Live Virtual Workshop on Wire Bonding


IMAPS Live Virtual Workshop on
WIRE BONDING

www.imaps.org/wirebonding

Wednesday, May 5, 2021 
MS Teams


General Chair:
Mike McKeown, Hesse Mechatronics, Inc.

Co-Chair:
William Crockett, Tanaka Precious Metals


Register Here          Submit Abstract

Speaker Abstracts Due on/before:  MARCH 12, 2021
 
Overview:  The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Virtual Workshop on WIRE BONDING on May 5, 2021, using the Microsoft Teams Live Event software. The objective of the Wire Bonding Virtual Workshop is to have a unique forum that brings together scientists, engineers, manufacturing and academia people from around the world who have been working in the area of Wire Bonding.  This workshop has been specifically organized to allow for the presentation and debate of some of the latest technologies related to the use of Wire Bonding in semiconductor and microelectronic packaging. Abstracts will be considered for the following topics:
 
•           Wire bonding and bumping
•           Novel packaging and design
•           Failure Analysis and Reliability
•           Simulation and Modeling
 
 
Those wishing to present at the virtual workshop must submit a 200+ word abstract at www.imaps.org/wirebonding no later than MARCH 12, 2021. Please contact Brian Schieman (bschieman@imaps.org) if you have questions. Full papers are not required; 25-minute presentations normally make use of PowerPoint formats. A post-conference download containing the presentation material as supplied by the presenter will be distributed to attendees. 
 

Priced at $100 for IMAPS members, $200 for non-members. Attendance will be limited to maintain an interactive workshop atmosphere virtually.  A limited number of sponsorships will be available this year to encourage strong interaction between sponsors, speakers, and attendees. For further information and to submit abstracts or to register, visit www.imaps.org/wirebonding or email bschieman@imaps.org.


Registration Details: 

This virtual workshop will be hosted via MS Teams. Registrants will receive an email prior to the start of the webinar with login instructions. 

Attendee Registration:
Student Members: $0*
*Student membership is now FREE!
IMAPS Members: $100
IMAPS Early Career Members: $80
Non-Members: $200 (inclusive of a one-year IMAPS membership)

Register Here