International Symposium on Microelectronics

General Chair:
Mak Kulkarni
Texas Instruments

General Chair-elect (2022):
Sandeep Sane
Intel Corporation

Past General Chair (2020):
Habib Hichri
Ajinomoto Fine-Techno USA 



                        Conference                  
October 12 - 14, 2021

                       Exhibition                     
October 12 - 13, 2021

 Professional Development Courses 
October 11, 2021

ABSTRACTS STILL BEING ACCEPTED | SUBMIT YOUR ABSTRACT HERE!

 SPONSOR & EXHIBIT SALES BEGIN: JUNE 21, 2021

The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.

IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of IMAPS 2021 San Diego. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best Symposium this Fall and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Symposium are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all.


TRACK 1:
Manufacturing Optimization

Chairs:
Dongshun Bai, Brewer Science
Suresh Jayaraman, Amkor

TRACK 2:
Wafer Level/Panel Level (Advanced RDL)

Chairs:
Tarak Railkar, Qorvo
Rey Alvarado, Qualcomm

TRACK 3:
High Performance / High Reliability

Chairs:
Erica Folk, Northrop Grumman
Ivan Ndip, Fraunhofer IZM

TRACK 4:
Advanced Package (Flip Chip, 2.5D, 3D, Optical)

Chairs:
Frank Eberle, Northrop Grumman Corp.
Jaimal Williamson, TI

TRACK 5:
Advanced Process & Materials (Enabling Tech.)

Chairs:
Benson Chan, Binghamton University
Mark Hoffmeyer, IBM

  PLANNED SESSIONS:

  • CPI & Modeling
  • PDK Development for Packaging
  • Assembly Process Integration
  • Yield Advancement
  • Cost Reduction & Tradeoffs
  • Throughput & Cycle Time
  • Design for Manufacturing
  • Reliability & Test

  PLANNED SESSIONS:

  • Wafer-level Fan Out / WLCSP
  • Advanced Fan Out & Heterogeneous Integration
  • Panel-level Fan Out
  • MEMS & Sensors
  • Edge Protection
  • Carrier Technologies
  • Reliability & Test
  • Df/Dk Loss Tangent of Dielectrics

  PLANNED SESSIONS:

  • High Reliability in Defense and Aerospace
  • High Reliability in Automotive
  • MM Wave / High-speed Packaging
  • RF / Wireless Components
  • HiRel in Bio/Medical
  • HiRel in Extreme Environments

  PLANNED SESSIONS:

  • Large Body / Small Body FC
  • 2.5D/3D Technologies
  • Optical / Photonics / Waveguides / Lasers
  • BUMP & Interconnect
  • 3D Technologies
  • Advanced Flip Chip
  • Heterogeneous Integration

  PLANNED SESSIONS:

  • Substrate Technology
  • Polymer Materials & Processes
  • Novel Materials & Processes
  • Advanced Wirebond
  • Advanced Equipment for Additive Manufacturing
  • Flexible & Wearable Electronics

TRACK 6:
INTERACTIVE POSTER SESSION - "Posters & Pizza Lunch"

Technical sessions are being planned for these tracks, and abstracts will be considered on the session topic listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.


If your abstract is selected, you will be asked to follow the speaker timeline: - Speaker Acceptance/Rejection (June 14, 2021); - First Paper to Peer Review (July 9, 2021); - Peer Review feedback to authors (August 4, 2021); - Final/corrected Papers (August 30, 2021); - Speaker must register before (September 10, 2021); - BIO due (September 17, 2021); Speaker Breakfast (morning of your session); and - Slides/Presentation ready (on/before October 8, 2021).



 Special Paper Recognition - Cash Awards Offered! 

 6 "Best of Track" Outstanding Papers  - Six (6) Cash Awards
Six "Best of Track" Winners will then be reviewed for...


 1 Best Paper of the Symposium  - One (1) additional Cash Award for a "Best of Track" Winner


 IMAPS Microelectronics Foundation Student Paper Awards 
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students


SUBMIT YOUR ABSTRACTS RIGHT AWAY - CLOSING SOON