IMAPS Symposium 2022 BOSTON

IMAPS 2022 Boston


              Conference            
October 4 - 6, 2022

            Exhibition            
October 4 - 5, 2022

 Professional Development Courses 
October 3, 2022

The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. This year's Symposium will  focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL, and will feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!

General Chair:
Sandeep Sane
Intel Corporation


General Chair-elect (2023):
Suresh Jayaraman
Amkor Technology

Past General Chair (2021):
Mak Kulkarni
Texas Instruments 


PROFESSIONAL DEVELOPMENT COURSES (PDCs)

The 2022 PDC courses are offered on Monday, October 3, prior to IMAPS 2022. Attendees must register for each course as an add-on to their overall symposium registration. Attendees may select up to one course in each time slot. 

Make sure to review your preferred course's time slot before registration. Course fees are $325 each if registered by September 2, 2022 and $425 after September 2. Course fees are non-refundable.

Click here for detailed information on PDCs.

8:00 am - 10:00 amPDC AM1: 

Introduction to Fan-Out Wafer Level Packaging (FOWLP) Beth Keser, Director, Intel Corp.

PDC AM2:

Semiconductors in Automotive - Technology Trends and Reliability - Vikas Gupta, ASE & Pradeep Lall, Auburn University

PDC AM3: Flip Chip Tech - Mark Gerber, ASE US, Inc.
10:30 am - 12:30 amPDC AM4: Chiplet Design and Heterogeneous Integration Packaging - John Lau, Professor, Unimicron Technology Corp.PDC AM5: Wire Bond Process Development and Optimization - Henri Seppanen, Research Scientist, Kulicke & Soffa IndustriesPDC AM6: Chip Packaging Processes and Materials - Syed Ahmad, Director, City of Jamestown, ND
1:00 pm - 3:00 pmPDC PM1: Fan Out for Advanced Packaging Applications - John Hunt, Senior Advisor & Jan Vardaman, President, TechSearch International, Inc.PDC PM2: System-in-Package (SiP) - System Solutions Through Miniaturization - Mark Gerber, ASE US, Inc.PDC PM3: Fundamentals of Thermal Management - Rita Mohanty, Sr. Scientific Principal, Henkel Corp.
3:30 pm - 5:30 pmPDC PM4: Polymers for Wafer Level Packaging - Jeffrey Gotro, President, InnoCentrixLLCPDC PM5: 3D Flip Chip Package Technology and Assembly Processes - Tom Dory, R&D Manager, Fujifilm Electronic MaterialsPDC PM6: Qualification Formalism for Markets Demanding High Quality & Reliability Standards - Shubhada Sahasrabudhe, Principal Engineer, Corporate, Intel Corp.

KEYNOTE PRESENTATIONS

KEYNOTE: 6G: OPPORTUNITIES AND PACKAGING CHALLENGES
Glenn Daves, NXP Semiconductors
Vice President, Package Innovation

KEYNOTE: ELECTRONIC-PHOTONIC PACKAGE INTEGRATION 
Lionel C. Kimerling, Massachusetts Institute of Technology
Thomas Lord Professor of Materials Science and Engineering
Director, MIT Microphotonics Center

AUTOMOTIVE MEMS: OVERVIEW, DEVELOPMENTS AND INNOVATIONS
Dr. Ando Feyh, robert Bosch GmbH
MEMS Strategy Management, New Business and M&A

TBD
Santosh Kumar

MORE TO COME!

TECHNICAL PROGRAM NOW AVAILABLE!

The IMAPS 2022 Technical Committee has helped recruit more than 100  speakers around the following track and session topics.
VIEW THE FULL TECHNICAL PROGRAM FEATURING 20 SESSIONS, 12 PDCs, 5 KEYNOTES, POSTERS & PANELS OVER 2.5 DAYS!!

TRACK 1:
SiP/Design/Manufacturing Optimization

TRACK 2:
Wafer Level/Panel Level (Advanced RDL)

TRACK 3:
High Performance / High Reliability

TRACK 4:
Advanced Package (Flip Chip, 2.5D, 3D, Optical)

TRACK 5:
Advanced Process & Materials (Enabling Tech.)

TRACK CHAIRS:

Dongshun Bai, Brewer Science; 
Bora Baloglu, Amkor Technology; 
Fang Luo, Stony Brook Univ.

TRACK CHAIRS:

Tarak Railkar, Qorvo; 
Rey Alvarado, Qualcomm; 
Mohan Kathaperumal, Georgia Tech.

