Executive Council

IMAPS 2020-2021 Executive Council

The Executive Council is the primary leadership arm of IMAPS, composed of elected volunteers from within the Society. Executive Council members are voted into leadership by IMAPS members and carry a two-year term. 




Mr. Richard Rice
Sr. VP of Business Development,
ASE US, Inc.

Dallas, TX, United States

President Elect

Dr. Beth Keser
Intel Corporation

San Diego, CA, United States

Past President

Mr. Ron Huemoeller
Nano Circuit Technologies

Phoenix, AZ, United States

VP of Technology

Mr. Jon G. Aday
VP, Advanced Packaging Technology Integration,

Amkor Technology
San Diego, CA, United States

VP of Marketing

Ms. Adrienne Gerard
Marketing and Business Development,
Finetech, Inc.

Gilbert, AZ, United States


Mr. Michael T. Gervais
Vice President,
Geib Refining Corporation

Warwick, RI, United States


Dr. Daniel S. Krueger
Engineer Fellow,
Honeywell Federal Manufacturing & Technologies

Kansas City, MO, United States


Dr. Douglas C. Hopkins
NCSU Packaging Research in Electronic Energy Systems (PREES)

Raleigh, NC, United States

Dr. Urmi Ray
San Diego, CA, United States

Mr. Curtis Zwenger

VP, Advanced Package Development & Technology Integration,
Amkor Technology

Tempe, AZ, United States

Dr. Patrick McCluskey
Professor of Mechanical Engineering
Design and Systems, Reliability Division Leader,
University of Maryland,
College Park, United States

Dr. Zhenzhen (Jenny) Shen
Research Engineer,
Facebook Reality Lab

Seattle, WA, United States


Mr. Brian Schieman
Executive Director,
International Microelectronics Assembly and Packaging Society (IMAPS)

Research Triangle Park, NC, United States