International Symposium on Microelectronics

The 53rd International Symposium on Microelectronics, IMAPS 2020, was hosted LIVE in a virtual environment from October 5-8. It remains on-demand for all previous and new registrants until November 6th (NEW! Enjoy this one week extension!)
General Chair of IMAPS 2020:
Habib Hichri
Ajinomoto Fine-Techno USA Corporation
General Chair-elect (2021):
Mak Kulkarni
Texas Instruments
Past General Chair (2019):
Curtis Zwenger
Amkor Technology
2020 Virtual Symposium Overview
The IMAPS 2020 organizing committee launched a Symposium experience that attendees, speakers, and exhibitors safely enjoyed from home. The theme Enabling a Connected World: Always On! was more relevant than ever as we debuted this online experience with truly global reach. Attendees continued to expect the same valuable technical content as our in-person event, including:
- Live keynotes, panel session, and a feature workshop from Fraunhofer IZM
- Live professional development courses
- Five tracks and nearly 80 technical speakers and poster presentations available on-demand
- Face to face connections in the virtual exhibit hall
- And more!
Learn more about the program below!
KEYNOTE SPEAKERS

Babak Sabi
CVP and GM for Packaging, Assembly, and Test
Intel
Advanced Packaging Architectures: Scaling for A Heterogeneous World
Bryan Black
Senior Fellow
AMD
Chiplets: How to Utilize Them, Some of the Challenges, and What They Can Do

Ron Ho
Director Silicon Engineering
Facebook
Packaging Enabling Tomorrow‘s Realities
Martin Weigert
Vice President & General Manager
Broadcom Limited
Silicon Detector Configurations for Optimizing Lidar Systems
Jeff Pauza, Mustapha Slamani, and Selaka Bulumulla
GlobalFoundries
mmWave Antenna in Package Needs More than a Package
Feature Panel
The Future Advanced Packaging Ecosystem: Who Will Be in the Driver's Seat?
Chair and Moderator:
Jan Vardaman, TechSearch International
Panelists:
Koushik Banerjee, Intel Corp.
Dan Berger, GLOBALFOUNDRIES
Eelco Bergman, ASE
Mike Kelly, Amkor Technology
Khai Nguyen, NVIDIA
Craig Orr, Samsung
Ashkan Seyedi, HPE
Symposium Program
Over 80 technical speaker presentations are available on-demand during the virtual symposium. Presentations are sorted across 5 tracks and 17 sessions, plus a poster session. Click here for the full listing of accepted speakers and presentation titles.
Professional Development Courses
IMAPS 2020 offered supplementary classroom-style education in the form of two-hour short courses taught by industry leaders.
PDCs were taught live and are not available for replay or on-demand. Please join us in April at the International Conference on Device Packaging for the next selection of PDC courses!
Track A | Track B | |
---|---|---|
Friday, October 2nd 9:30am-11:30am Eastern | Course B4: **MOVED FROM MONDAY, OCTOBER 5 at 2PM** | |
Monday October 5th 12:00pm-2:00pm Eastern | Course A3: | |
Monday October 5th 2:00pm-4:00pm Eastern | Course A4: Polymers for Electronic Packaging Jeffrey Gotro, InnoCentrix LLC | **PDC B4 MOVED TO FRIDAY, OCTOBER 2 at 9:30AM** |
Tuesday October 6th 1:00pm-3:00pm Eastern | Course B6: Fan Out Variations - Structures and Processes for Low and High Density John Hunt, ASE US, Inc | |
Thursday October 8th 1:00pm-3:00pm Eastern | Course A8: The Evolution of Flip Chip Package Technology Mark Gerber, ASE US, Inc. |
Sponsors and Exhibitors
The exhibit hall remains OPEN through October 30th!
Learn more about our virtual exhibit hall. Register now for a free virtual exhibit hall badge!
Sponsoring & Exhibiting Organizations
3D InCites
Amkor Technology
ASE Group
3D InCites
Ajinomoto Fine-Techno USA Corp.
Canon USA
Cicor Group
EMD Performance Materials
Finetech
Geib Refining
Heidelberg Instruments Inc.
Heraeus Electronics
Hermetic Solutions Group
Honeywell
IBM Canada
JIACO Instruments
Kulicke & Soffa Industries Inc.
Materion
Microcircuit Laboratories LLC
Micro Systems Technologies, Inc.
Micross
Mini-Systems, Inc.
MRSI Systems
MST
NCSU PREES
NorCom Systems, Inc.
NTK Technologies, Inc.
Optomec
Palomar Technologies
Plasmatreat USA
Quik-Pak
Royce Instruments
Semiconductor Digest
Specialty Coating Systems
StratEdge Corpration
SUSS MicroTec
Technic, Inc.
Torrey Hills Technologies
Universal Instruments Corporation
US Tech
Registration
Registration Type | Price |
Member | $275 |
Non-Member | $349 |
Speaker or Chair | $250 |
Student Member* *Student membership is now FREE! | $25 |
Exhibits Visitor | Complimentary |
Professional Development Course | Add $250 per course |
Virtual Exhibitor | Starting at $1,200 |
University Exhibitor | $600-$1000 Inclusive of student registrations |
How to Register
- Click here to register as a Member, Non-Member, Speaker, Chair, Student, or Exhibits Visitor.
- Select your registration type from the available options.
- Make payment online with a credit card.
- Receive a confirmation via email. If you do not receive an email confirmation, please contact us at (919) 293-5000.
If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone.