Live Virtual Workshop on Medical Microelectronics
IMAPS Live Virtual Workshop on
ADVANCED PACKAGING FOR MEDICAL MICROELECTRONICS
The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Live Virtual Workshop on Advanced Packaging and Business Outlook for Medical Microelectronics.. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. Attendees will be exposed to a wide variety of disciplines to encourage discussions involving technologies, products, strategies, market forecasts, and collaborations. This one-day virtual event presented live will draw invited experts in the fields of medicine, materials, devices, microelectronics, and semiconductor packaging.
Vern Stygar, Asahi Glass Company
Tim LeClair, Cerapax
Susan Bagen, MST; Rick Elbert, Cicor; Sophia Shi, Samsung Research America; Aric Shorey, Mosaic Microsystems
General Co-Chairs: Vern Stygar, Asahi Glass Company; Tim LeClair, Cerapax
|11:15am-11:40am||Impact of Fine Volume Adhesive Depositions Using Automated Jetting Systems in Medical Microelectronics Applications|
The rapid pace in the innovation and design of complex printed circuit boards with high density component packaging over the past 15 years has enabled the existence of cutting edge consumer electronic devices such as smartphones, wearable devices, tablets, etc. This has further broadened the technological innovation in medical device sector with availability of micro-scaled pacemakers, portable and wearable insulin monitoring systems, micro pump technology for heart recovery, portable ventilators and many more. These technology advancements present manufacturing and assembly challenges of PCBs and microelectronic components to adhere high standards of quality, reliability, portability, biocompatibility, and sterilization assessment. Dispensing process with main focus on jetting applications of adhesives has proven to be a potential solution to address assembly challenges and provide high quality throughout. Some applications such as conformal coating, encapsulation, etc. are widely used in medical device assembly.
Rajiv Iyer, Medtronic - Engineering Program Manager
Rajiv Iyer currently is a Program Manager at Medtronic, Inc. in the Greater Boston area and has been in the Medical Device industry for almost 3 years. He has more than 10 years of experience in the Electronics Manufacturing sector working as a Sr. Process Engineer for CAMLOT Dispensing Group at ITW EAE. He also graduated with a PhD in Industrial and Systems Engineering from State University of New York at Binghamton with his research focused towards micro-liter and nano-liter depositions using Jetting Systems in SMT assembly.
|11:40am-12:05pm||Embedding Process with High Density Silicon Capacitors for Enabling Next Level of Integration in Implantable Applications|
In the race for higher integration, one of the most promising assembly technologies is embedding. Passive components such as capacitors are widely used on electronic boards. Offering a solution to embed these components will help decreasing significantly the occupied board surface. Trials have been carried-out with ceramic or tantalum capacitors but showed limitations in terms of industrialization and reliability. Silicon capacitors are the ideal candidates providing mechanical advantages and high-rel levels while achieving high capacitance values. Stand-alone capacitors as well as capacitor array dies can be embedded in a FR4 board targeting implantable applications. First, we will introduce silicon capacitor technology followed by a discussion of the embedding approach used in this work. Then, we will present experimental results providing electrical measurements and reliability tests carried-out on a test vehicle. Cross sections have also been performed to validate the overall embedding stack. Finally, we will open the discussion to the integration roadmap.
Nicolas Normand, Murata Integrated Passive Solutions - R&D Engineer
Nicolas Normand received the B.S degree in microelectronics from the school of electronics Engineering, Ensicaen at Caen, France in 2006. Working as analog designer in integrated passive device technology, he spent 10 years of developing high integrated silicon interposer in the field of telecommunication, automotive, drilling and implantable devices. He is currently working with international research team to investigate and develop next generation in pacemakers, defibrillator or neuro-stimulator systems by proposing breakthrough in silicon passive component technologies. The today’s challenge is to propose analog passive device always smaller with high integrated possibilities and reliability while having superior electrical performances.
|12:05pm-12:30pm||Miniature Power Sources for Active Implanted Medical Devices|
Active implanted medical devices are going through a phase of rapid miniaturisation in order to be placed nearer to the targeted organs and by a shorter, less risky medical procedure. In addition, the development of sensing devices for Wireless Body Area Networks is opening opportunities for continuous health monitoring in the patient's home. Advances in ultra-low power electronic, small-size components and integrated packaging techniques make this shift in dimensions and functionalities possible in the area of neuromodulation (Vagus nerve, spinal cord, deep brain…) and implanted sensors (pulmonary pressure, smart orthopedics…). This paper describes developments in the area of solid state batteries (SSB) and their micro-electronics ecosystem: SSB are a novel type of miniature, mm-scale, energy storage component intended to power and be packaged efficiently into next-generation active implanted medical devices.
