Medical Microelectronics 2023
8th Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics
Westin San Diego Bayview
San Diego, California
February 2-3, 2023
PLEASE JOIN US LIVE AND IN-PERSON FOR MEDICAL 2023!
Tim LeClair, Vitrix Labs, Inc. / Konstanin Yamnitskiy, Medtronic
Organizing Committee:
Susan Bagen, Consultant / Rick Elbert, Cicor / Rajiv Iyer, Medtronic /
Nakul Kothari, Qualcomm / Vern Stygar, Asahi Glass / Vanessa Tolosa, Facebook Reality Labs
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on February 2-3, 2023 at the Westin San Diego Bayview Hotel. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage discussions involving technologies, products, strategies, current and emerging markets, and collaborations. This two-day event will draw invited experts in the fields of medicine, medical devices, biomaterials, microelectronics, semiconductor packaging, and product assembly.
THANK YOU TO OUR WORKSHOP SPONSORS
THANK YOU TO OUR ADDITIONAL TABLETOP EXHIBITORS
AGC Corp.
AT&S Austria Technologie & Systemtechnik AG
Bayflex Solutions
Cicor Group
Materion
This Workshop will feature exhibitor tabletops ($850-950) and sponsor tabletops ($1750). A maximum of 12 total tabletop spaces will be available inside the session room around the perimeter of the room. Tabletops and sponsorships are still available - REGISTER ONLINE
PROGRAM
Tabletop exhibits will be located around the perimeter of the session room for the entire workshop. Exhibits will be "open" during the full hours of the workshop as listed in our program, but we ask all attendees and exhibitors to use the breakfast, break, lunch, and reception break times for all networking. | |||
Thursday, Feb 2 | |||
Implantables | |||
Medical Workshop Held in the Crystal Ballroom 1 | |||
8:00AM | Breakfast (Diamond Room) | ||
8:00AM | Registration | ||
8:45AM | Opening Remarks - Workshop General Chairs Tim LeClair, Vitrix Labs, Inc. / Konstanin Yamnitskiy, Medtronic | ||
9:00AM | KEYNOTE: SUPPLY CHAIN AND THE ELECTRONIC COMPONENT CRISIS The keynote will start with an overview of the electronics (mainly semiconductors) marketplace and how we got where we are today - Crisis. The presentation will drill down more into the Medical marketplace and adjacent marketplaces as well. Then the speaker will share forward looking projections of where we are headed. After that the presentation will discuss mitigation efforts such as reactive, proactive and predictive measures. From there the speaker will discuss new challenges - labor, geopolitical etc. and how we approach solutions for these challenges, and will plan to end with some Q&A. Patrick Walker, Medtronic PLC | Sr. Director Electronics - Global Category Management
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9:45AM | Silicon Integrated Passive Components: Key Benefits for Implantable Medical Applications Faycal Mounaim, Murata (Leruez Sebastien, Nicolas Normand) | ||
10:15AM | Coffee Break | ||
10:45AM | Sponsor Presentation 1 - MURATA | ||
10:50AM | Advancing Cochlear Implants: Design and Manufacturing Challenges Razi-ul Haque, Lawrence Livermore National Laboratory | ||
11:20AM | Medical Device Miniaturization – Think Big with Small Flexible Substrates Jason Doyle, DYCONEX AG | ||
11:50AM | High-Channel-Density Implantable-Connector Technology Paritosh Rustogi, University of Florida | ||
12:20PM | Lunch (Diamond Room) | ||
Materials and Assembly | |||
2:00PM | KEYNOTE: HETEROGENEOUS INTEGRATION ENABLES NEW FUNCTIONALITY IN MEDICAL AND BIOTECH DEVICES Continuous advances in medical technology, biotech, microelectronics and information processing are converging to enable a broadening range of devices that can diagnose, analyze and treat medical conditions. These devices incorporate not only electronics but also parts that interact with a patient and their environment to gather and analyze data to report the results to patients and medical professional. Manufacturing these heterogeneously assembled devices requires developing processes that are compatible with these parts and their distinctive characteristics. This talk will address the issues that arise during this process development and examine the exciting possibilities that are becoming viable thanks to miniaturization and other trends. Richard Otte, Promex Industries | President & CEO
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2:45PM | Case Study for Yield Improvment Valtronic | ||
3:15PM | Innovative, Biocompatible Carriers and Packaging for Advancing the Throughput of Delicate, High-Value Medical Microelectronics Victoria Tran, Delphon | ||
3:45PM | Coffee Break | ||
4:15PM | Sponsor Presentation 2 - PROMEX | ||
4:20PM | Ultra-thin Flexible ICs for Smart Contacts Doug Hackler, American Semiconductor (Liana Jackson, Randall Parker) | ||
4:50PM | Advancements in Flexible Hybrid Materials Testing for Medical Applications Doug Hackler, American Semiconductor (Michael Myers, American Semiconductor; Robert Hopkins, Bayflex Solutions) | ||
