IMAPS 2020 Society Award Winners
Congratulations to the IMAPS 2020 Society Award Winners!
Brian is a long time staff member of IMAPS, and has become well known to membership and conference organizers for his incredible support and coordination of the events and programs. Specifically in this last year, Brian did his usual excellent job of supporting and organizing key events, as well as leading the IMAPS staff, for DPC, Symposium and others. But what demonstrated Brian‘s value to the society was the leadership and effort he put into development of IMAPS‘ online presence, leading definition of key areas to focus our efforts, and then working with vendors to create flexible tools for a partial or full virtual event. Brian did all of this with a can-do attitude in an incredibly uncertain environment with overall event planning.
Curtis is currently finishing up his 3 year commitment of contributing to the IMAPS Symposium as General Chair Elect (2018), General Chair (2019), and Past General Chair (2020), all of which he supported with leadership excellence. Recently, Curtis has accepted a Director role on the IMAPS Executive Council, and his eager contributions, positive attitude, and thoughtful follow up in the area of fostering young professional membership have already been noticed by the EC. It is for all of these reasons that I would like to recognize Curtis Zwenger with the IMAPS President’s Award for 2020.
Daniel C. Hughes, Jr. Award
Professor Subramanian Iyer
Subramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering Department at the University of California at Los Angeles. He is Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS). Prior to that he was an IBM Fellow. His key technical contributions have been the development of the world‘s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. He also was among the first to commercialize bonded SOI for CMOS applications through a start-up called SiBond LLC. More recently, he has been exploring new packaging paradigms and device innovations that they may enable wafer-scale architectures, in-memory analog compute and medical engineering applications. He has published over 300 papers and holds over 75 patents. He has received several outstanding technical achievements and corporate awards at IBM. He is an IEEE Fellow, an APS Fellow and a Distinguished Lecturer of the IEEE EDS and EPS and a member of the Board of Governors of IEEE EPS. He is also a Fellow of the National Academy of Inventors. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012.
Ashman - Wagnon Tehcnical Achievement Award
Professor Chuan Seng Tan
Chuan Seng Tan is a Professor of Electronic Engineering at the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore. He received his PhD from MIT in 2006. He works on 3D packaging and integration.
He is a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) since 2019. He is a senior member of IEEE and a recipient of the Exceptional Technical Achievement Award from the IEEE Electronics Packaging Society (EPS) in 2019. Beginning June 2019, he is a Distinguished Lecturer with IEEE-EPS.
Lifetime Achievement Award
Sam Forman has contributed to IMAPS/ISHM since its founding (original ISHM founding member) and for over 62 years as IMAPS Founder, 1967, Life Member, Charter Member, Fellow of the Society, Daniel C. Hughes Award, Chapter President Texas and supported the IMAPS chapters in NY Metro, NM, NC, and in the Texas Dallas chapter for over 50 years... and has been in the microelectronic technology for over 62 years. His Thick Film career started in 1958 and progressed to Surface Mount by trimming leads from devices and attaching to substrates in 1960. Sam is still active in the North Texas Chapter of IMAPS and is presently 1st Past President
Sidney J. Stein International Award
Susan C. Trulli
Susan Trulli is a Senior Engineering Fellow in the Advanced Microelectronics Solutions department of Raytheon Missiles and Defense Systems and has over forty years of experience in microwave microelectronics for defense, space and commercial applications. Susan is currently on the Advisory Council of the International Microelectronics Assembly and Packaging Society (IMAPS) after serving seventeen years on the Executive Council completing her first past presidency in 2019 and has chaired numerous IMAPS advanced technology workshops in RF and Microwave Packaging. Susan is the recipient of Raytheon‘s highest technical achievement award, the Thomas K. Phillips Award for Excellence in Technology, the IMAPS President‘s Award and most recently the Society for Women Engineers Patent Recognition Award. She is currently focused on GaN packaging solutions for high reliability, high power microwave systems, including principal investigator for Embedded Die for High Power Microwave Applications through NextFlex. Susan has presented many papers on microwave module design and materials and holds patents in this area as well as in the area of plasma applicator materials and construction.
Fellow of the Society Award
Mr. Chan received his B.S. in Mechanical Engineering in 1981 and M.S. in Engineering Science in 1987 from Rensselaer Polytechnic Institute. Mr. Chan had a diverse career with IBM for 22 years in the areas of Process Engineer, Design Engineer and Development Engineer. At IBM he was an Advisory Engineer in the Connector Development group responsible for developing custom connectors used in I, P and Z series mainframes for IBM. He was also the lead mechanical engineer for the development of the first 10Gbps x 12 optical transceiver in IBM. In the last 4 years at IBM, he was a taskforce lead managing members around the world responsible for correcting problems with LGA connectors for Z series systems as well as the 10K RPM hard drives for IBM.
