HiTEC - April 18-20

International Conference and Exhibition on

High Temperature Electronics (HiTEC)

www.imaps.org/hitec

April 18-20, 2023

Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE,

Albuquerque, NM 87109 USA

A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!

Abstract Deadline:  October 14, 2022

General Co-Chairs:
F. Patrick McCluskey, University of Maryland
Colin Johnston, Oxford University

Technical Committee:
Linda del Castillo, NASA JPL | Brianna Klein, Sandia National Labs. | Emad Andarawis, GE Global Research | David Shaddock, GE Global Research | Liangyu Chen, Ohio Aerospace Institute/NASA | Holger Kappert, Fraunhofer IMS | Andy Longford, PandA Europe | Samjid Mannan, King's College London | Steve Riches, Tribus-D Ltd | others?

Overview:  HiTEC 2023 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2023 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Abstracts being requested include the following topics:

  • Applications:
    • Geothermal
    • Oil well logging
    • Automotive
    • Military/aerospace
    • Space
  • Device Technologies:
    • Si, SOI
    • SiC
    • Diamond
    • GaN
    • AlN
    • Contacts
    • Dielectrics
  •  MEMS and Sensors:
    • Vibration
    • Pressure
    • Seismic
  • Packaging:
    • Materials
    • Processing
    • Solders/Brazes
    • Substrates
    • Wire Bonding
    • Flip Chip
    • Insulation
    • Thermal management
  •  Circuits:
    • Analog
    • Digital
    • Power
    • Wireless
    • Mixed Signal
  • Energy Sources:
    • Batteries
    • Nuclear
    • Fuel Cells
    • Passives:
      • Resistors
      • Inductors
      • Capacitors
      • Oscillators
      • Connectors
    •  Reliability & Modeling:
      • AI Machine Learning
      • Failure mechanisms
      • Co-Design
      • Prognostics & Health Management

Those wishing to present at the HiTEC Conference must submit a ~250 word abstract electronically no later OCTOBER 14, 2022, using the online submission form at: www.imaps.org/hitec. A optional Final Manuscript of 4-8pages, two-column format is due February 15, 2023, for all accepted abstracts. Please contact Brian Schieman by email at bschieman@imaps.org if you have questions. A Proceedings DOWNLOAD containing the conference papers will be distributed to all attendees during the Conference. Speakers are required to pay a reduced registration fee.

Abstracts Deadline: October 14, 2022
Notice of Acceptance: December 1, 2022