International Symposium on Microelectronics

General Chair:
Mak Kulkarni
Texas Instruments

General Chair-elect (2022):
Sandeep Sane
Intel Corporation

Past General Chair (2020):
Habib Hichri
Ajinomoto Fine-Techno USA 


              Conference            
October 12 - 14, 2021

            Exhibition            
October 12 - 13, 2021

 Professional Development Courses 
October 11, 2021

The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.

IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of IMAPS 2021 San Diego. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best Symposium this Fall and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Symposium are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all.

PROGRAM

IMAPS 2021 program is packed with keynote presentations from top experts, Professional Development Courses, numerous technical sessions and over a dozen posters. For a full list of topics and presenters, click here.

   KEYNOTES  

Advanced Packaging Architectures: Opportunities and Challenges

Hamid Azimi, Ph.D., Intel Corporation

Next Generation Advanced Packaging and Thermo-Mechanical Considerations to Maximize Si Performance

Suresh Ramalingam, Xilinx

More Moore or More than Moore. An EDA perspective

KT Moore, Cadence Design Systems, Inc.

A New Era for Glass in Microelectronics Packaging

Roman Ostholt, LPKF Laser & Electronics AG

Packaging Technologies for Integrated Photonics

Peter O'Brien, Tyndall Institute

Advanced Packaging is the Future of the Semiconductor Industry

Jean-Christophe Eloy, Yole

   PROFESSIONAL DEVELOPMENT COURSES 

PDCs will be offered on Monday, October 11 from 8AM-5:30PM Pacific Time

8:00 am - 10:00 am

  • System-in-Package (SiP) - System Solutions Through Miniaturization - Instructor: Mark Gerber, ASE US, Inc.
  • Packaging Technologies and Antenna-in-Package Solutions for 5G Applications - Instructors: Ivan Ndip and Markus Woehrmann, Fraunhofer IZM (VIRTUAL ONLY)
  • Achieving High Reliability Leadfree Solder Joints - Materials Consideration - Instructor: Ning-Cheng Lee, Consultant (VIRTUAL ONLY)

10:30 am - 12:30 pm

  • Advances in Fan-Out Wafer-Level Packaging - Instructor: Beth Keser, Intel Corporation
  • Polymers for Advanced Packages - Instructor: Jeff Gotro, InnoCentrix, LLC
  • Failure Analysis in Semiconductor Package Assembly - Instructor: Tom Dory, Fujifilm Electronic Materials USA

1:00 pm - 3:00 pm

  • The Evolution of Flip Chip Package Technology - Instructor: Mark Gerber, ASE US, Inc.
  • Chiplet Design and Heterogeneous Integration Packaging - Instructor: John Lau, Unimicron Technology Corp.
  • Package/Assembly Integrity & Solder Joint Reliability - Instructor: Jennie Hwang, H-Technologies Group (VIRTUAL ONLY)

3:30 pm - 5:30 pm

  • Fan-out Wafer/Panel-level Packaging - Instructor: John Lau, Unimicron Technology Corp.
  • Thermal Management of Electronics - Instructor: Jaime Sanchez, Intel Corporation (VIRTUAL ONLY)
  • 3D Package Assembly Processes and Technology - Instructor: Tom Dory, Fujifilm Electronic Materials USA

   PANEL SESSION   

Wednesday, October 13, 2021 | 6:45-8:00pm Pacific

Next Generation Packages: Are We Ready?

Moderator: Jan Vardaman, TechSearch International

Panelists and description soon

    TECHNICAL TRACKS/SESSIONS   

Heterogenous Integration Roadmap

Manufacturing Optimization

Wafer Level/Panel Level (Advanced RDL)

High Performance-High Reliability

Advanced Packaging (Flip Chip/2.5D/3D/Optical)

Advanced Process  & Materials (Enabling Technologies)

   POSTER SESSION   

Currently, there are thirteen posters sessions scheduled for the Symposium.

   PROGRAM AT A GLANCE (Pacific Time)   

Monday, October 11 

8:00am-5:30pmProfessional Development Courses
5:30pm-7:00pm

Welcome Reception

Tuesday, October 12

8:00am-5:30pmIMAPS 2021 Conference
11:00am-5:30pmExhibit Hall Open

Wednesday, October 13

8:00am-5:30pmIMAPS 2021 Conference
11:00am-5:30pm

Exhibit Hall Open

6:00pm-7:30pm
Panel Discussion

Thursday, October 14

8:00am-12:00pmIMAPS 2021 Conference
1:00pmIMAPS Foundation Golf Outing

Town and Country Resort
500 Hotel Circle North
San Diego, CA  92108
Single/Double is $219 per night + taxes/fees
Hotel Block Still Available - Book Soon


Booking in the Block

IMAPS sincerely appreciates your support by staying at the Town &  Country Hotel.  We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants. 

  • Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel
  • Easily accessible — staying in the host hotel means less travel time and overall convenience

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