International Symposium on Microelectronics
General Chair of IMAPS 2020:
General Chair-elect (2021):
Past General Chair (2019):
2020 Virtual Symposium Overview | What to Expect
The 53rd International Symposium on Microelectronics, IMAPS 2020, will be hosted in a virtual environment from October 5-8. The Symposium will no longer take place in San Diego, California.
IMAPS has closely monitored the business, regulatory, and health climate surrounding COVID-19. After several months of discussions and evaluations between IMAPS leadership, event partners, and stakeholders such as exhibitors and speakers, organizers reached the conclusion that a safe and successful Symposium was no longer feasible in an in-person environment.
Preparations are well under way to launch a Symposium experience that attendees, speakers, and exhibitors can safely enjoy from home. The theme Enabling a Connected World: Always On! is more relevant than ever as we debut this highly interactive online experience with truly global reach. Attendees can continue to expect the same valuable technical content as our in-person event, including:
- Live keynotes and panel sessions
- Live professional development courses
- Five tracks and over 80 technical speakers and poster presentations
Access more presentations with on-demand presentations!
- Face to face connections in the virtual exhibit hall
- Attendee to attendee networking opportunities
- And more!
The full broadcast schedule, virtual tools, and registration details will be announced soon! Stay updated right here at www.imaps2020.org.
This will mark the first time that such a significant change has been mandated of the IMAPS signature event and we anticipate a valuable experience for all involved. The Symposium is expected to return to its traditional face-to-face atmosphere in October 2021 for the 54th International Symposium on Microelectronics.
Technical speaker presentations will be presented on-demand during the virtual symposium. Expect presentations from over 80 speakers across these technical tracks. Broadcast schedule coming soon!
SiP/SiM/CPI (Systems Solutions)
Kim Yess, Brewer Science
Suresh Jayaraman, Amkor Technology
Wafer Level/Panel Level (Advanced RDL)
Beth Keser, Intel
Rey Alvarado, Qualcomm
High Performance-High Reliability
Erica Folk, Northrop Grumman
Ivan Ndip, Fraunhofer IZM
Advanced Packaging (Flip Chip/2.5D/3D/Optical)
Sandeep Sane, Intel
Frank Eberle, Northrop Grumman
Jaimal Williamson, Texas Instruments
Advanced Process & Materials (Enabling Technologies)
Benson Chan, Binghamton University
Mark Hoffmeyer, IBM
Virtual Poster Session
Abstract Submissions and Speaker Planning
The abstract submission window has closed. Please contact Brian Schieman at firstname.lastname@example.org with any questions.
Please click here for the speaker planning page.
Professional Development Courses
IMAPS 2020 will continue to offer supplementary classroom-style education in the form of two-hour short courses taught by industry leaders. Information about the PDC lineup and delivery style will be announced soon.
The exhibitor prospectus has been released! IMAPS is pleased to offer exhibitors three virtual environments and a valuable benefits package that will make our virtual exhibition the right choice for your organization.
CLICK HERE TO LEARN MORE AND COMPARE EXHIBITOR ENVIRONMENTS
Final exhibitor application deadline is September 4th. Commit now!