International Symposium on Microelectronics
The 53rd International Symposium on Microelectronics, IMAPS 2020, was hosted LIVE in a virtual environment from October 5-8. It remains on-demand for all previous and new registrants until October 30th.
General Chair of IMAPS 2020:
Habib Hichri
Ajinomoto Fine-Techno USA Corporation
General Chair-elect (2021):
Mak Kulkarni
Texas Instruments
Past General Chair (2019):
Curtis Zwenger
Amkor Technology
2020 Virtual Symposium Overview
The IMAPS 2020 organizing committee launched a Symposium experience that attendees, speakers, and exhibitors safely enjoyed from home. The theme Enabling a Connected World: Always On! was more relevant than ever as we debuted this online experience with truly global reach. Attendees continued to expect the same valuable technical content as our in-person event, including:
- Live keynotes, panel session, and a feature workshop from Fraunhofer IZM
- Live professional development courses
- Five tracks and nearly 80 technical speakers and poster presentations available on-demand
- Face to face connections in the virtual exhibit hall
- And more!
Learn more about the program below!
KEYNOTE SPEAKERS
We are pleased to announce FIVE keynote speakers from Intel, AMD, Facebook, GlobalFoundries, and BroadCom!
Keynote Sessions Sponsored by:
Babak Sabi
CVP and GM for Packaging, Assembly, and Test
Intel
Advanced Packaging Architectures: Scaling for A Heterogeneous World
Bryan Black
Senior Fellow
AMD
Chiplets: How to Utilize Them, Some of the Challenges, and What They Can Do
Ron Ho
Director Silicon Engineering
Facebook
Packaging Enabling Tomorrow’s Realities
Martin Weigert
Vice President & General Manager
Broadcom Limited
Silicon Detector Configurations for Optimizing Lidar Systems
Jeff Pauza, Mustapha Slamani, and Selaka Bulumulla
GlobalFoundries
mmWave Antenna in Package Needs More than a Package
Feature Panel
The Future Advanced Packaging Ecosystem: Who Will Be in the Driver's Seat?
Chair and Moderator:
Jan Vardaman, TechSearch International
Panelists:
Koushik Banerjee, Intel Corp.
Dan Berger, GLOBALFOUNDRIES
Eelco Bergman, ASE
Mike Kelly, Amkor Technology
Khai Nguyen, NVIDIA
Craig Orr, Samsung
Ashkan Seyedi, HPE
Panel Session Sponsored by:
Symposium Program
Over 80 technical speaker presentations are available on-demand during the virtual symposium. Presentations are sorted across 5 tracks and 17 sessions, plus a poster session. Click here for the full listing of accepted speakers and presentation titles.
Professional Development Courses
IMAPS 2020 offered supplementary classroom-style education in the form of two-hour short courses taught by industry leaders.
PDCs were taught live and are not available for replay or on-demand. Please join us in April at the International Conference on Device Packaging for the next selection of PDC courses!
| Track A | Track B | |
|---|---|---|
| Friday, October 2nd 9:30am-11:30am Eastern | Course B4: **MOVED FROM MONDAY, OCTOBER 5 at 2PM** | |
| Monday October 5th 12:00pm-2:00pm Eastern | Course A3: | |
| Monday October 5th 2:00pm-4:00pm Eastern | Course A4: Polymers for Electronic Packaging Jeffrey Gotro, InnoCentrix LLC | **PDC B4 MOVED TO FRIDAY, OCTOBER 2 at 9:30AM** |
| Tuesday October 6th 1:00pm-3:00pm Eastern | Course B6: Fan Out Variations - Structures and Processes for Low and High Density John Hunt, ASE US, Inc | |
| Thursday October 8th 1:00pm-3:00pm Eastern | Course A8: The Evolution of Flip Chip Package Technology Mark Gerber, ASE US, Inc. |
Sponsors and Exhibitors
The exhibit hall remains OPEN through October 30th!
Learn more about our virtual exhibit hall. Register now for a free virtual exhibit hall badge!
Sponsoring & Exhibiting Organizations
3D InCites
Amkor Technology
ASE Group
3D InCites
Ajinomoto Fine-Techno USA Corp.
Canon USA
Cicor Group
EMD Performance Materials
Finetech
Geib Refining
Heidelberg Instruments Inc.
Heraeus Electronics
Hermetic Solutions Group
Honeywell
IBM Canada
JIACO Instruments
Kulicke & Soffa Industries Inc.
Materion
Microcircuit Laboratories LLC
Micro Systems Technologies, Inc.
Micross
Mini-Systems, Inc.
MRSI Systems
MST
NCSU PREES
NorCom Systems, Inc.
NTK Technologies, Inc.
Optomec
Palomar Technologies
Plasmatreat USA
Quik-Pak
Royce Instruments
Semiconductor Digest
Specialty Coating Systems
StratEdge Corpration
SUSS MicroTec
Technic, Inc.
Torrey Hills Technologies
Universal Instruments Corporation
US Tech
Registration
Registration Type | Price |
Member | $275 |
Non-Member | $349 |
Speaker or Chair | $250 |
| Student Member* *Student membership is now FREE! | $25 |
Exhibits Visitor | Complimentary |
Professional Development Course | Add $250 per course |
Virtual Exhibitor | Starting at $1,200 |
University Exhibitor | $600-$1000 Inclusive of student registrations |
How to Register
- Click here to register as a Member, Non-Member, Speaker, Chair, Student, or Exhibits Visitor.
- Select your registration type from the available options.
- Make payment online with a credit card.
- Receive a confirmation via email. If you do not receive an email confirmation, please contact us at (919) 293-5000.
If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone.
SPONSORS
PRESENTING SPONSOR
SUPPORTING SPONSOR: KEYNOTES
SUPPORTING SPONSOR: SESSION
SUPPORTING SPONSOR: POSTER SESSION
SUPPORTING SPONSOR: DIVERSITY, INCLUSION & STUDENTS
SUPPORTING SPONSOR: PANEL
SUPPORTING SPONSOR: SESSIONS
SUPPORTING SPONSOR: Q&A
MEDIA SPONSOR
MEDIA SPONSOR
MEDIA SPONSOR
