Executive Council

IMAPS 2021-2022 Executive Council

The Executive Council is the primary leadership arm of IMAPS, composed of elected volunteers from within the Society. Executive Council members are voted into leadership by IMAPS members and carry a two-year term. 




Dr. Beth Keser
Intel Corporation

San Diego, CA, United States


Ms. Erica Folk
Manager of MMIC and FRIC Design, 
Northrop Grumman
Baltimore, MD, United States

Past President

Mr. Richard Rice
Sr. VP of Business Development,
ASE US, Inc.

Dallas, TX, United States

VP of Technology

Mr. Jon G. Aday
VP, Advanced Packaging Technology Integration,

Amkor Technology
San Diego, CA, United States

VP of Marketing

Mr. Jim Haley
Management Team, EMD Electronics
San Diego, CA, United States


Dr. Daniel S. Krueger
Engineer Fellow,
Honeywell Federal Manufacturing & Technologies

Kansas City, MO, United States


Mr. Eric Huenger
Plating on Plastics Product Manager, DuPont Electronic & Imaging
Seaford, NY, United States


Dr. Douglas C. Hopkins
NCSU Packaging Research in Electronic Energy Systems (PREES)

Raleigh, NC, United States

Dr. Patrick McCluskey
Professor of Mechanical Engineering
Design and Systems, Reliability Division Leader,
University of Maryland,
College Park, United States

Mr. Mark Gerber
Senior Director of Engineering  & Technical Marketing
ASE US, Inc.

Dallas, TX, United States


Mr. Chris Scanlan
Senior Vice President Technology

Steinhausen, Switzerland

Dr. Zhenzhen (Jenny) Shen
Research Engineer,
Facebook Reality Lab

Mr. Curtis Zwenger

VP, Advanced Package Development & Technology Integration,
Amkor Technology

Tempe, AZ, United States



Mr. Brian Schieman
Executive Director,
International Microelectronics Assembly and Packaging Society (IMAPS)

Research Triangle Park, NC, United States