International Symposium on Microelectronics

General Chair:
Mak Kulkarni
Texas Instruments

General Chair-elect (2022):
Sandeep Sane
Intel Corporation

Past General Chair (2020):
Habib Hichri
Ajinomoto Fine-Techno USA 

IMAPS 2021 Health and Safety Statement

You can participate in-person or virtually in 2021

 NOTE: PDCs are an additional fee.

IMAPS 2021 program is packed with keynote presentations from top experts, Professional Development Courses, numerous technical sessions and over a dozen posters. For a full list of topics and presenters, click here.

   KEYNOTES  

	October 12 - 9:00AM Advanced Packaging Architectures: Opportunities and Challenges Hamid Azimi, Ph.D., Intel Corporation		October 13 - 9:00AM Next Generation Advanced Packaging and Thermo-Mechanical Considerations to Maximize Si Performance Suresh Ramalingam, Xilinx
	October 12 - 10:15AM More Moore or More than Moore. An EDA perspective KT Moore, Cadence Design Systems, Inc.		October 14 - 8:15AM Advanced Packaging is the Future of the Semiconductor Industry Jean-Christophe Eloy, Yole
	October 13 - 8:15AM Packaging Technologies for Integrated Photonics Peter O'Brien, Tyndall Institute		October 14 - 9:00AM A New Era for Glass in Microelectronics Packaging Roman Ostholt, LPKF Laser & Electronics AG
		October 13 - 6:45 PM Challenges and Opportunities of Packaging Fab Near the End of Moore's Era Seungwook "Stewart" Yoon, Samsung Electronics

   PROFESSIONAL DEVELOPMENT COURSES 

PDCs will be offered on Monday, October 11 from 8AM-5:30PM Pacific Time

8:00 am - 10:00 am

• System-in-Package (SiP) - System Solutions Through Miniaturization - Instructor: Mark Gerber, ASE US, Inc.
• Packaging Technologies and Antenna-in-Package Solutions for 5G Applications - Instructors: Ivan Ndip and Markus Woehrmann, Fraunhofer IZM (VIRTUAL ONLY)
• CANCELED -- Achieving High Reliability Leadfree Solder Joints - Materials Consideration - Instructor: Ning-Cheng Lee, Consultant (VIRTUAL ONLY)

10:30 am - 12:30 pm

• Advances in Fan-Out Wafer-Level Packaging - Instructor: Beth Keser, Intel Corporation
• Polymers for Advanced Packages - Instructor: Jeff Gotro, InnoCentrix, LLC
• Failure Analysis in Semiconductor Package Assembly - Instructor: Tom Dory, Fujifilm Electronic Materials USA

1:00 pm - 3:00 pm

• The Evolution of Flip Chip Package Technology - Instructor: Mark Gerber, ASE US, Inc.
• Chiplet Design and Heterogeneous Integration Packaging - Instructor: John Lau, Unimicron Technology Corp.
• CANCELED -- Package/Assembly Integrity & Solder Joint Reliability - Instructor: Jennie Hwang, H-Technologies Group (VIRTUAL ONLY)

3:30 pm - 5:30 pm

• Fan-out Wafer/Panel-level Packaging - Instructor: John Lau, Unimicron Technology Corp.
• Thermal Management of Electronics - Instructor: Jaime Sanchez, Intel Corporation (VIRTUAL ONLY)
• 3D Package Assembly Processes and Technology - Instructor: Tom Dory, Fujifilm Electronic Materials USA

DIVERSITY & INCLUSION TOWNHALL DISCUSSION:
Career Growth During a Global Pandemic

Moderator/Chair: Erica Folk, Northrop Grumman
Townhall Participants:
Beth Keser, Intel Corp.; Mak Kulkarni, Texas Instruments;
Marqus Patton, SD National Society of Black Engineers; Nicole Wongk, Honeywell

This will be a one-hour townhall – open discussion and panel format. Join us for open and lively conversation around many important topics for all to consider in today’s challenging pandemic work environment, including:

The importance of diversity within IMAPS
Diversity in Challenges in a virtual workplace
Best practices for diversity and inclusion
How to make an impact in your workplace
And more

   EVENING KEYNOTE & PANEL SESSION   

Wednesday, October 13, 2021 | 6:45-8:30pm Pacific

KEYNOTE: CHALLENGES AND OPPORTUNITIES OF PACKAGING FAB NEAR THE END OF MOORE‘S ERA -Seungwook Stewart Yoon, Samsung Electronics

PANEL: NEXT GENERATION PACKAGES: ARE WE READY? - Raja Swaminathan, AMD, Senior Fellow and Advanced Packaging Leader; Ravi Agarwal, Facebook - Technical Sourcing Manager; Tom DeBonis, Intel – Engineering TD Manager, Assembly/Test Technology Development; Suresh Ramalingam, Xilinx - Fellow; Ashkan Seyedi, Nvidia – Silicon Photonics Product Architect; Seungwook Stewart Yoon, Samsung Electronics - R&D Strategy, Corporate VP/Head of Team             

Moderator: Jan Vardaman, TechSearch International

    TECHNICAL TRACKS/SESSIONS   

October 14 - 12:15PM - 3:00PM (Pizza Lunch for those in the room)

Heterogenous Integration Roadmap                              (LIVE – VIRTUAL all remote)
Session Chair: Bill Chen, ASE

12:15 pm – 12:40 pm                   Overview                                         Bill Bottoms / Bill Chen
12:40 pm – 1:05 pm                      Medical Health & Wearable        Mark Poliks
1:05 pm – 1:30 pm                        MEMS & Sensor Integration        Shafi Saiyid & MaryAnn Maher
1:30 pm – 1:45 pm                         Break
1:45 pm – 2:10 pm                        Supply Chain                                   Tom Salmon
2:10 pm – 2:35 pm                        Security                                            Sohrab Attabjahani
2:35 pm – 3:00 pm                        Round Table Discussion + Q&A from Chat 

   POSTER SESSION   

Currently, there are thirteen posters sessions scheduled for the Symposium.

   PROGRAM AT A GLANCE (Pacific Time)   

PREMIER SPONSOR

Diversity, Inclusion and Student Programming

                       Corporate

                 Corporate

Poster Session

Keynote Session

Keynote Session

Supporting Sponsor