IMAPS 2022 Society Award Winners
Congratulations to the IMAPS 2022 Society Award Winners!
Emerging Leadership Award
Sanketh Buggaveeti is a Principal Engineer at Infinera where he leads the design of cutting-edge photonic modules with industry leading levels of mechanical, electrical, thermal, and optical integration. Since his joining in 2015, Mr. Buggaveeti has helped Infinera develop and commercialize optical module packaging technology ranging from 200Gbps/wave to 800Gbps/wave. He is an integral part of teams designing optical systems that have received 5 "Most Innovative Product" industry awards, set over 10 performance records, and supported some of the largest telecommunication networks around the world. Mr. Buggaveeti has authored/co-authored 19 journal and conference papers and contributes as a peer reviewer for 7 International Journals in the fields of microsystems, opto-mechanics, and systems engineering. In addition to representing Infinera at conferences such as OFC, IMAPS, IEEE iTherm, he serves as a mentor to recent graduate hires within the design team. In 2021, Mr. Buggaveeti was recognized by the U.S. Government in 2021 as an "Outstanding Researcher" for his contributions in the field of "Packaging and Integration of Microsystems".
Mr. Buggaveeti holds a BTech in Mechanical Engineering from Vellore Institute of Technology (India), MS in Mechanical Engineering from the University of Michigan, and is currently pursuing a Distance Learning MS in Electrical and Computer Engineering from Georgia Institute of Technology. Mr. Buggaveeti attended the University of Michigan as a KC Mahindra Scholar and held a Graduate Research Assistantship at the Micro System Techology and Sciences Lab.
Harvey Smith's introduction to microelectronic packaging and assembly was with not-so-micro ceramic-metal housings for Power Diodes, Thyristors, & SCRs followed by Microwave then Millimeter Wave Diodes & Transistors and Mil-Aero Assemblies, early Integrated Circuits and, eventually, Semiconductor Lasers, LEDs and photonic circuits. His membership in ISHM began in 1978 and later, IEPS. Harvey has been a Manufacturer's Representative and active committee member of the ISHM/iMAPS New England Chapter since 1988. He was New England Chapter President during the ISHM/IEPS merger. He served as Publicity Chair of the IMAPS 2000 International Symposium Committee, is an IMAPS Fellow, Life Member and recipient of the iMAPS New England George Hanow Award.
Tim Olson is the founder and CEO of Deca Technologies, a widely recognized leader in advanced packaging technology including M-Series, the industry’s highest volume fan-out technology as well as Adaptive Patterning, the innovative design-during-manufacturing system which eliminates fixed glass photomasks allowing uniquely optimized designs for every device in real-time.
Tim’s establishment of Deca follows a history of innovation spanning four decades. Early in his career at Motorola Semiconductor, Tim led the creation of the PRISM CEO model factory where powerful new capabilities were introduced to the industry which are still in widespread use today including two-dimensional codes (2D codes) enabling individual device tracking & traceability adopted from NASA as well as strip-based final electrical test (commonly known as strip-test) allowing leadframe or laminate products to enjoy test productivity breakthroughs typically reserved for wafer probing.
Venturing out from his global R&D leadership position at Amkor Technology, Tim founded Deca in late 2009 with a vision to transform the way the world creates advanced electronic systems. From his advisory board position with Cypress Semiconductor, Tim brought the idea to Silicon Valley legend TJ Rodgers, CEO of Cypress, who was excited to provide Deca’s original startup funding in conjunction with SunPower, a solar power technology leader.
Within two years, Deca had qualified its first wafer level packaging production customer and established world class operations in the Philippines. Soon after introduction of the unique M-Series™ fan-out and breakthrough Adaptive Patterning™ technologies, major investments were received from ASE and Qualcomm supporting significant capacity growth to over 450 employees, propelling Deca onto the world stage.
Through a recent transition to an independent technology provider, Deca’s reach continues to expand throughout the semiconductor industry with multiple licensee partners including ASE, nepes and SkyWater Technology. Deca’s M-Series has become the #1 fan-out technology in the industry with over 4.5 million products currently shipping per day.
Growing up in central Minnesota, Tim has always enjoyed watersports and other outdoor activities. Tim graduated magna cum laude from the University of North Dakota with dual bachelor’s degrees in mechanical engineering and engineering management. Tim holds over two dozen issued United States patents relating to packaging, software, equipment, process and design.
