IMAPS Symposium 2022 BOSTON

IMAPS Symposium Student Design Challenge

Call for Submissions

Calling on student teams to expand the possibilities of package design using additive manufacturing.  As part of this design challenge you will be asked to design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba.  The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below.  All packaging components, except the devices, should be additively manufactured.            

After an initial registration period, you will be sent detailed scoring criteria and manufacturing constraints.  You will need first to prepare a white paper that justifies your design, materials selection, and qualification test plan.  This can be done with preliminary multi-physics modeling.  The top three papers will be selected for protoype manufacture and testing.  These top teams will be supported such that one member can travel to the IMAPS Symposium in Boston in October, where they will defend their design using the actual prototype and a video presentation in front of industry leaders.  From those oral presentations, the champion will be crowned!  Good luck!

Metrics:

• The packaged circuit not the full product must be less than 15 cm³ and less than 0.5 kg in weight.

• No breadboarding of circuit – must be actual functioning package

• Must withstand short exposure (24 hrs) to high temperature (150C), and to humidity (60C, 85%RH)

• Must withstand a drop of 1 m

• Must avoid obstacles on a track

Judging Criteria:

• Size and Weight of Packaged Circuit

• Successful Completion of the Metrics

• Time needed to successfully complete the course

Timeline:

• Call for Papers and Registration: April 1 – July 15

• Design Phase and White Paper: June 1 – July 15

• White Paper Judging: July 15 – July 31

• Prototyping, Testing, and Presentation Preparation: August 1 – September 30

• Symposium: October 3-6, 2002

   CLICK HERE TO REGISTER FOR STUDENT COMPETITION   

Call for Sponsors

IMAPS is starting a student packaging competition to expand the possibilities of package design using additive manufacturing.  In this design challenge, teams will design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba.  The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below.  All packaging components, except the devices, should be additively manufactured.            

In order to make this competition a reality, we are looking for sponsors for the following items:

1. Donation of the Arduino‘s and components for three teams - $1500

2. Donation of the Autonomous Vehicle for three teams - $ 2000

3. Donation of 3D Printing Services to make the packages

4. Co-Sponsorship of the Awards - $2000

We look forward to your participation in this exciting new event. Email Brian Schieman at bschieman@imaps.org to become a Student Competition Sponsor.

Booking in the Block

IMAPS sincerely appreciates your support by staying at the Sheraton Boston Hotel.  We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants. 

• Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel

• Easily accessible — staying in the host hotel means less travel time and overall convenience

Exhibit/Sponsor Application are now being accepted. Early registration ends May 31, 2022.

IMAPS 2022 Prospectus

IMAPS 2022 Exhibit Application

IMAPS 2022 Sponsor Application

IMAPS 2022 Floorplan

   CURRENT EXHBITORS AND SPONSORS INCLUDE