HiTEC - April 18-20
International Conference and Exhibition on
High Temperature Electronics (HiTEC)
April 18-20, 2023
Albuquerque, NM 87109 USA
A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!
General Co-Chairs:
F. Patrick McCluskey, University of Maryland
Colin Johnston, Oxford University
Technical Committee:
Linda del Castillo, NASA JPL | Brianna Klein, Sandia National Labs. | Emad Andarawis, GE Global Research | David Shaddock, GE Global Research | Liangyu Chen, Ohio Aerospace Institute/NASA | Holger Kappert, Fraunhofer IMS | Andy Longford, PandA Europe | Samjid Mannan, King's College London | Steve Riches, Tribus-D Ltd
KEYNOTE SPEAKERS
All Attendees/Conferences Keynotes
HIGH RELIABILITY ELECTRONICS FOR DEMANDING AIRCRAFT & HYPERSONICS APPLICATIONS
(Tues. April 18, 8:30am)
Roger Brewer, Lockheed Martin
TBD (Tues. April 18, 9:15am)
Jerome Teysseyre, onsemi
DoD INTERESTS IN HIGH TEMPERATURE ELECTRONICS (Tues. April 18, 10:45am)
Eric Forsythe, US Army Research Laboratory
ALTERNATIVE PoF-BASED ACCELETED TESTING METHODS (Tues. April 18, 11:30am)
Professor Khatibi
PROFESSIONAL DEVELOPMENT COURSES
Attendees must register for each course as an add-on to their overall symposium registration at $325 each for early registration or $425 after March 24. Attendees may select up to one course in each time slot.
Make sure to review your preferred course's date and time slot before registration. Course fees are non-refundable.
Monday, April 17, 2023
- 11:00AM-1:00PM
- PDC1: ADDITIVE MANUFACTURING FUNDAMENTALS WITH APPLICATIONS TO CHIP PACKAGING
Brian English, Engenius Micro
- PDC1: ADDITIVE MANUFACTURING FUNDAMENTALS WITH APPLICATIONS TO CHIP PACKAGING
- 1:30PM-3:30PM
- PDC2: FUNDAMENTALS OF HIGH TEMPERATURE ELECTRONICS
Patrick McCluskey, University of Maryland
- PDC2: FUNDAMENTALS OF HIGH TEMPERATURE ELECTRONICS
- 4:00PM-6:00PM
- PDC3: PACKAGING AND INTEGRATION OF WIDE-BANDGAP POWER SEMICONDUCTORS
Christina DiMarino, Virginia Polytechnic and State University
- PDC3: PACKAGING AND INTEGRATION OF WIDE-BANDGAP POWER SEMICONDUCTORS
TECHNICAL PRESENTATIONS
Overview: HiTEC 2023 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2023 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.
Below are the topics being presented for each of the three conferences. Attendees are welcome to attend any session for any conference.
A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!
HIGH TEMPERATURE ELECTRONICS CONFERENCE (HiTEC)
- Passive Devices
- Active Devices and Circuits
- Packaging for High Temp
- Attach & Interconnection
- High Temperature Power Electronics (Joint Session with APPE)
ADVANCED PACKAGING FOR POWER ELECTRONICS CONFERENCE (APPE)
- WBG Package Design and Reliability
- Modeling and Simulation
- Assembly and Thermal Solutions
- Hybrid and Multichip Packages (Joint Session with CICMT)
- High Temperature Power Electronics (Joint Session with HiTEC)
CERAMIC INTERCONNECT AND CERAMIC MICROSYSTEMS TECHNOLOGIES CONFERENCE (CICMT)
- Advanced Manufacturing Technologies
- Emerging Materials
- RF and Microwave Applications
- Hybrid and Multichip Packages (Joint Session with APPE)
EXHIBITORS & SPONSORS
There will be a joint tabletop exhibition featuring companies from the HiTEC, CICMT and Power Packaging Conferences and extensive networking opportunities with the attendees from each Conference. There will be 30 total tabletops available at this conference, and the space is expected to sell out quickly. For companies wishing for broader exposure and additional benefits, we have a variety of sponsorships available with a range of options and price points. These spots are also very limited for this event. View the exhibit/sponsor prospectus. When you are ready book reserve your space, you can use the online registration or contact bschieman@imaps.org if you need assistance or a custom package.
Thank you to the HiTEC Conference Sponsors: | |
 |  |
Be Sure to visit all of the tabletop exhibitors at HiTEC, CICMT and Power Packaging during exhibit hours on April 18 & 19:
Haiku Tech, Inc.
Henkel Corporation -- POWER CONFERENCE SPONSOR
Heraeus Electronics
Materion Corporation -- HiTEC CONFERENCE SPONSOR
NTK Technologies, Inc.
Presidio Components -- HiTEC CONFERENCE SPONSOR
Q-Tech Corp.
StratEdge Corporation
Torrey Hills Technologies, LLC
Universal Instruments
Win Source Electronic Technology limited
Zestron Americas
REGISTRATION
Early registration discounts end March 24, 2023. Registration for the conferences includes access to technical sessions across all 3 conferences (HiTEC, CICMT, Power), so attendees can attend any sessions or speakers they wish at this event. The only additional fee is for add-on professional development courses which will be held Monday, April 17 before the full technical conferences begin Tuesday. All registrants also have access to visit the exhibit hall, participate in breakfasts, lunches and breaks and other networking activities, as noted in the program.
| Registration Type | Early (thru Mar. 24) | After Mar. 24 |
| Member | $825 | $925 |
| Nonmember | $1025 | $1125 |
| Speaker/Chair | $595 | $745 |
| Student | $150 | $300 |
| Tabletop Exhibit (includes 1 six-foot tabletop, with 1 booth personnel or full badge; additional discounted full badges at $500/person or booth personnel at $150/person) | $900 member $1050 nonmember | $1000 member $1150 nonmember |
| Premier Sponsorship (includes 2 six-foot tabletops, with 2 full badges and 2 exhibit badges, advertisements, flyer or giveaway distributed to attendees, additional discounted full badges at $500/person or booth personnel at $150/person) | $6000 | $6000 |
| HiTEC Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person) | $3000 | $3000 |
| CICMT Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person) | $3000 | $3000 |
| Power Packaging Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person) | $3000 | $3000 |
| Coffee Break Sponsorship (includes logo recognition and signage, discounted full badges at $500/person) | $1500 | $1500 |
| Professional Development Courses (PDCs announced soon - each course is an additional fee, per course per person - this is in addition to the regular conference registration) | $325 | $425 |
HOTEL RESERVATIONS
IMAPS has arranged for a discounted hotel block at the:
Albuquerque Marriott Pyramid North
5151 San Francisco Road NE
Albuquerque, New Mexico 87109
$179 USD/night + taxes and fees (single/double)
Hotel block closes APRIL 10 and will not be extended
Just 10 miles from the ABQ airport
