IMAPS Symposium 2022 BOSTON
October 4 - 6, 2022
October 4 - 5, 2022
Professional Development Courses
October 3, 2022
The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. This year's Symposium will focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL, and will feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!
The 2022 PDC courses are offered on Monday, October 3, prior to IMAPS 2022. Attendees must register for each course as an add-on to their overall symposium registration. Attendees may select up to one course in each time slot.
Make sure to review your preferred course's time slot before registration. Course fees are $325 each if registered by September 2, 2022 and $425 after September 2. Course fees are non-refundable.
|8:00 am - 10:00 am||PDC AM1: |
Introduction to Fan-Out Wafer Level Packaging (FOWLP) - Beth Keser, Director, Intel Corp.
|PDC AM2: |
Semiconductors in Automotive - Technology Trends and Reliability - Vikas Gupta, ASE & Pradeep Lall, Auburn University
|PDC AM3: Flip Chip Tech - Mark Gerber, ASE US, Inc.|
|10:30 am - 12:30 am||PDC AM4: Chiplet Design and Heterogeneous Integration Packaging - John Lau, Professor, Unimicron Technology Corp.||PDC AM5: Wire Bond Process Development and Optimization - Henri Seppanen, Research Scientist, Kulicke & Soffa Industries||PDC AM6: Chip Packaging Processes and Materials - Syed Ahmad, Director, City of Jamestown, ND|
|1:00 pm - 3:00 pm||PDC PM1: Fan Out for Advanced Packaging Applications - John Hunt, Senior Advisor & Jan Vardaman, President, TechSearch International, Inc.||PDC PM2: System-in-Package (SiP) - System Solutions Through Miniaturization - Mark Gerber, ASE US, Inc.||PDC PM3: Fundamentals of Thermal Management - Rita Mohanty, Sr. Scientific Principal, Henkel Corp.|
|3:30 pm - 5:30 pm||PDC PM4: Polymers for Wafer Level Packaging - Jeffrey Gotro, President, InnoCentrix, LLC||PDC PM5: 3D Flip Chip Package Technology and Assembly Processes - Tom Dory, R&D Manager, Fujifilm Electronic Materials||PDC PM6: Qualification Formalism for Markets Demanding High Quality & Reliability Standards - Shubhada Sahasrabudhe, Principal Engineer, Corporate, Intel Corp.|
The IMAPS 2022 Technical Committee has helped recruit more than 100 speakers around the following track and session topics.
VIEW THE FULL TECHNICAL PROGRAM FEATURING 20 SESSIONS, 12 PDCs, 5 KEYNOTES, POSTERS & PANELS OVER 2.5 DAYS!!
Dongshun Bai, Brewer Science;
Tarak Railkar, Qorvo;
Erica Folk, Northrop Grumman;
Frank Eberle, Northrop Grumman;
Mark Hoffmeyer, IBM;
NEW THIS YEAR
Overview: The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve On-Shore Packaging and Assembly Capabilities on Monday, October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts.
The mission of this workshop is to engage our workforce community to identify solutions, which address US Government and Defense requirements, critical to the onshoring of the microelectronic assembly and packaging supply chain.
The workshop will feature a SHIP keynote speaker and SHIP program speakers, plus several breakout sessions with speakers focused on: Manufacturing, Assembly, Substrates & Materials, Enabling & Disruptive Technologies, Reliability, the Chiplet Ecosystem, and Workforce Development. Confirmed speakers and panelists include:
- SHIP Keynote & Session Speakers:
- Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics
- John Sotir, Intel
- Ted Jones, Qorvo
- The Evolution of Moore's Law through Chipletized Architectures | Tony Trinh, Mercury Systems
- PANEL: Defense Industrial Base Ecosystem
- Helen Phillips, Northrop Grumman
- Additional Panelists Soon
- PANEL: Workforce Development
- John Allgair, GoBridg
Dr Kara Perry, SCALE/Purdue
Jerry Roberson, Northrop Grumman
- John Allgair, GoBridg
- Technical Session Speakers:
- Co-Packaged Optics (CPO) of Silicon Photonics Optical I/O Chiplet | Steve Groothius, Ayar Labs
- When Chips Become Systems | John Park, Cadence
Discounts are available when registering for both the Workshop and IMAPS 2022 Symposium.
Monday, October 3 - 7:00 pm - 8:00 pm
EQUITY vs. EQUALITY IN THE WORKPLACE
Chair: Robin Davis, Deca Technologies
Committee: Erica Folk, Northrop Grumman; Beth Keser, Intel; Dan Krueger, Honeywell; Urmi Ray, iNEMI; Nicole Wongk, Honeywell
This will be a one-hour townhall – open discussion and panel format. Join us for open and lively conversation around many important topics for all to consider in today‘s challenging work environment, including the important differences between equity and equality in the workplace.
