Live Virtual Workshop on Advanced System-in-Packag


IMAPS Live Virtual Workshop on


Wednesday, November 18, 2020 | 11:00am-2:30pm EASTERN | MS Teams


Technical Program    Registration


Event Description:
IMAPS Virtual workshops take attendees on a deeper dive into a particular topical area, for this meeting – ADVANCED SYSTEM-IN-PACKAGE (SiP) and related topics! Attendees will have an opportunity to pose questions to the speakers during this LIVE Virtual Workshop. The November 18th workshop features six technical speakers from ASE, Cadence, DuPont, and more. 

Workshop Program (Subject to Change):

11:00am-11:15amOpening Remarks

General Chair: Mark Gerber, ASE Group
11:15am-11:40amSiP Layout and Analysis Design Tool/Flow
John Park, Product Management Group Director, Cadence Design Systems
11:40am-12:05pm  LTCC/AIP
Brian Laughlin, PVAM 5G Technology Lead, DuPont
12:05pm-12:30pmHigh Performance Reliability of SiP Module by Mold Encapsulation with EMI Shielding
Vincent Liao (Kuo-Hsien Liao), ASE Group

12:30pm-1:15pmLunch Break
Live programming is paused for attendee lunch break on own.
2:30pmClosing Remarks

General Chair: Mark Gerber, ASE Group

Registration Details:
This virtual workshop will be hosted via MS Teams. Registrants will receive an email prior to the start of the webinar with login instructions. 

Student Members: $0
IMAPS Members: $100
Non-Members: $200 (inclusive of a one-year IMAPS membership)
Sponsorship: $500 (max 2)

Register Now