Medical Microelectronics 2022

7th Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics

Town and Country Hotel, Mission Valley

San Diego, California
March 30-31, 2022 (new dates)


PLEASE JOIN US LIVE AND IN-PERSON FOR MEDICAL 2022!
Virtual options will be available for those unable to join us in San Diego.


General Co-Chairs:

Tim LeClair, Vitrix Labs, Inc. / Konstanin Yamnitskiy, Medtronic


Organizing Committee:

Vanessa Tolosa, Reality Labs (Meta Platforms, Inc.) / Rick Elbert, Cicor / Susan Bagen, MST Inc. / Rajiv Iyer, Medtronic


THANK YOU SPONSORS


The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on March 30 and March 31, 2022 at the Town & Country Hotel, San Diego, CA. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage discussions involving technologies, products, strategies, current and emerging markets, and collaborations.

    WEDNESDAY, MARCH 30

    8:00 AM - 6:00 PM

    8:00 AM - 8:45 AM

    8:45 AM - 9:00 AM

    Registration Open

    Breakfast

    Opening Remarks
    General Chairs: Tim LeClair, Vitrix Labs, Inc. and  Konstanin Yamnitskiy, Medtronic

    9:00 AM - 9:45 AM  Michael Fink

    KEYNOTE SPEAKER
    From "Ugly Duckling" to "Beautiful Swan", about the Challenges Encountered by Early Stage Enterprises and Mature Companies in their Relationship with Contract Manufacturing and Other Suppliers

    Early stage companies are sometimes surprised that contract manufacturers do not necessarily share their spontaneous enthusiasm for their new product ideas. And that they want money, sometimes even up front. And sometimes they are similarly "negatively impressed" by inquisitory questioning about realism of timelines, financial backing and maturity of the management team and the product design. We will investigate the respective motivations, expectations and the gaps between them. And we will try to establish a realistic view of both realities. In addition we will attempt to review of few important aspects of the regulatory environment, in particular the new Medical Device Regulation in Europe and, what it means for the OEM and the CMO. Last but not least we will close the loop on the options and supply chain or prototype decisions to be made along the way from "duckling" to "Swan".... hopefully a prospering and successful, now mature and fast growing enterprise. There are examples out there!  


    Michael Fink, GlobeTec | President

    After 15 years in executive functions in medical electronics contract manufacturing (MST, Dyconex AG), Michael Fink in 2020 started his own strategy consulting and interim management firm Globetec, supporting CMO's & OEMS. Prior to that he spent 22 years in a variety of management positions in the Semiconductor Equipment & Materials industry. Michael holds an M.S. in optical engineering from Cologne University of Applied Science.

    9:45 AM - 12:15 PM

    Session 1: NEW MEDICAL TECHNOLOGIES
    Session Chair: Susan Bagen, MST Inc.  

    9:45 AM - 10:15 AM
    Novel Vertical Stack Embedded Die Technology in Flexible Printed Circuit for Electronics Miniaturization in Medical Devices
    Josh Magnuson, Fujikura

    10:15 AM - 10:45 AM

    COFFEE BREAK WITH EXHIBITORS & SPONSORS

    Session 1 Continued

    10:45 AM - 11:15 AM
    Greater Reliability of Medical Devices Using Novel Low Concentration Chemistry for Defluxing of Cu-Pillar Bump Flip Chip 
    Ravi Parthasarathy, ZESTRON Americas

    11:15 AM - 11:45 AM
    Multimodal Sensing with Advanced Telemetry Components in Fan-out Flex Packages 
    PM Raj, Florida International University

    11:45 AM - 12:15 PM
    A Platform Technology for Paper Thin Bioelectronic Implants
    Susan Bagen, Micro Systems Technologies;  Eckardt Bihler, Dyconex

    12:30 PM - 2:00 PM

    LUNCH AND NETWORKING WITH EXHIBITORS & SPONSORS

    2:00 PM - 2:45 PM

    KEYNOTE SPEAKER
    SmartLenses: Needs, Opportunities, and Challenges

    Ophthalmic devices such as contact lenses and intraocular lenses are ubiquitous today and produced at massive scale. The core manufacturing and materials technologies for these devices have matured significantly, however, there are still many unmet patient needs. The simultaneous maturity of microelectronics miniaturization, assembly, and packaging technologies has opened the door to embedding electronic systems into such ophthalmic devices. We can now envision solving unmet needs in ophthalmology, and also enabling entirely new applications that are not possible with current passive devices. This talk will explore some of the unmet patient needs, market opportunities, and the unique engineering and biological challenges associated with building smart ocular technologies. 