TRACK CHAIRS:

Erica Folk, Northrop Grumman; 
Rajiv Iyer, Medtronic; 
Ivan Ndip, Fraunhofer IZM

TRACK CHAIRS:

Frank Eberle, Northrop Grumman; 
Jaimal Williamson, Texas Instruments; 
Rahul Panat, Carnegie Mellon Univ.

TRACK CHAIRS:

Mark Hoffmeyer, IBM; 
Habib Hichri, Ajinomoto; 
Benson Chan, Binghamton Univ.

VIEW THE FULL TECHNICAL PROGRAM

NEW THIS YEAR

IMAPS Advanced Technology Workshop on 
STRATEGIES TO REVITALIZE THE  ON-SHORE PACKAGING

AND ASSEMBLY DEFENSE INDUSTRIAL BASE 

Overview:  The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve On-Shore Packaging and Assembly Capabilities on Monday, October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts. 

The mission of this workshop is to engage our workforce community to identify solutions, which address US Government and Defense requirements, critical to the onshoring of the microelectronic assembly and packaging supply chain.

The workshop will feature a SHIP keynote speaker and SHIP program speakers, plus several breakout sessions with speakers focused on: Manufacturing, Assembly, Substrates & Materials, Enabling & Disruptive Technologies, Reliability, the Chiplet Ecosystem, and Workforce Development. Confirmed speakers and panelists include:

  • SHIP Keynote & Session Speakers:
    • Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics
    • John Sotir, Intel
    • Ted Jones, Qorvo
    • The Evolution of Moore's Law through Chipletized Architectures | Tony Trinh, Mercury Systems
  • PANEL: Defense Industrial Base Ecosystem
    • Helen Phillips, Northrop Grumman
    • Additional Panelists Soon
  • PANEL: Workforce Development
    • John Allgair, GoBridg
      Dr Kara Perry, SCALE/Purdue
      Jerry Roberson, Northrop Grumman
  • Technical Session Speakers:
    • Co-Packaged Optics (CPO) of Silicon Photonics Optical I/O Chiplet | Steve Groothius, Ayar Labs
    • When Chips Become Systems | John Park, Cadence
    • Kyocera 

Discounts are available when registering for both the Workshop and IMAPS 2022 Symposium.

DEI Townhall Discussion and Reception

Monday, October 3 - 7:00 pm - 8:00 pm

EQUITY vs. EQUALITY IN THE WORKPLACE

Chair: Robin Davis, Deca Technologies
Committee: Erica Folk, Northrop Grumman; Beth Keser, Intel; Dan Krueger, Honeywell; Urmi Ray, iNEMI; Nicole Wongk, Honeywell


This will be a one-hour townhall – open discussion and panel format. Join us for open and lively conversation around many important topics for all to consider in today‘s challenging work environment, including the important differences between equity and equality in the workplace.


PANELISTS:

Rebeca Jimenez, Amkor Technology - Corporate Vice President, Advanced SiP Business Unit
KT Moore, Cadence Design Systems - VP Corporate Marketing & Business Development
Shelby Nelson, Mosaic Microsystems – Chief Technical Officer
Jean Trewhella, GlobalFoundries - Director of PostFab New Product Introduction

Additional Panelists Announced Soon


Food & Drink Provided


SPEAKER INFORMATION

If your abstract is selected, you will be asked to follow the speaker timeline:

  • Speaker Acceptance/Rejection (June 3, 2022)

  • First Paper to Peer Review (July 8, 2022)

  • Peer Review feedback to authors (August 31, 2022)

  • Final/corrected Papers (September 23, 2022)

  • Speaker must register before (September 5, 2022)

  • BIO due (September 14, 2022)

  • Speaker Breakfast (morning of your session)

  • Slides/Presentation ready (on/before October 2, 2022)


Special Paper Recognition -
Financial Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) Cash Awards
Six "Best of Track" Winners will then be reviewed for...
1 Best Paper of the Symposium - One (1) additional Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students


IMAPS Symposium Student Design Challenge

Call for Submissions

Calling on student teams to expand the possibilities of package design using additive manufacturing.  As part of this design challenge you will be asked to design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba.  The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below.  All packaging components, except the devices, should be additively manufactured.            

After an initial registration period, you will be sent detailed scoring criteria and manufacturing constraints.  You will need first to prepare a white paper that justifies your design, materials selection, and qualification test plan.  This can be done with preliminary multi-physics modeling.  The top three papers will be selected for protoype manufacture and testing.  These top teams will be supported such that one member can travel to the IMAPS Symposium in Boston in October, where they will defend their design using the actual prototype and a video presentation in front of industry leaders.  From those oral presentations, the champion will be crowned!  Good luck!

