HiTEC - April 18-20

International Conference and Exhibition on

High Temperature Electronics (HiTEC)


April 18-20, 2023

Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE,

Albuquerque, NM 87109 USA

Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!

Last call to submit your Abstracts - submission form closing soon

General Co-Chairs:
F. Patrick McCluskey, University of Maryland
Colin Johnston, Oxford University

Technical Committee:
Linda del Castillo, NASA JPL | Brianna Klein, Sandia National Labs. | Emad Andarawis, GE Global Research | David Shaddock, GE Global Research | Liangyu Chen, Ohio Aerospace Institute/NASA | Holger Kappert, Fraunhofer IMS | Andy Longford, PandA Europe | Samjid Mannan, King's College London | Steve Riches, Tribus-D Ltd 

Overview:  HiTEC 2023 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2023 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Abstracts being requested include the following topics:

  • Applications:
    • Geothermal
    • Oil well logging
    • Automotive
    • Military/aerospace
    • Space
  • Device Technologies:
    • Si, SOI
    • SiC
    • Diamond
    • GaN
    • AlN
    • Contacts
    • Dielectrics
  •  MEMS and Sensors:
    • Vibration
    • Pressure
    • Seismic
  • Packaging:
    • Materials
    • Processing
    • Solders/Brazes
    • Substrates
    • Wire Bonding
    • Flip Chip
    • Insulation
    • Thermal management
  •  Circuits:
    • Analog
    • Digital
    • Power
    • Wireless
    • Mixed Signal
  • Energy Sources:
    • Batteries
    • Nuclear
    • Fuel Cells
    • Passives:
      • Resistors
      • Inductors
      • Capacitors
      • Oscillators
      • Connectors
    •  Reliability & Modeling:
      • AI Machine Learning
      • Failure mechanisms
      • Co-Design
      • Prognostics & Health Management

Those wishing to present at the HiTEC Conference must submit a ~250 word abstract immediately using the online submission form at: www.imaps.org/hitec. A optional Final Manuscript of 4-8pages, two-column format is due February 15, 2023, for all accepted abstracts. Please contact Brian Schieman by email at bschieman@imaps.org if you have questions. A Proceedings DOWNLOAD containing the conference papers will be distributed to all attendees during the Conference. Speakers are required to pay a reduced registration fee.

Abstracts Deadline: December 15, 2022 - Submission Software Closing Soon
Notice of Acceptance: January 6, 2023


There will be a joint tabletop exhibition featuring companies from the HiTEC, CICMT and Power Packaging Conferences and extensive networking opportunities with the attendees from each Conference. There will be 30 total tabletops available at this conference, and the space is expected to sell out quickly. For companies wishing for broader exposure and additional benefits, we have a variety of sponsorships available with a range of options and price points. These spots are also very limited for this event. View the exhibit/sponsor prospectus. When you are ready book reserve your space, you can use the online registration or contact bschieman@imaps.org if you need assistance or a custom package. 



Early registration discounts end March 24, 2023. Registration for the conferences includes access to technical sessions across all 3 conferences (HiTEC, CICMT, Power), so attendees can attend any sessions or speakers they wish at this event. The only additional fee is for add-on professional development courses which will be held Monday, April 17 before the full technical conferences begin Tuesday. All registrants also have access to visit the exhibit hall, participate in breakfasts, lunches and breaks and other networking activities, as noted in the program. 

Registration TypeEarly (thru Mar. 24)After Mar. 24
Tabletop Exhibit (includes 1 six-foot tabletop, with 1 booth personnel or full  badge; additional discounted full badges at $500/person or booth personnel at $150/person)$900 member
$1050 nonmember
$1000 member
$1150 nonmember
Premier Sponsorship (includes 2 six-foot tabletops, with 2 full badges and 2 exhibit badges, advertisements, flyer or giveaway distributed to attendees, additional discounted full badges at $500/person or booth personnel at $150/person)$6000$6000
HiTEC Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)$3000$3000
CICMT Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)$3000$3000
Power Packaging Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)$3000$3000
Coffee Break Sponsorship (includes logo recognition and signage, discounted full badges at $500/person)
Professional Development Courses (PDCs announced soon - each course is an additional fee, per course per person - this is in addition to the regular conference registration)$325$425


IMAPS has arranged for a discounted hotel block at the:

Albuquerque Marriott Pyramid North
5151 San Francisco Road NE
Albuquerque, New Mexico 87109

$179 USD/night + taxes and fees (single/double)

Marriott online reservation link

Hotel block closes APRIL 10 and will not be extended

Marriott Pyramid North

Just 10 miles from the ABQ airport

Albuquerque, New Mexico