    Kedar Shah, Verily Life Science | Engineering Lead, SmartLens Program

    Kedar joined Verily Life Sciences (formerly Google Life Sciences) in 2015 where he has held various engineering and program leadership roles on the accommodating contact lens, smart intraocular lens, neuromodulation, and retinal imaging programs. Prior to Alphabet, Kedar was a Principal Investigator in the Neurotechnology group at Lawrence Livermore National Lab where he developed microfabrication, assembly, and packaging technologies for retinal prostheses and neuromodulation devices for brain stimulation and recording. Kedar has a bachelor‘s degree in Engineering Science and Mechanics from Penn State University, and a Master‘s in Mechanical Engineering from University of California at Berkeley. 

    2:45 PM - 5:15 PM

    Session 2: ENHANCED IMPLANTABLES
    Session Chair: Konstanin Yamnitskiy, Medtronic

    2:45 PM - 3:15 PM
    Wireless mm-sized implants for neuromodulation using magnetoelectric materials 
    Josh Chen and Jacob Robinson, Rice University

    3:15 PM - 3:45 PM
    Thin film flexible circuits with embedded ASICs; Enabling technology for sophisticated medical applications 
    Rick Elbert and Alex Kaiser, Cicor Group

    3:45 PM - 4:15 PM

    COFFEE BREAK WITH EXHIBITORS & SPONSORS

    Session 2 Continued

    4:15 PM - 4:45 PM
    Advanced Micro-electronics Packaging for Wearables 
    Vikram Venkatadri, Analog Devices Inc.

    4:45 PM - 5:15 PM
    Advanced IC Packaging and Assembly for New Medical Capabilities
    Doug Hackler, American Semiconductor

    5:15 PM - 6:30 PM

    HAPPY HOUR WITH EXHIBITORS & SPONSORS

    THURSDAY, MARCH 31

    8:00 AM - 5:00 PM

    8:00 AM - 8:45 AM

    8:45 AM - 9:00 AM

    Registration Open

    Breakfast

    Opening Remarks
    General Chairs: Tim LeClairVitrix Labs, Inc. and  Konstanin Yamnitskiy, Medtronic

    9:00 AM - 9:45 AM

    Gert Cauwenberghs


    KEYNOTE SPEAKER
    High-Density Integrated Silicon Neural Interfaces

    The convergence of neurotechnology and adaptive machine intelligence onto low-power silicon integrated systems offers opportunities to advance the effectiveness, efficiency, affordability, and comfort of mobile brain-computer interfaces for human-machine communication and neural prosthetics.  I will highlight advances and current trends in the miniaturization and integration of neural interfaces with embedded active electronics, ranging from unobtrusive wearable systems for whole-brain electroencephalography to implantable silicon integrated circuits for probing and controlling neural activity at near-cellular resolution.  These include fully integrated brain-computer-interface-on-chips for neural stimulation and recording with up to 1,024 electrodes operating at less than 1uW per channel for 1uVrms input-referred noise voltage sensitivity over 12.5kHz bandwidth, and 20fArms current sensitivity over 100Hz bandwidth.  The scale and density of these neurotechnologies present unique challenges and opportunities for hermetically sealed encapsulation and integration onto flexible, compliant and biocompatible substrates.  I will also discuss implications of these advances and related developments in body area networks to new and emerging applications of pervasive neural interfaces for closed-loop neurological monitoring and neurofeedback therapy.

    Gert Cauwenberghs, UC San Diego | Professor of Bioengineering & Co-Director of the Institute for Neural Computation

    Gert Cauwenberghs is Professor of Bioengineering and Co-Director of the Institute for Neural Computation at UC San Diego.  He received the Ph.D. in Electrical Engineering from Caltech in 1994, and was previously Professor of Electrical and Computer Engineering at Johns Hopkins University, and Visiting Professor of Brain and Cognitive Science at MIT.  His research focuses on neuromorphic engineering, adaptive intelligent systems, neuron-silicon and brain-machine interfaces, and micropower biomedical instrumentation.  He is a Fellow of the Institute of Electrical and Electronic Engineers (IEEE) and the American Institute for Medical and Biological Engineering (AIMBE), and a Francqui Fellow of the Belgian American Educational Foundation.  He received NSF CAREER, ONR Young Investigator Program and White House PECASE awards.  He served IEEE in a variety of roles including as Distinguished Lecturer of the Circuits and Systems Society and Editor-in-Chief of the IEEE Transactions on Biomedical Circuits and Systems.

