International Symposium on Microelectronics

General Chair:
Mak Kulkarni
Texas Instruments

General Chair-elect (2022):
Sandeep Sane
Intel Corporation

Past General Chair (2020):
Habib Hichri
Ajinomoto Fine-Techno USA 

October 12 - 14, 2021

October 12 - 13, 2021

 Professional Development Courses 
October 11, 2021

IMAPS 2021 Begins October 11!

Join us for the return to in-person
meetings & great networking!

Still time to register to attend in-person or virtually

Register for full technical program or a complimentary exhibit pass

Join the Welcome Reception - Monday, 5:30-7pm

Visit 56 Exhibit Booths - Tuesday & Wednesday

Our committee has planned a great technical program for you:

7 keynote speakers

More than 40 live / in-person presentations

In-person live Poster Session

Live Panel Session with:

AMD, Facebook, Intel, Nvidia, Samsung & Xilinx

10 Professional Development Courses (Monday)

New Workshop on 6G from Fraunhofer IZM

Virtual access to live streamed content & more than 75 on-demand speakers

Be sure to view the final program and details below

The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.

You can participate in-person or virtually in 2021

In Person

  • Live Keynote, Panel, HIR Workshop, PDCs and Posters
  • More than 50 Live Technical Speakers
  • Exhibit Hall access
  • Breakfast and lunch each day along with networking receptions
  • On Demand access for all Keynote, Panel, HIR Workshop, and Posters
  • Live Diversity & Inclusion Townhall Discussion


  • On Demand access for Keynote, Panel, HIR Workshop, and Posters
  • On Demand access to ~100 Speaker Presentations
  • Live stream access to SELECT PDCs Only

 NOTE: PDCs are an additional fee.

What Does 6G Mean For Packaging?

This workshop is part of this year's IMAPS 2021, 54th International Symposium on Microelectronics. All participants of IMAPS 2021 will receive a TEAMS Meeting link if they wish to attend this Virtual Workshop on Monday, October 11 from 12:00pm-2:15pm PACIFIC. 

This Workshop will feature 6 speakers from Fraunhofer IZM. The meeting will be held virtually in Microsoft TEAMS only. There will not be a face-to-face meeting at IMAPS 2021 for this event. This meeting will be recorded and all registered attendees for the Symposium will receive a recording link for on-demand replay. 

Download the Fraunhofer 6G Program

Keynote: The leap from 5 to 6G
Ivan Ndip

Cost-optimized manufacturing technologies for RF packages
Tanja Braun

Glass interposer technology for highly compact high-frequency applications
Markus Wöhrmann

Photonic packaging
Hermann Oppermann

Photonic systems for massive communication
Tolga Tekin

Aging of RF materials
Hans Walter et al


IMAPS 2021 program is packed with keynote presentations from top experts, Professional Development Courses, numerous technical sessions and over a dozen posters. For a full list of topics and presenters, click here.


October 12 - 9:00AM
Advanced Packaging Architectures: Opportunities and Challenges

Hamid Azimi, Ph.D., Intel Corporation

October 13 - 9:00AM
Next Generation Advanced Packaging and Thermo-Mechanical Considerations to Maximize Si Performance

Suresh Ramalingam, Xilinx

October 12 - 10:15AM
More Moore or More than Moore. An EDA perspective

KT Moore, Cadence Design Systems, Inc.

October 14 - 8:15AM

Advanced Packaging is the Future of the Semiconductor Industry

Jean-Christophe Eloy, Yole

October 13 - 8:15AM
Packaging Technologies for Integrated Photonics

Peter O'Brien, Tyndall Institute

October 14 - 9:00AM
A New Era for Glass in Microelectronics Packaging

Roman Ostholt, LPKF Laser & Electronics AG

October 13 - 6:45 PM
Challenges and Opportunities of Packaging Fab Near the End of Moore's Era

Seungwook "Stewart" Yoon, Samsung Electronics


PDCs will be offered on Monday, October 11 from 8AM-5:30PM Pacific Time

8:00 am - 10:00 am

  • System-in-Package (SiP) - System Solutions Through Miniaturization - Instructor: Mark Gerber, ASE US, Inc.
  • Packaging Technologies and Antenna-in-Package Solutions for 5G Applications - Instructors: Ivan Ndip and Markus Woehrmann, Fraunhofer IZM (VIRTUAL ONLY)
  • CANCELED -- Achieving High Reliability Leadfree Solder Joints - Materials Consideration - Instructor: Ning-Cheng Lee, Consultant (VIRTUAL ONLY)

