International Symposium on Microelectronics

General Chair:
Mak Kulkarni
Texas Instruments
General Chair-elect (2022):
Sandeep Sane
Intel Corporation
Past General Chair (2020):
Habib Hichri
Ajinomoto Fine-Techno USA
Conference
October 12 - 14, 2021
Exhibition
October 12 - 13, 2021
Professional Development Courses
October 11, 2021
IMAPS 2021 Begins October 11!
Join us for the return to in-person
meetings & great networking!
Still time to register to attend in-person or virtually
Register for full technical program or a complimentary exhibit pass
Join the Welcome Reception - Monday, 5:30-7pm
Visit 56 Exhibit Booths - Tuesday & Wednesday
Our committee has planned a great technical program for you:
7 keynote speakers
More than 40 live / in-person presentations
In-person live Poster Session
Live Panel Session with:
AMD, Facebook, Intel, Nvidia, Samsung & Xilinx
10 Professional Development Courses (Monday)
New Workshop on 6G from Fraunhofer IZM
Virtual access to live streamed content & more than 75 on-demand speakers
Be sure to view the final program and details below
The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.
You can participate in-person or virtually in 2021
In Person |
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Virtually |
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NOTE: PDCs are an additional fee.
** NEW MONDAY VIRTUAL WORKSHOP by Fraunhofer IZM **
What Does 6G Mean For Packaging?
This workshop is part of this year's IMAPS 2021, 54th International Symposium on Microelectronics. All participants of IMAPS 2021 will receive a TEAMS Meeting link if they wish to attend this Virtual Workshop on Monday, October 11 from 12:00pm-2:15pm PACIFIC.
This Workshop will feature 6 speakers from Fraunhofer IZM. The meeting will be held virtually in Microsoft TEAMS only. There will not be a face-to-face meeting at IMAPS 2021 for this event. This meeting will be recorded and all registered attendees for the Symposium will receive a recording link for on-demand replay.
Download the Fraunhofer 6G Program
Keynote: The leap from 5 to 6G
Ivan Ndip
Cost-optimized manufacturing technologies for RF packages
Tanja Braun
Glass interposer technology for highly compact high-frequency applications
Markus Wöhrmann
Photonic packaging
Hermann Oppermann
Photonic systems for massive communication
Tolga Tekin
Aging of RF materials
Hans Walter et al
PROGRAM
IMAPS 2021 program is packed with keynote presentations from top experts, Professional Development Courses, numerous technical sessions and over a dozen posters. For a full list of topics and presenters, click here.
KEYNOTES
![]() | October 12 - 9:00AM Advanced Packaging Architectures: Opportunities and Challenges Hamid Azimi, Ph.D., Intel Corporation | ![]() | October 13 - 9:00AM Next Generation Advanced Packaging and Thermo-Mechanical Considerations to Maximize Si Performance Suresh Ramalingam, Xilinx |
![]() | October 12 - 10:15AM More Moore or More than Moore. An EDA perspective KT Moore, Cadence Design Systems, Inc. | ![]() | October 14 - 8:15AM Advanced Packaging is the Future of the Semiconductor Industry Jean-Christophe Eloy, Yole |
![]() | October 13 - 8:15AM Packaging Technologies for Integrated Photonics Peter O'Brien, Tyndall Institute | ![]() | October 14 - 9:00AM A New Era for Glass in Microelectronics Packaging Roman Ostholt, LPKF Laser & Electronics AG |
![]() | October 13 - 6:45 PM Challenges and Opportunities of Packaging Fab Near the End of Moore's Era Seungwook "Stewart" Yoon, Samsung Electronics |
PROFESSIONAL DEVELOPMENT COURSES
PDCs will be offered on Monday, October 11 from 8AM-5:30PM Pacific Time
8:00 am - 10:00 am
- System-in-Package (SiP) - System Solutions Through Miniaturization - Instructor: Mark Gerber, ASE US, Inc.
- Packaging Technologies and Antenna-in-Package Solutions for 5G Applications - Instructors: Ivan Ndip and Markus Woehrmann, Fraunhofer IZM (VIRTUAL ONLY)
- CANCELED -- Achieving High Reliability Leadfree Solder Joints - Materials Consideration - Instructor: Ning-Cheng Lee, Consultant (VIRTUAL ONLY)
10:30 am - 12:30 pm
- Advances in Fan-Out Wafer-Level Packaging - Instructor: Beth Keser, Intel Corporation
- Polymers for Advanced Packages - Instructor: Jeff Gotro, InnoCentrix, LLC
- Failure Analysis in Semiconductor Package Assembly - Instructor: Tom Dory, Fujifilm Electronic Materials USA
1:00 pm - 3:00 pm
- The Evolution of Flip Chip Package Technology - Instructor: Mark Gerber, ASE US, Inc.
