HiTEN 2022
International Conference and Exhibition on
High Temperature Electronics Network
(HiTEN 2022)
July 18-20, 2022
St. Anne’s College in the University of Oxford
Oxford, United Kingdom

Conference Chairs:
Colin Johnston | F. Patrick McCluskey |
Organizing Committee: | |
HiTEN Conference Focus:
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.
Thank you to our HiTEN Sponsor:

MONDAY, 18 JULY
7:30am-5:00pm | Registration Open (Marquee Quad) |
8:00am-8:45am | Breakfast (Dining Hall) Breakfast - provided by the College for those staying overnight only. |
10:00am-4:30pm | Exhibits Open (when not in session) (Marquee Quad) |
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8:45am-9:00am | Opening Remarks: Conference Chair – Colin Johnston, Oxford University (All Sessions in Mary Ogilvie Lecture Hall) |
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SESSION 1 | Special Session: Sensor Systems for Harsh Environments |
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9:00am-9:45am | KEYNOTE: SENSOR SYSTEMS FOR EXTREMELY HARSH ENVIRONMENTS |
9:45am-10:15am | A novel assembly and interconnection approach for electronics in harsh environments within the Fraunhofer lighthouse project Malte Spanier, Fraunhofer IZM |
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10:15am-11:00am | Morning Coffee/Tea Break in the Exhibit Area (Marquee Quad) |
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11:00am-11:30am | Performance and reliability of Multilayer Ceramic sensor solutions for on-turbine measurements |
11:30am-12:00pm | CMUT sensors for targeted applications in high temperature borehole imaging |
12:00pm-12:30pm | High Temperature Inertial Navigation Sensors, Electronics and Packaging for reliable 300C Operation Emad Andarawis, GE Global Research |
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12:30pm-2:00pm | Lunch Break Networking with Exhibitors & Lunch served at 1pm (Dining Hall) |
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SESSION 2 | SOLDERS AND BRAZES |
2:00pm-2:45pm | KEYNOTE: MODELING AND SIMULATION FOR PACKAGING IN HARSH ENVIRONMENTS |
2:45pm-3:15pm | Unveiling High Performance Solder Alloys for Automotive Applications Alan Plant, MacDermid Alpha Electronics Solutions (Pritha Choudhury) |
3:15pm-3:45pm | Composite soldering materials for high-temperature stable solder joints Mathias Nowottnick, University of Rostock (Andrej Novikov) |
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3:45pm-4:30pm | Afternoon Coffee/Tea Break in the Exhibit Area (Marquee Quad) |
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4:30pm- 5:00pm | A Drop-in High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications Hongwen Zhang, Indium Corporation |
5:00pm-5:30pm | Development of brazing alloy as high-temperature interconnection filler assisted by self-propagating exothermic reaction Canyu Liu, Loughborough University |
5:30pm-6:00pm | Location dependent down-rating of voids in high power solder connections for automotive power modules Bettina Ottinger, Vitesco Technologies Germany GmbH |
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Dinner not provided - Opportunity to visit Oxford for Dinner & Networking! |
TUESDAY, 19 JULY
7:30am-5:00pm | Registration Open (Marquee Quad) |
8:00am-8:45am | Breakfast (Dining Hall) Breakfast - provided by the College for those staying overnight only. |
10:00am-4:30pm | Exhibits Open (when not in session) (Marquee Quad) |
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8:45am-9:00am | Day 2 Opening Remarks: Conference Chair – F. Patrick McCluskey University of Maryland (All Sessions in Mary Ogilvie Lecture Hall) |
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SESSION 3 | DEVICES |
9:00am-9:45am | KEYNOTE: DIAMOND ELECTRONICS AND RELATED WIDEBAND GAP SEMICONDUCTORS FOR HIGH TEMPERATURE APPLICATIONS |
9:45am-10:15am | AlGaN High Electron Mobility Transistor for High Temperature Logic Brianna Klein, Sandia National Laboratories |
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10:15am-11:00am | Morning Coffee/Tea Break in the Exhibit Area (Marquee Quad) |
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11:00am-11:30am | Extended Lifetime Testing of SiC CMOS Electronics at 500C Emad Andarawis, GE Global Research |
11:30am-12:00pm | High Temperature Operation of Beta-Ga2O3 MOSFETs Ahmad Islam, Air Force Research Laboratory |
12:00pm-12:30pm | Recent Trends in High Reliability Timing and Frequency Control Devices for Extreme Environment Applications |
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12:30pm-2:00pm | Lunch Break Networking with Exhibitors & Lunch served at 1pm (Dining Hall) |
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SESSION 4 | PASSIVES and SUBSTRATES |
2:00pm-2:45pm | KEYNOTE: Capacitor Solutions for Harsh Environment Applications [150C – 260C] |
2:45pm-3:15pm | Characteristics of Practical CTE-Matched Composites for Electronics Thermal Management: Newest Materials, Comparative |
3:15pm-3:45pm | Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate |
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3:45pm-4:30pm | Afternoon Coffee/Tea Break in the Exhibit area (Marquee Quad) |
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4:30pm-5:00pm | Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment App |
5:00pm-5:30pm | Investigation of Adhesion between Additively Manufactured Planar Transformer Windings and Ceramic Substrates |
5:30pm-6:00pm | Direct Write Extreme Environment Packaging David Shaddock, GE Global Research |
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Dinner not provided - Opportunity to visit Oxford for Dinner & Networking! |
WEDNESDAY, 20 JULY
7:30am-3:00pm | Registration Open (Marquee Quad) |
8:00am-8:45am | Breakfast (Dining Hall) Breakfast - provided by the College for those staying overnight only. |
NO EXHIBITS TODAY | |
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8:45am-9:00am | Day 3 Opening Remarks: Conference Chair – Colin Johnston, Oxford University (All Sessions in Mary Ogilvie Lecture Hall) |
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SESSION 5 | DEVICES and APPLICATIONS |
9:00am-9:45am | KEYNOTE: TRENDS TO ADVANCED PACKAGING FOR POWER ELECTRONICS (NASA Keynote moved to Wednesday afternoon) |
9:45am-10:15am | Extreme Environment Electronics for Venus Linda del Castillo, NASA Jet Propulsion Laboratory |
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10:15am-11:00am | Morning Coffee/Tea Break |
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11:00am-11:30am | Designs of Ultra-HPHT Electrical Component Packages for Downhole and Geothermal Wellbore Logging Tool Integrations Hua Xia, Hermetic Solutions Group |
11:30am-12:00pm | AlScN-on-SiC Diaphragm Multimode Micromechanical Resonators for High-Temperature Sensing Applications |
12:00pm-12:30pm | Investigation of using BSPT for ring-dot piezoelectric transformers for use in high-temperature resonant power supplies Jack Forrester, University of Sheffield |
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12:30pm-1:30pm | Lunch Break (Dining Hall) |
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SESSION 6 | PACKAGING and INTERCONNECTION |
1:30pm-2:15pm | KEYNOTE: AN OVERVIEW OF HIGH TEMPERATURE TECHNOLOGIES FOR VENUS SURFACE EXPLORATION (PandA Keynote moved to Wednesday morning) |
2:15pm-2:45pm | Application and Behavior of Gallium Nitride Field Effect Transistors in High and Extreme Temperatures |
2:45pm-3:15pm | In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature Electronics |
3:15pm-3:45pm | 'Green' Chemistry for Protection of High Temperature (> 250C) Electronics Jochen Schuermans, ROARTIS |
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3:45pm-4:00pm | CLOSING REMARKS Wrap up and Plans for HiTEC 2023 |
Registration Information: (Early Registration Deadline: June 17, 2022)
Delegate, Speaker/Chair, and Student registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and a download of the Proceedings Papers. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.
Type | Early Fee Through 6/17/22 | Advance/Onsite Fee After 6/17/22 |
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Delegate (Member/Non-Member) | $795 USD | $895 USD |
Speaker/Chair | $595 USD | $695 USD |
Student | $225 USD | $350 USD |
Tabletop Exhibit (IMAPS Member) 16 Tabletop Spots Available | $750 USD | $850 USD |
Tabletop Exhibit (Non-Member) 16 Tabletop Spots Available | $850 USD | $950 USD |
Premier Sponsorship (Includes Tabletop - Limit 4) Includes 1 tabletop, 2 session badges, 2 exhibit personnel badges with meals, and advertisements | $3500 USD | $3500 USD |
Corporate Sponsorship (Includes Tabletop - Limit 8) Includes 1 tabletop, 1 session badge, and 1 exhibit personnel badge with meals | $2000 USD | $2000 USD |
Sleeping rooms will be available right at the event venue at St. Anne’s College in the University of Oxford, Woodstock Road, Oxford, OX2 6HS, UK. IMAPS has negotiated a block of rooms with St. Anne's and they are available to our attendees at a discounted group rate - instructions and fees below.
PREPARING FOR YOUR TRIP TO HITEN AT ST. ANNE'S:
Travel Tips coming from Heathrow and Gatwick Airports: St. Anne's would recommend the Airline Bus which goes direct from both Heathrow and Gatwick to Gloucester Green Bus Station in Oxford, we are about a 15 minute walk from the bus station. You could also get a train from both Heathrow Airport and Gatwick Airport to Oxford Train station, we are about a 20 minute walk (or 5 minute taxi) from the station.
Driving to St. Anne's? IMAPS receives a very limited number of parking spaces at St Anne‘s. You will need to request a parking pass from bschieman@imaps.org. Alternatively, there is the Gloucester Green car park, again a 15 minute walk away from here or there is the Peartree Park and Ride or the Oxford Parkway Park and Ride and you can get a bus which drops you directly outside the college.
Checking in at St. Anne's: There is no latest time for check-in as the lodge is manned 24 hours a day. They do have walk-rounds late at night so generally speaking if the arrival is after 10pm it’s useful for us to know an approximate arrival time in order to plan.
Exhibitors Shipping Materials: Any deliveries should be made as close to the start date of the event as possible as St. Anne's has limited storage and should be addressed in the following way:
FAO Kate Harris
HiTEN 2022 REF 35058
St Anne’s College
56 Woodstock Road
Oxford OX2 6HS UK
Finding the HiTEN Meeting at St. Anne's: The breakfasts will be held in the Dining Hall. Registration, coffee/tea, lunches and the exhibit tables will all be held in the Marquee (Quad). All conference sessions (speaker presentations) will be held in the Mary Ogilvie Lecture Theatre (Building C, is in its own building attached to the Claire Palley). View a map of the college here.
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The bedrooms are now online for our guests to book and pay directly. Please use the following link to book:
Book your B&B (with Promotional Code) - St Anne's College, Oxford
Where it asks for the promotional/event code please ask them to type HIGHT35058 before selecting the arrival and departure date.
Single Ensuite Bed & Breakfast - 102.00pound per night + fees
Comfortable single ensuite rooms are situated in the Claire Palley, Trenaman House and Ruth Deech Buildings which are on the main site within close proximity of the Hall. Each room contains a hospitality tray, toiletries and towels. Rooms are serviced by the Housekeeping staff on a daily basis between 10.00am and 12 noon. Ground floor rooms are available in all blocks. Private bathroom & Internet Wifi.
Twin Ensuite Bed & Breakfast - 156.00pound per night + fees
Pleasant twin bedded rooms with ensuite. Twin ensuite accommodation can be found in Trenaman House and Claire Palley buildings, some on the ground floor. Please note only twin bedded rooms are available, not doubles. Each room contains a hospitality tray, towels and toiletries. Rooms are serviced by our Housekeeping staff between 10.00am and 12 noon each day. Private bathroom & Internet Wifi.
Cancellations
100% refund before 03 July 2022, minus 10.00 admin fee. Cancellations made after 03 July 2022 will be charged 25%-100% of the room fees, plus the admin fee, depending on the exact date of cancellations - see full cancellation policy through St. Anne's.
Be sure to visit our exhibitors during HiTEN 2022 Oxford:
Presidio Components - SPONSOR
Frequency Management International
IMAPS UK Chapter
Metalor Technologies
Roartis
UniTemp GmbH
SPEAKER INFORMATION
All speakers are required to pay a reduced registration fee. If your abstract is selected, you will be asked to follow the speaker timeline: - Speaker Acceptance Email (May 17, 2022); - Final Manuscript due for Proceedings (June 30, 2022); - Speaker Registration complete (June 15, 2022); - Speaker Sleeping Room Reservation complete (June 15, 2022);- BIO Submitted (July 1, 2022); Slides/Presentation for session presentation (on/before July 17, 2022); and - Slides/Presentation file to distribute to registrants post-conference (on/before July 25, 2022).
The HiTEN Proceedings papers will be ARCHIVED into IMAPS online research portal/library, IMAPSource® - www.imapsource.org. IMAPSource® currently features all of IMAPS proceedings, journal papers, magazines, and other conference publications back to 2010. This portal is a fully searchable, user and Google Scholar-friendly database. The software allows for fully exportable citations, improved keyword and Boolean search functionality and customizable alerts, among many other features. The library is indexed by Google Scholar and many key scientific engines/indexes, and growing each day. Please visit www.imapsource.org and search. HiTEC/HiTEN Proceedings can be found in our conference section: http://www.imapsource.org/loi/apap.
IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of HiTEN 2022. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best event in July and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Conference are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all. Speakers that cannot attend to present in person will have virtual options for delivering their technical presentations at HiTEN.