International Symposium on Microelectronics

General Chair:
Mak Kulkarni
Texas Instruments

General Chair-elect (2022):
Sandeep Sane
Intel Corporation

Past General Chair (2020):
Habib Hichri
Ajinomoto Fine-Techno USA 



                        Conference                  
October 12 - 14, 2021

                       Exhibition                     
October 12 - 13, 2021

 Professional Development Courses 
October 11, 2021

ABSTRACT DEADLINE: APRIL 30, 2021 | SUBMIT YOUR ABSTRACT HERE!

 EXHIBIT SALES BEGIN: MAY 3, 2021


The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.


TRACK 1:
Manufacturing Optimization

TRACK 2:
Wafer Level/Panel Level (Advanced RDL)

TRACK 3:
High Performance / High Reliability

TRACK 4:
Advanced Package (Flip Chip, 2.5D, 3D, Optical)

TRACK 5:
Advanced Process & Materials (Enabling Tech.)

PLANNED SESSIONS:

CPI & Modeling

PDK Development for Packaging

Assembly Process Integration

Yield Advancement

Cost Reduction & Tradeoffs

Throughput & Cycle Time

Design for Manufacturing
Reliability & Test

PLANNED SESSIONS:

Wafer-level Fan Out / WLCSP
Advanced Fan Out & Heterogeneous Integration
Panel-level Fan Out
MEMS & Sensors
Edge Protection
Carrier Technologies
Reliability & Test

Df/Dk Loss Tangent of Dielectrics

PLANNED SESSIONS:

High Reliability in Defense and Aerospace
High Reliability in Automotive
MM Wave / High-speed Packaging
RF / Wireless Components
HiRel in Bio/Medical
HiRel in Extreme Environments

PLANNED SESSIONS:

Large Body / Small Body FC
2.5D/3D Technologies
Optical / Photonics / Waveguides / Lasers
BUMP & Interconnect
3D Technologies
Advanced Flip Chip
Heterogeneous Integration

PLANNED SESSIONS:

Substrate Technology
Polymer Materials & Processes
Novel Materials & Processes
Advanced Wirebond
Advanced Equipment for Additive Manufacturing
Flexible & Wearable Electronics

TRACK 6:
INTERACTIVE POSTER SESSION - "Posters & Pizza Lunch"

Technical sessions are being planned for these tracks, and abstracts will be considered on the session topic listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

If your abstract is selected, you will be asked to follow the speaker timeline: - Speaker Acceptance/Rejection (June 1, 2021); - First Paper to Peer Review (June 30, 2021); - Peer Review feedback to authors (July 26, 2021); - Final/corrected Papers (August 30, 2021); - Speaker must register before (September 10, 2021); - BIO due (September 17, 2021); Speaker Breakfast (morning of your session); and - Slides/Presentation ready (on/before October 8, 2021).



 Special Paper Recognition - Cash Awards Offered! 

 6 "Best of Track" Outstanding Papers  - Six (6) Cash Awards
Six "Best of Track" Winners will then be reviewed for...
 1 Best Paper of the Symposium  - One (1) additional Cash Award for a "Best of Track" Winner


 IMAPS Microelectronics Foundation Student Paper Awards 
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students



IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of IMAPS 2021 San Diego. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best Symposium this Fall and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Symposium are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all.