Corporate Recognition Award
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Sidney J. Stein International Award
Steve Muckett is a British citizen resident in Italy and Jamaica.
He graduated with a BSc degree in Metallurgy & Materials Science at University of Wales in 1976. Steve started his professional career at International Tin Research Institute, London active in the field of Soldering Technology. That was followed in 1984 by 9 years at ESL responsible for sales and marketing of thick film materials.
During 1993 Steve founded Mozaik Technology Ventures which had a focus on microelectronics materials and equipment and business opportunities within Eastern Europe.
At the present time Steve also performs a consultancy role for Fraunhofer IKTS, Dresden in the field of very fine line thick film materials on ceramic substrates and ceramic tapes . He also has a sales & technical role for Technic Inc (USA) to sell and support precious metal powder & flake customers in Europe and also acts for Honeystone Ltd in UK as Overseas Manager for turnkey microelectronics projects worldwide.
Steve Muckett has been a Committee Chairman of IMAPS UK during two terms (once when it was ISHM UK Chapter and once after name change to IMAPS) and is currently a Life member and Trustee of IMAPS UK.
Outstanding Educator Award
Dr. Rao Tummala was Fellow and Director of Advanced Packaging Lab at IBM for 25 years. He pioneered the Industry's first Plasma Display and first LTCC with 100 chips.
He has 28 years as Distinguished & Chair Professor at Georgia Tech. He is the Founding Director of the first and only NSF Engineering Research Center in packaging in U.S. pioneering System on Package vision. He created a model at Georgia Tech for a very large and successful global industry consortium. He has educated 10,000 engineers in more than 20 different packaging courses. He had graduated 900 Ph.D & MS packaging engineers to supply almost all electronic companies in the United States.
Dr. Tummala was named Father of Modern Packaging by IEEE and created the IEEE Rao Tummala Electronic Packaging Award, which is a technical field award. He has written over 800 papers and 7 textbooks, and hold over 100 US patents. He is a member of National Academy of Engineering in the U.S. and India, a Fellow of IEEE and a member of IMAPS. He served as President of IEEE CPMT from 2000-2004 and President of IMAPS from 1998-2000.
Fellow of the Society Award
Liangyu Chen received his M.S. and Pd.D. degrees in experimental solid-state physics from Case Western Reserve University, and his B.S. degree in electronics/physics from Fudan University, P.R. China. Currently, he is a Senior Scientist at Ohio Aerospace Institute/NASA GRC in Cleveland, Ohio. His major research interests include materials, structures, process, and testing of packaging technologies for silicon carbide electronics and sensors for applications in high temperature harsh environment. He has been working with collaborators at NASA GRC, ceramics industries, and universities to develop an electronic packaging system primarily for 500 C operation.
Fellow of the Society Award and President's Award
Urmi Ray is the CTO of Saras Micro Devices and is responsible for driving the technical strategy and roadmapping and customer vision of Saras. She also leads 5G/mmWave projects and strategy at iNEMI,. She is an experienced semiconductor professional with over 25 years of experience working with industry organizations such as IMAPS, SEMI, JEDEC and others on driving advanced packaging and integration strategies. She has worked at JCET Group focusing on advanced system in package (SIP) technologies and Qualcomm as the technology and program lead in several forward-looking programs in 3D and 2.5D and system integration, with particular focus on low-cost packaging for mobile industry. She joined Qualcomm in 2006, after spending 10+ years at Lucent Technologies Bell Laboratories in NJ working on advanced materials and reliability for a diverse set of product portfolios, including consumer products and high reliability telecommunications projects. She has a PhD from Columbia University (New York City).
Fellow of the Society Award
Paul Van Loan
Dr. Paul Van Loan Was born in Toronto, Canada, and received his BA in Geological Sciences and MA in Mineralogy/Crystallography at University of Toronto. He then earned his Ph.D. in X-Ray Crystallography from McGill University in Montreal.
He has written approximately 20 papers on diverse subjects ranging from Abrasives/Refractories to Electrically Conducting Oxides to LCD's.
Dr. Van Loan became a member of ISHM in 1958, just the second year of the organization's existence. He was IMAPS Chair in 2000 and received the IMAPS Award for Scientific Excellence.
