IMAPS Advanced Technology Workshop on
STRATEGIES TO REVITALIZE THE
ON-SHORE PACKAGING AND ASSEMBLY DEFENSE INDUSTRIAL BASE
October 3, 2022
Hynes Convention Center
900 Boylston St
Boston, MA 02115
Co-located with IMAPS 2022 Symposium.
Chris Riso, Booz Allen Hamilton Inc.
Mark Dimke, Sandia National Labs | Dave Shahin, Northrop Grumman
Speakers by Invitation Only
Overview: The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve On-Shore Packaging and Assembly Capabilities on Monday, October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts. This workshop will be followed by the IMAPS 2022 Symposium, October 3-6 at the same location. The mission of this workshop is to engage our workforce community to identify solutions, which address US Government and Defense requirements, critical to the onshoring of the microelectronic assembly and packaging supply chain.
Please view the Technical Program below which features: a SHIP keynote speaker and SHIP program speakers, plus several breakout sessions with speakers focused on Substrates & Materials Manufacturing, Enabling & Disruptive Technologies, Reliability, and Heterogeneous Integration, as well as two panel sessions on the Defense Industrial Base (DIB) Ecosystem, and Workforce Development.
|MONDAY, OCTOBER 3|
|8:00am-8:15am||Opening Remarks: Workshop Chairs (Hynes Convention Center Room 210)|
KEYNOTE & SHIP SESSION
Session Chair: Chris Riso, Booz Allen Hamilton Inc.
KEYNOTE: DoD’S STATE-OF-THE-ART (SOTA) HETEROGENEOUS INTEGRATED PACKAGING (SHIP) PROGRAM
Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics
John Sotir, Intel
Ted Jones, Qorvo
|9:35am-10:00am||The Evolution of Moore's Law through Chipletized Architectures |
Tony Trinh, Mercury Systems
|10:00am-10:30am||SHIP SESSION Q&A|
PANEL DISCUSSION: DEFENSE INDUSTRIAL BASE (DIB) ECOSYSTEM
Helen Phillips, Northrop Grumman – Director Advanced Operations
Anthony Bednarz, Lockheed Martin – Engineering Project Manager, Advanced Sensors
Susan Trulli, Raytheon Technologies, RMD Advanced Microelectronics Solutions, Principal Engineering Fellow
Jim Vandevere, BRIDG
|SESSIONS||SESSION 1: SUBSTRATES & MATERIALS MANUFACTURING|
Dave Shahin, Northrop Grumman
(Hynes Convention Center Room 210)
SESSION 2: ENABLING & DISRUPTIVE TECHNOLOGIES
Organic Substrate Process and Commercial Practices
|Co-Packaged Optics (CPO) of Silicon Photonics Optical I/O Chiplet|
Steve Groothuis, Ayar Labs
Advances in Glass Interposers for (Beyond) 5G mmW Communications
Madhavan Swaminathan, Georgia Tech
Design and Manufacturing for Additive and Flexible Electronics
Patricia Beck, NextFlex
Panel Discussion: Onshoring Advanced Substrates & Materials
Meredith LaBeau, Calumet Electronics;
Habib Hichri, Ajinomoto USA;
Mike Gleason, GreenSource Fabrication;
Jim Haley, EMD Group;
John Swanson, MacDermidAlpha
Wafer Scale 3DHI for Next Generation RF Electronics
Jeff Herd, MIT Lincoln Laboratory
Heterogenous Electronic and Photonic Multi-Chip Module Platforms
Dave Kharas, MIT Lincoln Laboratory
|SESSIONS||SESSION 3: RELIABILITY|
Brandon Hamilton, Booz Allen Hamilton, Inc.
(Hynes Convention Center Room 210)
SESSION 4: HETEROGENEOUS INTEGRATION
|2:50pm-3:15pm||Advanced Packaging Needs and Issues in Perspective of High-reliability Space Applications|
Eric Suh, NASA JPL
When Chips Become SystemsJohn Park, Cadence
|3:15pm-3:40pm||Low Volume, High Mix R&D and High-Reliability Production|
Scott List, Sandia National Labs.
Heterogeneous Integration of III-V Devices: Successes and ChallengesJohn Lannon, Micross
Design for Manufacturing: Package Design Cleaning Compatibility for High Reliability Electronic AssemblyTim Pearson, Collins
Establishing Domestic Heterogeneous Integration Capability
Alan Huffman, SkyWater Technology; Tim Olson, Deca Technologies
PANEL DISCUSSION: WORKFORCE DEVELOPMENT (Hynes Convention Center Room 210)
Jim Vandevere, BRIDG
with IMAPS 2022 Symposium
All Workshop Attendees Invited!
(Hynes Convention Center 2nd Floor Boylston Hallway)
Hotel reservation deadline: September 2, 2022
Cancellations must be received 3-days (72 hours) prior to confirmed arrival date to avoid penalty fee equal to one night's room and tax.
Booking in the Block
IMAPS sincerely appreciates your support by staying at the Sheraton Boston Hotel. We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants.
Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel
Easily accessible — staying in the host hotel means less travel time and overall convenience
ONLINE REGISTRATION OPEN for the following attendee registration categories. Early registration fees expire on September 2, 2022.
|Workshop Sponsorship (includes: 2 attendee registrations, full-page advertisement in program, logo/advertisement on event webpages, additional discounted full badges available to sponsors at $400/person)||$3000|
|Break Sponsorship (includes: logo on event webpages & program, discounted full badges available to sponsors at $500/person)||$1200|
There are two ways to register for the Workshop on On-shoring.
- On-shoring Registration Only – If you will only be attending the Workshop on On-shoring on October 3,
- On-shoring plus IMAPS 2022 Symposium Registration – If you register for both the Workshop on On-shoring and IMAPS 2022 Symposium, you receive a $150 discount on the On-shoring registration (students receive $25 discount). Please note that Professional Development Courses (PDCs) are the same date and time of On-shoring, so you will not be able to register for PDCs.