10:30 am - 12:30 pm

  • Advances in Fan-Out Wafer-Level Packaging - Instructor: Beth Keser, Intel Corporation
  • Polymers for Advanced Packages - Instructor: Jeff Gotro, InnoCentrix, LLC
  • Failure Analysis in Semiconductor Package Assembly - Instructor: Tom Dory, Fujifilm Electronic Materials USA

1:00 pm - 3:00 pm

  • The Evolution of Flip Chip Package Technology - Instructor: Mark Gerber, ASE US, Inc.
  • Chiplet Design and Heterogeneous Integration Packaging - Instructor: John Lau, Unimicron Technology Corp.
  • CANCELED -- Package/Assembly Integrity & Solder Joint Reliability - Instructor: Jennie Hwang, H-Technologies Group (VIRTUAL ONLY)

3:30 pm - 5:30 pm

  • Fan-out Wafer/Panel-level Packaging - Instructor: John Lau, Unimicron Technology Corp.
  • Thermal Management of Electronics - Instructor: Jaime Sanchez, Intel Corporation (VIRTUAL ONLY)
  • 3D Package Assembly Processes and Technology - Instructor: Tom Dory, Fujifilm Electronic Materials USA

Career Growth During a Global Pandemic

Moderator/Chair: Erica Folk, Northrop Grumman
Townhall Participants:
Beth Keser, Intel Corp.; Mak Kulkarni, Texas Instruments;
Marqus Patton, SD National Society of Black Engineers; Nicole Wongk, Honeywell

This will be a one-hour townhall – open discussion and panel format. Join us for open and lively conversation around many important topics for all to consider in today‘s challenging pandemic work environment, including:

The importance of diversity within IMAPS
Diversity in Challenges in a virtual workplace
Best practices for diversity and inclusion
How to make an impact in your workplace
And more


Wednesday, October 13, 2021 | 6:45-8:30pm Pacific


PANEL: NEXT GENERATION PACKAGES: ARE WE READY? - Raja Swaminathan, AMD, Senior Fellow and Advanced Packaging Leader; Ravi Agarwal, Facebook - Technical Sourcing Manager; Tom DeBonis, Intel – Engineering TD Manager, Assembly/Test Technology Development; Suresh Ramalingam, Xilinx - Fellow; Ashkan Seyedi, Nvidia – Silicon Photonics Product Architect; Seungwook Stewart Yoon, Samsung Electronics - R&D Strategy, Corporate VP/Head of Team             

Moderator: Jan Vardaman, TechSearch International


October 14 - 12:15PM - 3:00PM (Pizza Lunch for those in the room)

Heterogenous Integration Roadmap                              (LIVE – VIRTUAL all remote)
Session Chair: Bill Chen, ASE

12:15 pm – 12:40 pm                   Overview                                         Bill Bottoms / Bill Chen
12:40 pm – 1:05 pm                      Medical Health & Wearable        Mark Poliks
1:05 pm – 1:30 pm                        MEMS & Sensor Integration        Shafi Saiyid & MaryAnn Maher
1:30 pm – 1:45 pm                         Break
1:45 pm – 2:10 pm                        Supply Chain                                   Tom Salmon
2:10 pm – 2:35 pm                        Security                                            Sohrab Attabjahani
2:35 pm – 3:00 pm                        Round Table Discussion + Q&A from Chat 


Currently, there are thirteen posters sessions scheduled for the Symposium.

   PROGRAM AT A GLANCE (Pacific Time)   

Monday, October 11 

8:00am-5:30pmProfessional Development Courses

Welcome Reception

Diversity & Inclusion Towhall Meeting

Tuesday, October 12

8:00am-5:50pmIMAPS 2021 Conference
11:00am-4:30pmExhibit Hall Open

Wednesday, October 13

8:00am-5:30pmIMAPS 2021 Conference

Exhibit Hall Open

6:45pm-8:30pmPanel Discussion

Thursday, October 14

8:00am-3:00pmIMAPS 2021 Conference

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New Content

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Town and Country Resort
500 Hotel Circle North
San Diego, CA  92108
Single/Double is $219 per night + taxes/fees
Hotel Block Still Available - Book Soon

Booking in the Block

IMAPS sincerely appreciates your support by staying at the Town &  Country Hotel.  We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants. 

  • Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel
  • Easily accessible — staying in the host hotel means less travel time and overall convenience





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Diversity, Inclusion and Student Programming



Northrop Grumman

Poster Session

Keynote Session

Keynote Session

Supporting Sponsor