William D. Ashman - John A. Wagnon
Technical Achievement Award
Jianbiao (John) Pan
Dr. Jianbiao John Pan is Professor and Chair in the Department of Manufacturing Systems Engineering and Management at California State University Northridge (CSUN). Prior to joining CSUN, he was the DEI student success faculty fellow in the College of Engineering and a professor in the Department of Industrial and Manufacturing Engineering (IME) at California Polytechnic State University (Cal Poly), San Luis Obispo, CA. Prior to joining Cal Poly, he worked at the optoelectronics center of Lucent Technologies/Agere Systems as a member of technical staff. He received a Ph.D. degree in Industrial Engineering from Lehigh University, Bethlehem, PA. He is an ASQ-Certified Quality Engineer and an ASQ-Certified Reliability Engineer.
Dr. Pan's research interests lie in materials, process, thermal management, and reliability of microelectronics and electronic packaging, including lead-free soldering, LED packaging, and flexible hybrid electronics. His teaching interests include electronics manufacturing, microelectronics and electronic packaging, statistical data analysis, design and analysis of experiment, quality engineering, and reliability engineering. He has authored or co-authored over 50 technical papers and one book chapter. He has served as a principal or co-principal investigator on research projects funded by the Federal government and industry.
Dr. Pan is a recipient of the Raytheon Excellence in Teaching and Applied Research Award in the College of Engineering at Cal Poly, the Outstanding Educator Award from the International Microelectronics Assembly and Packaging Society (IMAPS), and the M. Eugene Merchant Outstanding Young Manufacturing Engineer Award from the Society of Manufacturing Engineers (SME). He has served as the Editor-in-Chief of Journal of Microelectronics and Electronic Packaging since 2012 and an Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology from 2011 to 2018. He is a Fellow of IMAPS, a senior member of IEEE, a senior member of ASQ, and a senior member of SME. He is an ABET evaluator for the SME.
Daniel C. Hughes, Jr. Memorial Award
Dr. William (Bill) Chen is chief architect for technology strategy, lead mentor, and hands-on engineer for strategy implementation at ASE Group, blazing the trail for packaging innovators and innovation across the electronic industry ecosystem. His strategy portfolio includes SiP, copper wire-bond, 2.5D packaging, & fan-out wafer-level packaging, all game-changing technologies brought to high volume production to address new demands for emerging applications in IoT, cloud computing, autonomous automotive, AI and smart mobility.
Previously, Bill spent over thirty-five years at IBM, where he pioneered the concept and implementation of predictive verified modeling incorporating materials science, micromechanical, and finite element for design and manufacturing benefiting generations of packaging products, from BGAs to mainframe systems.
Bill is a past president of the IEEE Electronics Packaging Society and was the co-chair of the Packaging & Assembly TWG at ITRS until its closure by SIA in 2016. He now chairs the Heterogeneous Integration Roadmap, co-sponsored by three IEEE Societies (EPS, EDS & Photonics) together with SEMI and ASME EPPD. He is the recipient of IEEE Electronics Packaging Technology Field Award and ASME InterPACK Award. Besides being ASE Fellow, he has also been elected IEEE Fellow and ASME Fellow. Living by his motto, Challenge things difficult but worthwhile, Bill hopes to inspire more young engineers to always maintain an enthusiastic attitude while facing challenges, which once overcome, will sustain the prosperity and impact of the semiconductor industry.
Lifetime Achievement Award
Theodore (Ted) Tessier is the Founder and Chief Technologist of Gordian Semiconductor Packaging Solutions, a subsidiary of Gordian International LLC located in Gilbert, Arizona, a semiconductor packaging consulting and international engineering management firm. He has worked in advanced packaging technologies throughout his career in areas including Flip Chip Bumping and Cu Pillar Bumping and Assembly, High Density PWB technologies, Fan-In & Fan-Out WLP & PLP technologies and more recently in Hybrid Bonding and Heterogeneous Integration.
He managed global engineering organizations for more than 30 years with a track record of driving technology development and deployment into overseas OSAT locations and leading New Product Introductions. Ted has published and co-published more than 150 conference papers and journal publications, has 15 patents issued in a wide array of advanced packaging areas and has been active in ISHM and IMAPS conferences and workshops throughout his whole career.
Ted graduated with a BSc. Degree in Biochemistry from Laurentian University, Sudbury Ontario, Canada and a Master’s degree in Applied Polymer Chemistry from the University of Ottawa, Ottawa, Ontario, Canada.