- Chiplet Design and Heterogeneous Integration Packaging - Instructor: John Lau, Unimicron Technology Corp.
- CANCELED -- Package/Assembly Integrity & Solder Joint Reliability - Instructor: Jennie Hwang, H-Technologies Group (VIRTUAL ONLY)
3:30 pm - 5:30 pm
- Fan-out Wafer/Panel-level Packaging - Instructor: John Lau, Unimicron Technology Corp.
- Thermal Management of Electronics - Instructor: Jaime Sanchez, Intel Corporation (VIRTUAL ONLY)
- 3D Package Assembly Processes and Technology - Instructor: Tom Dory, Fujifilm Electronic Materials USA
DIVERSITY & INCLUSION TOWNHALL DISCUSSION:
Career Growth During a Global Pandemic
Moderator/Chair: Erica Folk, Northrop Grumman
Townhall Participants:
Beth Keser, Intel Corp.; Mak Kulkarni, Texas Instruments;
Marqus Patton, SD National Society of Black Engineers; Nicole Wongk, Honeywell
This will be a one-hour townhall – open discussion and panel format. Join us for open and lively conversation around many important topics for all to consider in today‘s challenging pandemic work environment, including:
The importance of diversity within IMAPS
Diversity in Challenges in a virtual workplace
Best practices for diversity and inclusion
How to make an impact in your workplace
And more
EVENING KEYNOTE & PANEL SESSION
Wednesday, October 13, 2021 | 6:45-8:30pm Pacific
KEYNOTE: CHALLENGES AND OPPORTUNITIES OF PACKAGING FAB NEAR THE END OF MOORE’S ERA -Seungwook Stewart Yoon, Samsung Electronics
PANEL: NEXT GENERATION PACKAGES: ARE WE READY? - Raja Swaminathan, AMD, Senior Fellow and Advanced Packaging Leader; Ravi Agarwal, Facebook - Technical Sourcing Manager; Tom DeBonis, Intel – Engineering TD Manager, Assembly/Test Technology Development; Suresh Ramalingam, Xilinx - Fellow; Ashkan Seyedi, Nvidia – Silicon Photonics Product Architect; Seungwook Stewart Yoon, Samsung Electronics - R&D Strategy, Corporate VP/Head of Team
Moderator: Jan Vardaman, TechSearch International
TECHNICAL TRACKS/SESSIONS
October 14 - 12:15PM - 3:00PM (Pizza Lunch for those in the room)
Heterogenous Integration Roadmap (LIVE – VIRTUAL all remote)
Session Chair: Bill Chen, ASE
12:15 pm – 12:40 pm Overview Bill Bottoms / Bill Chen
12:40 pm – 1:05 pm Medical Health & Wearable Mark Poliks
1:05 pm – 1:30 pm MEMS & Sensor Integration Shafi Saiyid & MaryAnn Maher
1:30 pm – 1:45 pm Break
1:45 pm – 2:10 pm Supply Chain Tom Salmon
2:10 pm – 2:35 pm Security Sohrab Attabjahani
2:35 pm – 3:00 pm Round Table Discussion + Q&A from Chat
POSTER SESSION
Currently, there are thirteen posters sessions scheduled for the Symposium.
PROGRAM AT A GLANCE (Pacific Time)
Monday, October 11 | |
8:00am-5:30pm | Professional Development Courses |
5:30pm-7:00pm | Welcome Reception |
7:00pm-8:00pm | Diversity & Inclusion Towhall Meeting |
Tuesday, October 12 | |
8:00am-5:50pm | IMAPS 2021 Conference |
11:00am-4:30pm | Exhibit Hall Open |
Wednesday, October 13 | |
8:00am-5:30pm | IMAPS 2021 Conference |
11:00am-6:45pm | Exhibit Hall Open |
6:45pm-8:30pm | Panel Discussion |
Thursday, October 14 | |
8:00am-3:00pm | IMAPS 2021 Conference |
New Content
New Content
New Content
Booking in the Block
IMAPS sincerely appreciates your support by staying at the Town & Country Hotel. We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants.
- Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel
- Easily accessible — staying in the host hotel means less travel time and overall convenience
SPONSORS
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TECH SPONSORS
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Diversity, Inclusion and Student Programming

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Keynote Session
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