International Symposium on Microelectronics
General Chair of IMAPS 2020:
Ajinomoto Fine-Techno USA Corporation
General Chair-elect (2021):
Past General Chair (2019):
2020 Virtual Symposium Overview | What to Expect
The 53rd International Symposium on Microelectronics, IMAPS 2020, will be hosted in a virtual environment from October 5-8.
The IMAPS 2020 organizing committee is excited to launch a Symposium experience that attendees, speakers, and exhibitors can safely enjoy from home. The theme Enabling a Connected World: Always On! is more relevant than ever as we debut this highly interactive online experience with truly global reach. Attendees can continue to expect the same valuable technical content as our in-person event, including:
- Live keynotes, panel session, and a feature workshop from Fraunhofer IZM
- Live professional development courses
- Five tracks and nearly 90 technical speakers and poster presentations available on-demand
- Face to face connections in the virtual exhibit hall
- And more!
Learn more about the program below!
CVP and GM for Packaging, Assembly, and Test
Advanced Packaging Architectures: Scaling for A Heterogeneous World
Chiplets: Why AMD is Utilizing Chiplets, Some of the Challenges, and Where They May Take Us
Director Silicon Engineering
Packaging Enabling Tomorrow’s Realities
Vice President & General Manager
Silicon Detector Configurations for Optimizing Lidar Systems
Jeff Pauza, Mustapha Slamani, and Selaka Bulumulla
mmWave Antenna in Package Needs More than a Package
Chair and Moderator:
Jan Vardaman, TechSearch International
Koushik Banerjee, Intel Corp.
Dan Berger, GLOBALFOUNDRIES
Eelco Bergman, ASE
Mike Kelly, Amkor Technology
Khai Nguyen, NVIDIA
Craig Orr, Samsung
Ashkan Seyedi, HPE
Nearly 100 technical speaker presentations will be presented on-demand during the virtual symposium. Expect presentations across 5 tracks and 17 sessions, plus a live poster session. Click here for the full listing of accepted speakers and presentation titles.
IMAPS 2020 will continue to offer supplementary classroom-style education in the form of two-hour short courses taught by industry leaders.
NEW FOR 2020: Professional development courses will be offered every day of the Symposium! Choose from courses offered October 2nd - October 8th.
|Track A||Track B|
**MOVED FROM MONDAY, OCTOBER 5 at 2PM**
Polymers for Electronic Packaging
Jeffrey Gotro, InnoCentrix LLC
|**PDC B4 MOVED TO FRIDAY, OCTOBER 2 at 9:30AM**|
Fan Out Variations - Structures and Processes for Low and High Density
John Hunt, ASE US, Inc
The Evolution of Flip Chip Package Technology
Mark Gerber, ASE US, Inc.
Sponsoring & Exhibiting Organizations
Ajinomoto Fine-Techno USA Corp.
EMD Performance Materials
Heidelberg Instruments Inc.
Hermetic Solutions Group
Kulicke & Soffa Industries Inc.
Microcircuit Laboratories LLC
NorCom Systems, Inc.
NTK Technologies, Inc.
Specialty Coating Systems
Torrey Hills Technologies
Universal Instruments Corporation
Speaker or Chair
| Student Member*|
*Student membership is now FREE!
Professional Development Course
Add $250 per course
Starting at $1,200
Inclusive of student
How to Register
- Click here to register as a Member, Non-Member, Speaker, Chair, Student, or Exhibits Visitor.
- Select your registration type from the available options.
- Add optional Professional Development Courses (offered each day of the 2020 event!)
- Make payment online with a credit card.
- Receive a confirmation via email. If you do not receive an email confirmation, please contact us at (919) 293-5000.
If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone.