Out & Wafer Level Packaging

Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Applications

  • Automotive Packaging Trends
  • Automotive and 5G SiPs
  • Next Gen Application Solutions
  • Next Gen Applications

The 2021 abstract submission topics and abstract submission portal is now live. Submit your abstracts online today!

What to Expect

The Device Packaging Conference packs a punch with four days of programming in a magnificent desert mountain setting. Attendees can expect:

  • A hit keynote speaker lineup and more than 60 session speakers across 3 technical tracks
  • A full slate of professional development courses from the industry's best instructors
  • The most popular poster session of the year - an outdoor happy hour under the desert sunset!
  • A Global Business Council session featuring speakers from across the industry
  • An evening panel session
  • Two days of networking opportunities with 65+ exhibitors on our show floor

Check back often for updates!


Professional Development Courses

DPC 2021 will offer supplementary classroom-style education in the form of two-hour short courses taught by industry leaders. Expect more than ten PDC courses when the lineup is announced in late fall.

Interested in teaching a course? Course proposals can be submitted online.

Sponsorship and Exhibitor Opportunities

The Device Packaging exhibition and sponsorship opportunities are some of our most popular on the entire IMAPS calendar! Sponsorship commitments are accepted year round. Stay tuned for a sponsor and exhibitor prospectus release in early fall 2020. The full sponsorship menu, exhibitor commitment timeline, and pricing will be announced in the prospectus.