5:30 - 6:30PM | Happy Hour with the Exhibitors | ||
6:30PM - 7:30PM | IMAPS SAN DIEGO CHAPTER MEETING The San Diego Chapter will hold it's first technical meeting of 2023, featuring a presentation from Dr. Beth Keser, IMAPS President. Attendees from the Medical and Wire Bonding Workshops are invited to attend. San Diego Chapter members are encouraged to come early and visit our exhibitors during each workshop's happy hour reception as well. The Future of Electronic Packaging Beth Keser, Ph.D. **** | ||
Friday, Feb 3 | |||
Diagnostic Devices and Techniques | |||
Medical Workshop Held in the Crystal Ballroom 1 | |||
8:00AM | Breakfast (Diamond Room) | ||
8:00AM | Registration | ||
8:45AM | Day Two Opening Remarks - Workshop General Chairs Tim LeClair, Vitrix Labs, Inc. / Konstanin Yamnitskiy, Medtronic | ||
9:00AM | KEYNOTE: UNLOCKING THE POWER OF HIGH PLEX PROTEOMIC In Shane’s presentation, he will provide an overview of the proteomics field at large and the technology SomaLogic and his team are developing today. Shane Bowen, SomaLogic | Vice President, Technology Dev. & General Manager
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9:45AM | Advanced Benchtop Laser Microscopic Instruments for Disease Diagnostics Sam Crivello, KnightLight Consulting | ||
10:15AM | Coffee Break | ||
10:45AM | Sponsor Presentation 3 - VALTRONIC | ||
10:50AM | Minimally-Invasive Neural Interfaces: Prospects and Challenges at High Electrode Density Mark Hettick, Precision Neuroscience Corp. | ||
11:20AM | Precision Plastics for Hearing Aid Devices Rick Elbert, Cicor Group | ||
11:50AM | Platform Development Strategy for Implantable Neuromodulation Devices Andrew Kelly, Cirtec Medical | ||
12:20PM | Sponsor Presentation 4 - MST![]() | ||
12:30PM | Lunch (Diamond Room) | ||
Medical Products Business Forecasts | |||
2:00PM | KEYNOTE: GLASS CORE TECHNOLOGY FOR ENABLING MINIATURIZATION AND NEXT GENERATION INTEGRATION OF MEDICAL DEVICES As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. The inherent and consistent properties of glass has encouraged its selection as a well suited substrate. The process steps required reach this next generation of packaging technology with its fine feature sizes, transparency, and mechanical/electrical characteristics continue to mature. The family of glass core products is poised to offer this link to the next generation of packaging technology with to its fine feature sizes, transparency, and mechanical/electrical characteristics. Metalizing glass core products is not trivial but Samtec has a method for drilling holes and creating robust and reliable through glass vias. We can also metalize top and bottom faces of the glass to create circuits which can be used as substrates, interposers, RF components, embedded component, and microfluidics and optical wave guides. As glass processing continues to mature, this cost effective and stable material continues to demonstrate unique value in many emerging markets and specifically In medical devices. Steve Hillerich, Samtec Microelectronics | Product Manager
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2:45PM | Medical Device Applications of Glass Wafers and Components | ||
3:15PM | Advanced Biocompatible and Sustainable Sensing Platform | ||
3:45PM | Closing Remarks - Workshop General Chairs | ||
REGISTRATION
Early registration discounts end January 16, 2023.
Registration Type | Early (on/before Jan. 16) | After Jan. 16 |
Member | $695 | $795 |
Nonmember | $895 | $995 |
Speaker/Chair | $495 | $595 |
Student | $100 | $200 |
Tabletop Exhibit (includes 1 booth personnel badge; additional discounted full badges available to exhibitors at $450/person) | $850 | $950 |
Sponsorship (includes: 1 tabletop exhibit in the session room with 2 exhibit badges, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program; additional discounted full badges available to sponsors at $350/person) | $1750 |
HOTEL INFORMATION
WESTIN SAN DIEGO BAYVIEW
400 WEST BROADWAY
SAN DIEGO, CALIFORNIA, USA, 92101
IMAPS Room Rate: $239/night + taxes and fees
Call the hotel directly at 619-239-4500
BOOK YOUR ROOM WITH THE IMAPS GROUP RATE
Hotel Shuttle Services to/from SAN Airport
In-room Internet Access Included
Parking is Additional - Local garages available as well
HOTEL RESERVATION DEADLINE:
JANUARY 16, 2023
Upon reservation, guests must make a deposit for the first night's room reservation. Guests must cancel before 72 hours before the scheduled check-in date or the hotel will charge for 1 night.
Booking in the Block
IMAPS sincerely appreciates your support by staying at the host hotel. We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants.
- Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel
- Easily accessible — staying in the host hotel means less travel time and overall convenience