Denis Pasero, Ilika Technologies Ltd. - Product Commercialisation Manager
Denis Pasero joined Ilika Technologies in 2008, as a scientist specializing in battery technology, to manage commercial lithium ion projects. He became part of the Ilika team to apply his strong academic knowledge to commercial applications and saw the potential to be part of the development and success story of an enterprising smaller company with exciting technology and novel product ideas. Today, as Product Commercialization Manager, Denis interfaces between customers and technical teams.
|1:00pm-1:25pm||Glass Core Technology for Enabling Miniaturization and Next Generation Integration of Medical Devices|
As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. The inherent and consistent properties of glass has encouraged its selection as well suited substrate. The process steps required to reach this next generation of packaging technology with its fine feature sizes, transparency, and mechanical/electrical characteristics continue to mature. This presentation will overview the initial process steps including glass drilling, via filling, and RDL metallization on both top and bottom with examples of resulting products. Subsequent process steps in development show further promise for new applications as substrates and interposers for RF, integrated passives, microfluidics, advanced gyroscopes, and optical wave guides. As glass processing continues to mature, this cost effective and stable material continues to demonstrate unique value in many emerging markets and specifically In medical devices.
Steve Hillerich, Samtec Microelectronics – Product Manager
Steve Hillerich is a Mechanical Engineer and MBA who’s been with Samtec for 22 years. After designing automation for connector and cable assemblies, Steve migrated into helping customers solve their tricky custom applications. As Samtec has become a technology leader in this space, Steve has helped find and integrate new technologies within the broad Samtec portfolio. The tip of the spear for Samtec is Glass Core Technology and Steve is helping productize, define the roadmap, and listen to customer needs for these new and exciting products.
|1:25pm-1:50pm||Systematic Approach for Creating Medical Devices|
Over the past decade, the quest to design medical electronics that boast ever increasing capabilities while continuously decreasing their size and weight has led to the demand for new packaging solutions. As the need for more functionality in less real estate increased, standard electronics assembly processes are no longer satisfactory in many applications. Today, these applications call for a highly integrated packaging approach which often incorporates multiple functionalities into one package, especially the need for integration of microelectronics with chemistry and biologics in medical devices. With standard approaches for electronics product development, the time to the market for medical devices is too slow or too costly. An updated application of the System-in-a-package (SIP) approach that includes front-end integration of electronics, chemistry, and biologics processes can be the ideal solution.
One element in modern packaging is the use of new 3D structures and high-k dielectric materials. The second element is advanced packaging methods. New technologies such as chip-on-chip assemblies have been developed. The third element has been the progression in design tools that allow engineers to seamlessly design an overall, highly integrated system. The fourth element, testing, is often an expensive part of product development. With SIP technology that cost can be significantly lowered, making new product development economically more feasible.
In this paper we present a systematic approach to designing highly integrated and miniaturized medical device electronics packages. This approach enables rapid design, prototyping and time to production while achieving a new level of integration, miniaturization and reliability while positioning the medical device to meet regulatory requirements.
Tri Le, Microtek - President
Tri brings over 20 years of experience in science and technology development, system engineering and product design for the electronics industry. He has worked at TRW, Peregrine Semiconductor Corp., and NxGen Electronics. He holds an engineering degree from Harvey Mudd College and an Executive MBA from the UCLA Anderson School of Management specializing in Entrepreneurship.
|1:50pm-2:15pm||TITLE TBD -- Medical wearables|
Abstract coming soon.
Mark Poliks, Binghamton University
General Co-Chairs: Vern Stygar, Asahi Glass Company; Tim LeClair, Cerapax
This virtual workshop will be hosted via MS Teams. Registrants will receive an email prior to the start of the webinar with login instructions.
Student Members: $0*
*Student membership is now FREE!
IMAPS Members: $100
Non-Members: $200 (inclusive of a one-year IMAPS membership)