IMAPS Symposium 2022 BOSTON

IMAPS 2022 Boston


              Conference            
October 4 - 6, 2022

            Exhibition            
October 4 - 5, 2022

 Professional Development Courses 
October 3, 2022

The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!

General Chair:
Sandeep Sane
Intel Corporation


General Chair-elect (2023):
Suresh Jayaraman
Amkor Technology

Past General Chair (2021):
Mak Kulkarni
Texas Instruments 

STILL ACCEPTING LATE ABSTRACTS & PDCs
Closing Soon - Submit Right Away
!

Technical sessions are being planned by track themes, and abstracts will be considered on the topics listed below.



Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work. 



Special Paper Recognition -
Financial Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) Cash Awards
Six "Best of Track" Winners will then be reviewed for...
1 Best Paper of the Symposium - One (1) additional Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students


TECHNICAL PROGRAM TRACKS 
Sessions and technical topics to be organized for IMAPS 2022 Boston

The IMAPS 2022 Technical Committee will be recruiting speakers around the following track and session topics.
This list is subject to change. Please continue to check the website for updates. Additional topics will be considered as well. 

TRACK 1:
SiP/Design/Manufacturing Optimization
TRACK 2:
Wafer Level/Panel Level (Advanced RDL)
TRACK 3:
High Performance / High Reliability
TRACK 4:
Advanced Package (Flip Chip, 2.5D, 3D, Optical)
TRACK 5:
Advanced Process & Materials (Enabling Tech.)

TRACK CHAIRS:

Dongshun Bai, Brewer Science; 
Bora Baloglu, Amkor Technology; 
Fang Luo, Stony Brook Univ.

TRACK CHAIRS:

Tarak Railkar, Qorvo; 
Rey Alvarado, Qualcomm; 
Mohan Kathaperumal, Georgia Tech.

TRACK CHAIRS:

Erica Folk, Northrop Grumman; 
Rajiv Iyer, Medtronic; 
Ivan Ndip, Fraunhofer IZM

TRACK CHAIRS:

Frank Eberle, Northrop Grumman; 
Jaimal Williamson, Texas Instruments; 
Rahul Panat, Carnegie Mellon Univ.

TRACK CHAIRS:

Mark Hoffmeyer, IBM; 
Habib Hichri, Ajinomoto; 
Benson Chan, Binghamton Univ.

PLANNED TOPICS:

• System Architecture, Design, & Integration
• Embedded / High Voltage/  High Density
• Optical
• Automotive Microelectronics
• Wearable Electronics
• Internet of Things (IoT)
• EMI Shielding
• Computing & Networking Package
• CPI & Modeling
• Design for Reliablity/Manufacturing
• PDK Development for Packaging
• System Optimization

PLANNED TOPICS:

• Wafer-level Fan Out / WLCSP
• Advanced Fan Out
• Heterogeneous Integration
• Panel-level Fan Out
• MEMS & Sensors
• Edge Protection
• Carrier Technologies
• Reliability & Test

• Df/Dk Loss Tangent of Dielectrics

PLANNED TOPICS:

• High Reliability in Defense and Aerospace
• High Reliability in Automotive
• Reliability & Test
• MM Wave / High-speed  / High-frequency Packaging
• RF / Wireless Components
• HiRel in Bio/Medical
•HiRel in Extreme Environments
• Signal Integrity
• Power Integrity
• Electromagnetic Compatibility
• Simulation & Design for Reliability

PLANNED TOPICS:

• Large Body / Small Body FC
• 2.5D/3D Technologies
• Optical / Photonics / Waveguides / Lasers
• BUMP & Interconnect
• 3D Technologies
• Advanced Flip Chip
• Heterogeneous Integration
PLANNED TOPICS:

• Substrate Technology
• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond
• Additive Manufacturing
• Flexible & Wearable Electronics
• Solders & Soldering
• Advanced Processing Equipment
• Glass & Ceramic
• Power Applications
• New Thermal & Interconnect Materials
• Via Processes

and the
INTERACTIVE POSTER SESSION - "Posters & Pizza Lunch"


STILL ACCEPTING LATE ABSTRACTS & PDCs
Submit your Abstract(s) IMMEDIATELY


SPEAKER INFORMATION

If your abstract is selected, you will be asked to follow the speaker timeline:

  • Speaker Acceptance/Rejection (May 2, 2022)
  • First Paper to Peer Review (June 1, 2022)
  • Peer Review feedback to authors (June 27, 2022)
  • Final/corrected Papers (August 1, 2022)
  • Speaker must register before (September 5, 2022)
  • BIO due (September 14, 2022)
  • Speaker Breakfast (morning of your session)
  • Slides/Presentation ready (on/before October 2, 2022)


IMAPS Symposium Student Design Challenge

Call for Submissions

Calling on student teams to expand the possibilities of package design using additive manufacturing.  As part of this design challenge you will be asked to design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba.  The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below.  All packaging components, except the devices, should be additively manufactured.            