Rebeca Jimenez, Amkor Technology - Corporate Vice President, Advanced SiP Business Unit
KT Moore, Cadence Design Systems - VP Corporate Marketing & Business Development
Shelby Nelson, Mosaic Microsystems – Chief Technical Officer
Jean Trewhella, GlobalFoundries - Director of PostFab New Product Introduction
Additional Panelists Announced Soon
Food & Drink Provided
If your abstract is selected, you will be asked to follow the speaker timeline:
Speaker Acceptance/Rejection (June 3, 2022)
First Paper to Peer Review (July 8, 2022)
Peer Review feedback to authors (August 31, 2022)
Final/corrected Papers (September 23, 2022)
Speaker must register before (September 5, 2022)
BIO due (September 14, 2022)
Speaker Breakfast (morning of your session)
Slides/Presentation ready (on/before October 2, 2022)
IMAPS Symposium Student Design Challenge
Call for Submissions
Calling on student teams to expand the possibilities of package design using additive manufacturing. As part of this design challenge you will be asked to design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba. The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below. All packaging components, except the devices, should be additively manufactured.
After an initial registration period, you will be sent detailed scoring criteria and manufacturing constraints. You will need first to prepare a white paper that justifies your design, materials selection, and qualification test plan. This can be done with preliminary multi-physics modeling. The top three papers will be selected for protoype manufacture and testing. These top teams will be supported such that one member can travel to the IMAPS Symposium in Boston in October, where they will defend their design using the actual prototype and a video presentation in front of industry leaders. From those oral presentations, the champion will be crowned! Good luck!
The packaged circuit not the full product must be less than 15 cm3 and less than 0.5 kg in weight.
No breadboarding of circuit – must be actual functioning package
Must withstand short exposure (24 hrs) to high temperature (150C), and to humidity (60C, 85%RH)
Must withstand a drop of 1 m
Must avoid obstacles on a track
Size and Weight of Packaged Circuit
Successful Completion of the Metrics
Time needed to successfully complete the course
Call for Papers and Registration: April 1 – July 15
Design Phase and White Paper: June 1 – July 15
White Paper Judging: July 15 – July 31
Prototyping, Testing, and Presentation Preparation: August 1 – September 30
Symposium: October 3-6, 2002
Call for Sponsors
IMAPS is starting a student packaging competition to expand the possibilities of package design using additive manufacturing. In this design challenge, teams will design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba. The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below. All packaging components, except the devices, should be additively manufactured.
In order to make this competition a reality, we are looking for sponsors for the following items:
Donation of the Arduino’s and components for three teams - $1500
Donation of the Autonomous Vehicle for three teams - $ 2000
Donation of 3D Printing Services to make the packages
Co-Sponsorship of the Awards - $2000
We look forward to your participation in this exciting new event. Email Brian Schieman at email@example.com to become a Student Competition Sponsor.
Hotel reservation deadline: September 2, 2022
Cancellations must be received 3-days (72 hours) prior to confirmed arrival date to avoid penalty fee equal to one night's room and tax.
Booking in the Block
IMAPS sincerely appreciates your support by staying at the Sheraton Boston Hotel. We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants.
Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel
Easily accessible — staying in the host hotel means less travel time and overall convenience
Exhibit/Sponsor Application are now being accepted. The exhibition is now ~70% sold out with only ~30 10x10s still available. Download the exhibit application below and book your space TODAY! Early registration ended May 31, 2022.
CURRENT EXHBITORS AND SPONSORS INCLUDE
|AdTech Ceramics||Hi-Rel Laboratories||Optomec, Inc.|
|AEMTec GmbH||Indium Corp.||PacTech|
|AIM Photonics||Integra Technologies, LLC||PlasmaTreat|
|Ajiomoto Fine-Techno USA Corp.||JCET||Promerus|
Kayaku Advance Materials
Kulicke & Soffa Industries Inc.
|Besi North America, Inc.||Lintec of America, Inc.||Rochester Electronics|
|Binghamton University S3IP||Masimo Semiconductor||Royce Instruments|
Siltronics Solutions Inc.
Stellar Industries Corp.
Metalor Technologies USA
|CWI Technical Sales||MicroAssembly Technologies||Stratus Vision GmbH|
DeWeyl Tool Company
Micro Systems Technologies
|DuPont||MicroScreen, LLC||Technic Engineered Powders|
F & K Delvotec, Inc.
TechSearch International Inc.
Torrey Hills Technologies, LLC
MRSI Systems, Mycronic Group
Haiku Tech, Inc.
Nano OPS, Inc.
Noble Metal Servcies
Henkel AG& Co. KGaA
|Heraeus Electronics||NTK Technologies, Inc.|