Metrics:

  • The packaged circuit not the full product must be less than 15 cm3 and less than 0.5 kg in weight.

  • No breadboarding of circuit – must be actual functioning package

  • Must withstand short exposure (24 hrs) to high temperature (150C), and to humidity (60C, 85%RH)

  • Must withstand a drop of 1 m

  • Must avoid obstacles on a track

Judging Criteria:

  • Size and Weight of Packaged Circuit

  • Successful Completion of the Metrics

  • Time needed to successfully complete the course

Timeline:

  • Call for Papers and Registration: April 1 – July 15

  • Design Phase and White Paper: June 1 – July 15

  • White Paper Judging: July 15 – July 31

  • Prototyping, Testing, and Presentation Preparation: August 1 – September 30

  • Symposium: October 3-6, 2002

   CLICK HERE TO REGISTER FOR STUDENT COMPETITION   

Call for Sponsors

IMAPS is starting a student packaging competition to expand the possibilities of package design using additive manufacturing.  In this design challenge, teams will design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba.  The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below.  All packaging components, except the devices, should be additively manufactured.            

In order to make this competition a reality, we are looking for sponsors for the following items:

  1. Donation of the Arduino’s and components for three teams - $1500

  2. Donation of the Autonomous Vehicle for three teams - $ 2000

  3. Donation of 3D Printing Services to make the packages

  4. Co-Sponsorship of the Awards - $2000

We look forward to your participation in this exciting new event. Email Brian Schieman at bschieman@imaps.org to become a Student Competition Sponsor.

Sheraton Boston Hotel
39 Dalton Street
Boston, MA 02199 USA

Single/Double: $259/night + taxes and fees

Hotel reservation deadline: September 2, 2022


CANCELLATION POLICY
Cancellations must be received 3-days (72 hours) prior to confirmed arrival date to avoid penalty fee equal to one night's room and tax. 

.

Sheraton Boston Hotel

Booking in the Block

IMAPS sincerely appreciates your support by staying at the Sheraton Boston Hotel.  We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants. 

  • Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel

  • Easily accessible — staying in the host hotel means less travel time and overall convenience




SPONSORS AND EXHIBITORS

Exhibit/Sponsor Application are now being accepted. The exhibition is now ~70% sold out with only ~30 10x10s still available. Download the exhibit application below and book your space TODAY! Early registration ended May 31, 2022.

IMAPS 2022 Prospectus

IMAPS 2022 Exhibit Application

IMAPS 2022 Sponsor Application

IMAPS 2022 Floorplan

   CURRENT EXHBITORS AND SPONSORS INCLUDE   

AdTech CeramicsHi-Rel LaboratoriesOptomec, Inc.
AEMTec GmbHIndium Corp.PacTech

AI Technology

Insidix

Palomar Technologies

AIM PhotonicsIntegra Technologies, LLCPlasmaTreat 
Ajiomoto Fine-Techno USA Corp.JCETPromerus

AMETEK

Kayaku Advance Materials

QP Technologies

ASE Group

Kulicke & Soffa Industries Inc.

Remtec, Inc.

ASM

LFG Micro

Riv

Besi North America, Inc.
Lintec of America, Inc.Rochester Electronics
Binghamton University S3IP
Masimo SemiconductorRoyce Instruments

BSET EQ

Materion Corp.

Siltronics Solutions Inc.

BTU International

Metallix Refining

Stellar Industries Corp.

Cadence

Metalor Technologies USA

StratEdge Corp.

CWI Technical Sales
MicroAssembly TechnologiesStratus Vision GmbH

DeWeyl Tool Company

Micro Systems Technologies

Surfx Technologies

DuPont
MicroScreen, LLCTechnic Engineered Powders

F & K Delvotec, Inc.

MIDAS

TechSearch International Inc.

Finetech

Mini-Systems, Inc.

Torrey Hills Technologies, LLC

Gel-Pak

MRSI Systems, Mycronic Group

Tresky Automation

Haiku Tech, Inc.

Nano OPS, Inc.

Universal Instruments

Heidelberg Instruments

Noble Metal Servcies

Xtalic Corp.

Henkel AG& Co. KGaA

NorCom Systems

XYZTEC

Heraeus Electronics
NTK Technologies, Inc.
Hesse Mechatronics


THANK YOU SPONSORS

PREMIER SPONSOR


LUNCH SPONSOR

KEYNOTE SPONSORS





BREAK SPONSOR

DEI SPONSOR

Honeywell

BAG SPONSOR

OFFICIAL INDUSTRY PARTNER


 


OFFICIAL MEDIA PARTNER