Raleigh, NC | May 27, 2021
IMAPS Appoints New Executive Director
The International Microelectronics Assembly and Packaging Society (IMAPS) today announced that its Executive Council has appointed Brian Schieman as its new Executive Director, effective June 1, 2021. He will succeed Michael O’Donoghue, who will retire on June 30, 2021, and will work with Brian until then to ensure the leadership transition is seamless.
Brian has served IMAPS for over two decades, and within his current role as Director of Program Development and Technology, he has demonstrated a strong track record while managing a myriad of programs as well as all the technical content of the society, said Rich Rice, President of IMAPS. Given the depth and breadth of his experience, Brian is uniquely equipped to lead and handle the affairs of the society at a very exciting time in the evolution of the microelectronics industry.
Since joining IMAPS in 2000, I have enjoyed many relationships formed with our corporate partners, speakers, volunteers, and members worldwide, said Schieman. I look forward to great opportunities ahead for the Society and collaborating closely with leadership to create even more value for our members. I particularly appreciate the support of Rich Rice, Beth Keser, and the entire Executive Council of IMAPS, and wish to express sincere gratitude to Michael O’Donoghue for his long service to the organization.
Under his leadership, Michael adeptly guided IMAPS through the transfer of the headquarters from Washington, DC to Raleigh, NC, while expertly navigating it through some challenging times in the industry. Michael has also been instrumental in expanding IMAPS events while maintaining a solid financial footing, including the IMAPS Foundation that primarily supports and encourages student technical research.
The board and I deeply appreciate Michael for his leadership and significant contributions over the past sixteen years, continued Rice. He leaves IMAPS in a very strong position at time when our industry is being lauded for its unprecedented innovation and tremendous value. We thank Michael for his dedication and service and wish him the very best on his retirement.
Over the sixteen years I have served as Executive Director of IMAPS, I have experienced significant changes across both the semiconductor and packaging industries, said O’Donoghue. I am proud of the progress and accomplishments achieved by the Society throughout my tenure. But most of all, I am grateful for the warm friendships and professional camaraderie I have experienced and hope to continue these relationships into the future.
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history. For more information, visit www.imaps.org or contact firstname.lastname@example.org.