After IBM, he was with Endicott Interconnect Technologies for 12 years as a Chief Scientist. At EIT, he was the principle investigator for the DARPA Terabus III program, responsible for the design and build of a flexible optical waveguide capable of 25Gbps per channel with 48 channels interconnecting 2 hybrid optical modules. For a large DoD project, he provided all packaging options to dense pack the maximum number of processing elements into a given space, he also provided thermal solutions to support a 72KW cabinet.
Mr. Chan is currently the Associate Director for the Integrated Electronics Engineering Center at Binghamton University, this center is a NY State Center for Advanced Technology and has a mission to work with companies to understand their use of electronics to improve their business by understanding the design, reliability and failures of their products.
Mr. Chan holds 54 Patents in the fields of electronic packaging and advanced Connectors. He has 18 published papers in the fields of electronic packaging and connectors (ECTC, iMAPS, Photonics Journal, Fleck Research).
Mr. Chan is the president of the Empire Chapter of iMAPS. He has been the track chair for the IMAPS national symposium from 2016-2020 for the Advanced Process and Materials (Enabling Technologies) track.
He is the chair of the Emerging Technologies Committee for ECTC and a member of IEEE EPS. He was just appointed the Committee Chair for the IEEE EPS Technical Committee for Emerging Technologies. He is on the TWG for the IEEE EPS Heterogeneous Integration Roadmap for Single / Multichip, MEMS and Mobile working groups.
Fellow of the Society Award
Habib Hichri joined Ajinomoto Fine-Techno Corporation USA (AFT USA) on August 2020 as Senior Fellow, Global Applications and Business Development. Prior to joining AFT USA, Habib was Director of Applications Engineering at SUSS Microtec USA for the last 7 years where I have provided patterning solutions for advanced semiconductors packaging customers. Before joining SUSS MicroTec, Habib spend about 12 years with IBM Semiconductors Research and Development Center in East Fishkil, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to management positions within IBM on process development in lithography and Dry Reactive Ion Etch in the front end of line area for microprocessor fabrication. Prior to joining IBM, Habib was a senior research engineer responsible for design, develop, scale up and commissioning/startup of specialty chemicals products production at Occidental Chemical Corporation, in Buffalo NY. Habib holds over 40 U.S. patents and authored over 40 publications and presentations. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France and an MBA degree from the State University of New York at Buffalo. Habib is currently the president of the OC IMAPS chapter and treasurer of the OC IEEE chapter. He is also a member of the technical committees of ECTC, IMAPS and IWLPC. He is the general chair of IMPAS 2020.
Emerging Leader Award
Dr Kumar’s role at BRIDG is to identify innovation on semiconductor platforms and manage the technology programs driven by the next generation intelligent and connected electronic devices. Before taking the responsibility at BRIDG, Dr Kumar was an adjunct faculty at University of Central Florida appointed by Advanced Materials Processing and Analysis Centre.
He has also worked extensively on developing robust hydrogen sensors, in form of MEMS device, utilizing nanosize morphology of doped tin oxide, for extreme sensing environment (low temperature and high humidity). He has over 36 publications in high impact factor journals and several presentations at international conferences. He also serves as a reviewer for several journals.
Dr. Kumar holds a Bachelor’s and Master’s degree in Metallurgical and Materials Engineering from Indian Institute of Technology, Kharagpur. He received his Ph.D. in Materials Engineering from University of Central Florida.
IMAPS Leadership Award
Rozalia Beica is currently the CSO of Semiconductor Division, leading the semiconductor and module activities within AT&S. Prior to AT&S she had several executive and C-level roles with various organizations across the supply chain: electronic materials (Rohm and Haas Electronic Materials, Dow & DuPont), equipment (Semitool, Applied Materials and Lam Research), device manufacturing (Maxim IC) and market research & strategy consulting firm (Yole Developpement).
Rozalia is actively involved in various industry activities. Some of the current engagements include: Member of the Board of Governors for IEEE Electronics Packaging Society and Vice General Chair of 71th ECTC, Chair of the Heterogeneous Integration Roadmap WLP Technical Working Group, Chair of the Semi Strategic Materials Conference, Technical Chair of System in Package China Symposium, Advisory Board Member 3DinCites and IMPACT Taiwan. Past activities include Program Director of EMC3D consortia activities focused on 3D IC integration, General Chair Global Semi & Electronics Forum, Technical Advisory Board Member SRC, several other memberships in industry committees.
Rozalia has also been very supportive and actively involved with IMAPS activities, including General Chair IMAPS DPC, Technical Chair IMAPS SiP and more recently, as the IMAPS VP of Technology. Rozalia has over 150 presentations & publications, including 3 book chapters on 3D Integration.
Rozalia has a M.Sc in Chemical Engineering (Romania), a M. Sc. In Management of Technology (USA) and a Global Executive MBA from IE Business School (Spain).