After an initial registration period, you will be sent detailed scoring criteria and manufacturing constraints.  You will need first to prepare a white paper that justifies your design, materials selection, and qualification test plan.  This can be done with preliminary multi-physics modeling.  The top three papers will be selected for protoype manufacture and testing.  These top teams will be supported such that one member can travel to the IMAPS Symposium in Boston in October, where they will defend their design using the actual prototype and a video presentation in front of industry leaders.  From those oral presentations, the champion will be crowned!  Good luck!

Metrics:

  • The packaged circuit not the full product must be less than 15 cm3 and less than 0.5 kg in weight.
  • No breadboarding of circuit – must be actual functioning package
  • Must withstand short exposure (24 hrs) to high temperature (150C), and to humidity (60C, 85%RH)
  • Must withstand a drop of 1 m
  • Must avoid obstacles on a track

Judging Criteria:

  • Size and Weight of Packaged Circuit
  • Successful Completion of the Metrics
  • Time needed to successfully complete the course

Timeline:

  • Call for Papers and Registration: April 1 – May 31
  • Design Phase and White Paper: June 1 – July 15
  • White Paper Judging: July 15 – July 31
  • Prototyping, Testing, and Presentation Preparation: August 1 – September 30
  • Symposium: October 3-6, 2002

   CLICK HERE TO REGISTER FOR STUDENT COMPETITION   

Call for Sponsors

IMAPS is starting a student packaging competition to expand the possibilities of package design using additive manufacturing.  In this design challenge, teams will design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba.  The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below.  All packaging components, except the devices, should be additively manufactured.            

In order to make this competition a reality, we are looking for sponsors for the following items:

  1. Donation of the Arduino’s and components for three teams - $1500
  2. Donation of the Autonomous Vehicle for three teams - $ 2000
  3. Donation of 3D Printing Services to make the packages
  4. Co-Sponsorship of the Awards - $2000

We look forward to your participation in this exciting new event. Email Brian Schieman at bschieman@imaps.org to become a Student Competition Sponsor.


Sheraton Boston Hotel
39 Dalton Street
Boston, MA 02199 USA

Single/Double: $259/night + taxes and fees

Hotel reservation deadline: September 2, 2022


CANCELLATION POLICY
Cancellations must be received 3-days (72 hours) prior to confirmed arrival date to avoid penalty fee equal to one night's room and tax. 

.

Sheraton Boston Hotel

Booking in the Block

IMAPS sincerely appreciates your support by staying at the Sheraton Boston Hotel.  We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants. 

  • Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel

  • Easily accessible — staying in the host hotel means less travel time and overall convenience




SPONSORS AND EXHIBITORS

Exhibit/Sponsor Application are now being accepted. Early registration ends May 31, 2022.

IMAPS 2022 Prospectus

IMAPS 2022 Exhibit Application

IMAPS 2022 Sponsor Application

   CURRENT EXHBITORS AND SPONSORS INCLUDE   

AI Technology

Hesse Mechatronics

NorCom Systems

ASE Group

Indium Corp.

Optomec, Inc.

ASM

Integra Technologies, LLC

Palomar Technologies

Besi North America, Inc.

JCET

Promerus

BTU International

Kayaku Advance Materials

QP Technologies

Cadence

Kulicke & Soffa Industries Inc.

Remtec, Inc.

CWI Technical Sales

LFG Micro

Royce Instruments

DeWeyl Tool Company

Lintec of America, Inc.

Siltronics Solutions Inc.

Finetech

Materion Corp.

Stellar Industries Corp.

Gel-Pak

Metalor Technologies USA

StratEdge Corp.

Haiku Tech, Inc.

Micro Systems Technologies

Technic Engineered Powders

Heidelberg Instruments

MicroScreen, LLC

TechSearch International Inc.

Henkel AG& Co. KGaA

Mini-Systems, Inc.

Torry Hills Technologies, LLC

Heraeus Electronics

MRSI Systems, Mycronic Group

Universal Instruments