    9:45 AM - 12:15 PM

    Session 3: NEURO DEVICES AND CONNECTORS
    Session Chair: Rajiv Iyer, Medtronic


    9:45 AM - 10:15 AM
    Advanced High-Channel-Density Implantable Connectors: Effect of Parameters Impacting Electrical-Isolation Performance
    Paritosh Rustogi and Jack Judy, University of Florida

    10:15 AM - 10:45 AM

    COFFEE BREAK WITH EXHIBITORS & SPONSORS

    Session 3 Continued

    10:45 AM - 11:15 AM
    Minimally Invasive Brain Implant 
    Mark Hettick, Precision Neuroscience

    11:15 AM - 11:45 AM
    Development and Clinical Translation of a 4096 Channel Microelectrode Array 
    Shadi Dayeh, University of California-San Diego

    11:45 AM - 12:15 PM
    Flex Circuit Design for a Steerable Ablation Probe 
    Eron Flory, Medtronic; Josh Defosset, Supira Medical a Shifamed Company

       
    12:15 PM - 2:00 PM

    LUNCH AND NETWORKING WITH EXHIBITORS & SPONSORS

    2:00 PM - 4:00 PM

    Session 4: MATERIALS, GLASS, POLYMERS, GETTERS
    Session Chairs: Rick Elbert, Cicor & Tim LeClair, Vitrix Labs, Inc.


    2:00 PM - 2:30 PM
    Ultra-Active Antimicrobial Copper with a 100% Deactivation Rate in 30-60 Seconds
    Alfred Zinn, Kuprion Inc.

    2:30 PM - 3:00 PM
    Evaluations of Cleanable No-clean Lead-free Solder Paste
    Jasbir Bath, Koki Solder America Inc.

    3:00 PM - 3:30 PM
    Film Based Moisture Absorbers for Implantable Devices 
    Michael Previti, MacDermid Alpha Electronics Solutions

    3:30 PM - 4:00 PM
    Getter Technology for Improving Medical Implantable Device Package Reliability 
    Hua Xia and David DeWire, Hermetic Solutions Group



    CLOSING REMARKS


    IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of the IMAPS 2022 Medical Workshop in San Diego. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best event in January and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Workshop are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all. Speakers that cannot attend to present in person will have virtual options for delivering their technical presentations at the Workshop. 

    REGISTRATION

    Early registration discounts end March 4, 2022.

       REGISTER   

    Registration TypeEarly (by Mar. 4)Mar. 5 and after
         Member$695$795
         Nonmember$795$895
         Speaker/Chair$395$495
         Student$100$200
    Tabletop Exhibit (includes 1 booth personnel badge; additional discounted full badges available to exhibitors at $450/person)$850$950
    Sponsorship (includes: 1 tabletop exhibit in the session room with 2 exhibit badges, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program; additional discounted full badges available to sponsors at $350/person)$1750

    HOTEL INFORMATION

    Town and Country Resort
    500 Hotel Circle North
    San Diego, CA  92108

    Single/Double: $205 per night + taxes/fees

    Click here for hotel reservations at the discounted rate.

    Booking in the Block

    IMAPS sincerely appreciates your support by staying at the Town &  Country Hotel.  We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants. 

    • Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel
    • Easily accessible — staying in the host hotel means less travel time and overall convenience

    SPONSORS AND EXHIBITORS

    Cicor Group

    (Sponsor and Exhibitor)

    Hermetic Solutions Group

    (Sponsor and Exhibitor)

    Hybond

    (Sponsor and Exhibitor)

    Micro Systems Technologies, Inc.

    (Sponsor and Exhibitor)

    Promex Industries

    (Sponsor and Exhibitor)

         TABLETOP EXHIBITORS     

    AGC
    AT&S AG
    Finetech
    Oneida Research Services, Inc.
    Teikoku Taping System Inc.