Breakfast   (Diamond Room)

KEYNOTE: SUPPLY CHAIN AND THE ELECTRONIC COMPONENT CRISIS

The keynote will start with an overview of the electronics (mainly semiconductors) marketplace and how we got where we are today - Crisis.  The presentation will drill down more into the Medical marketplace and adjacent marketplaces as well. Then the speaker will share forward looking projections of where we are headed.  After that the presentation will discuss mitigation efforts such as reactive, proactive and predictive measures. From there the speaker will discuss new challenges - labor, geopolitical etc. and how we approach solutions for these challenges, and will plan to end with some Q&A. 

Patrick Walker, Medtronic PLC | Sr. Director Electronics - Global Category Management

Patrick is responsible for leading the global category teams that provide strategic direction and process excellence for all Electronics and Electronic Assemblies used on our medical devices across Medtronic.  At the world’s largest medical device company, Patrick’s teams value proposition is to delivery best in class total cost solutions and drive category strategies that support the Medtronic Mission that impacts over 75 million patients worldwide.  Prior to joining Medtronic in April 2009, Patrick was with Honeywell for 17 yrs and led supply management teams in various businesses that included: Industrial Automation Controls in the oil and gas industry, Wafer fabrication materials for the semiconductor manufacturing industry, and vertically integrated sensor manufacturing for various Honeywell segments.  As the director of supply management for the Sensing and Controls (S&C) Business he had functional responsibility for direct and indirect materials for over 19 plants that focused in automotive, aerospace, and industrial sensors.       Patrick earned both his BS in Operations Production Management and Procurement and his MBA from Arizona State University.

Sponsor Presentation 1 - MURATA

 NeuroStone(TM) Freeform Interconnection Ceramic Device

KEYNOTE: HETEROGENEOUS INTEGRATION ENABLES NEW FUNCTIONALITY IN MEDICAL AND BIOTECH DEVICES

Continuous advances in medical technology, biotech, microelectronics and information processing are converging to enable a broadening range of devices that can diagnose, analyze and treat medical conditions. These devices incorporate not only electronics but also parts that interact with a patient and their environment to gather and analyze data to report the results to patients and medical professional. Manufacturing these heterogeneously assembled devices requires developing processes that are compatible with these parts and their distinctive characteristics. This talk will address the issues that arise during this process development and examine the exciting possibilities that are becoming viable thanks to miniaturization and other trends. 

Richard Otte, Promex Industries | President & CEO

Mr. Otte has been President & CEO of Promex Industries Inc. since 1995.  Promex is an ISO 9001:2015, ISO  13485:2016 and ITAR registered manufacturing services company that specializes in the onshore mixed technology assembly of medical, biotech and semiconductor devices in its facilities in Santa Clara and Escondido California (DBA QP Technologies). Prior to that he was the General Manager of AMP’s Kaptron Optical Products Subsidiary and President of Advanced Packaging Systems, a Raychem-Corning Joint Venture.  Earlier in his career Mr. Otte was an electronic engineer, Program Manager and Raychem Division Manager. Otte is a member of the MIT Communication Technology Roadmap advisory Board. Over 75 patents issued throughout the world list Otte as an inventor.  He has a BSEE and an MSEE from MIT and an MBA from Harvard University.

  IMAPS SAN DIEGO CHAPTER MEETING  

The San Diego Chapter will hold it's first technical meeting of 2023, featuring a presentation from Dr. Beth Keser, IMAPS President. Attendees from the Medical and Wire Bonding Workshops are invited to attend. San Diego Chapter members are encouraged to come early and visit our exhibitors during each workshop's happy hour reception as well. 

The Future of Electronic Packaging
Recently, multiple application spaces including high performance compute (HPC), autonomous driver-assistance systems (ADAS) and automotive, 5G/6G, internet of things (IoT)/MEMS/sensors require the combining chips to create new competitive and reliable product solutions. These applications, whether driven by performance, form factor, or cost require packaging solutions where distinctly different chips can be integrated into a package or system. This talk will explore the current and future challenges of these growing application spaces, the future electronic packaging technologies required to meet these challenges and the skillsets that are needed to be successful.

Beth Keser, Ph.D. 
IMAPS President
BETH KESER, Ph.D., IMAPS President & IEEE Fellow, a recognized global leader in the semiconductor packaging industry with over 25 years of experience, received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 41 U.S. patents and patents pending and over 50 publications in the semiconductor industry. Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department in the Product Enablement Solutions Group.

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Chapter Members can REGISTER ONLINE by selecting the chapter visitor option, if not all ready registered for the workshops. This registration type only allows access to the chapter meeting and happy hours - not the technical sessions.

KEYNOTE: UNLOCKING THE POWER OF HIGH PLEX PROTEOMIC

In Shane’s presentation, he will provide an overview of the proteomics field at large and the technology SomaLogic and his team are developing today.

Shane Bowen, SomaLogic | Vice President, Technology Dev. & General Manager

Following earning his M.S. in Applied Physics and Ph.D. in Physical Chemistry from UC San Diego, Shane began his career in 2005 as a System Scientist working for TCZ, a joint-venture between Cymer and Zeiss, building equipment and processes used in the manufacturing of flat-panel displays. In 2007, he joined illumina as a Research Scientist, where he spent the next twelve and a half years developing technologies used throughout the most successful genotyping and DNA sequencing platforms on the planet. Shane was one of the key inventors of the chemical patterning technology that brought the $1000 genome to market in 2014 and championed the Nanofabrication division within illumina, driving many of the core innovations employed in sequencing today. In early 2020, Shane stepped away from illumina and co-found Palamedrix, a company focused on ushering in a new era of tools for quantitative proteomics. Serving as CEO for nearly 3 years, he led a successful exit with Palamedrix being acquired by SomaLogic, where Shane now leads the Technology Development division and serves as General Manager of their San Diego facility.

KEYNOTE: GLASS CORE TECHNOLOGY FOR ENABLING MINIATURIZATION AND NEXT GENERATION INTEGRATION OF MEDICAL DEVICES
Steve Hillerich, Samtec

As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. The inherent and consistent properties of glass has encouraged its selection as a well suited substrate. The process steps required reach this next generation of packaging technology with its fine feature sizes, transparency, and mechanical/electrical characteristics continue to mature. The family of glass core products is poised to offer this link to the next generation of packaging technology with to its fine feature sizes, transparency, and mechanical/electrical characteristics. Metalizing glass core products is not trivial but Samtec has a method for drilling holes and creating robust and reliable through glass vias. We can also metalize top and bottom faces of the glass to create circuits which can be used as substrates, interposers, RF components, embedded component, and microfluidics and optical wave guides. As glass processing continues to mature, this cost effective and stable material continues to demonstrate unique value in many emerging markets and specifically In medical devices.

Steve Hillerich, Samtec Microelectronics | Product Manager

Steve Hillerich is a Mechanical Engineer and MBA who’s been with Samtec for 24 years. After designing automation for connector and cable assemblies, Steve migrated into helping customers solve their tricky custom applications. As Samtec has become a technology leader in this space, Steve has helped find and integrate new technologies within the broad Samtec portfolio. The tip of the spear for Samtec is Glass Core Technology and Steve is helping productize, define the roadmap, and listen to customer needs for these new and exciting products.

Medical Device Applications of Glass Wafers and Components
Vern Stygar, AGC Corp.

Advanced Biocompatible and Sustainable Sensing Platform
Ahyeon Koh, Binghamton University