Onshoring Workshop
IMAPS Advanced Technology Workshop on
STRATEGIES TO REVITALIZE THE
ON-SHORE PACKAGING AND ASSEMBLY DEFENSE INDUSTRIAL BASE
October 3, 2022
Hynes Convention Center
900 Boylston St
Boston, MA 02115
Co-located with IMAPS 2022 Symposium.
General Co-Chairs:
Chris Riso, Booz Allen Hamilton Inc.
Organizing Committee:
Mark Dimke, Sandia National Labs | Dave Shahin, Northrop Grumman
Speakers by Invitation Only
Overview: The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve On-Shore Packaging and Assembly Capabilities on Monday, October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts. This workshop will be followed by the IMAPS 2022 Symposium, October 3-6 at the same location. The mission of this workshop is to engage our workforce community to identify solutions, which address US Government and Defense requirements, critical to the onshoring of the microelectronic assembly and packaging supply chain.
Please view the Technical Program below which features: a SHIP keynote speaker and SHIP program speakers, plus several breakout sessions with speakers focused on Substrates & Materials Manufacturing, Enabling & Disruptive Technologies, Reliability, and Heterogeneous Integration, as well as two panel sessions on the Defense Industrial Base (DIB) Ecosystem, and Workforce Development.
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| MONDAY, OCTOBER 3 | |
| 7:00am-5:30pm | Registration Open |
| 7:00am-8:00am | Breakfast |
| 8:00am-8:15am | Opening Remarks: Workshop Chairs (Hynes Convention Center Room 210) |
| SHIP SESSION | KEYNOTE & SHIP SESSION Session Chair: Chris Riso, Booz Allen Hamilton Inc. |
| 8:15am-8:45am | KEYNOTE: DoD’S STATE-OF-THE-ART (SOTA) HETEROGENEOUS INTEGRATED PACKAGING (SHIP) PROGRAM Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics |
| 8:45am-9:10am | SHIP DIGITAL John Sotir, Intel |
| 9:10am-9:35am | SHIP RF Ted Jones, Qorvo |
| 9:35am-10:00am | The Evolution of Moore's Law through Chipletized Architectures Tony Trinh, Mercury Systems |
| 10:00am-10:30am | SHIP SESSION Q&A |
| 10:30am-11:00am | Break |
| 11:00am-12:00pm | PANEL DISCUSSION: DEFENSE INDUSTRIAL BASE (DIB) ECOSYSTEM Panelists: Helen Phillips, Northrop Grumman – Director Advanced Operations Anthony Bednarz, Lockheed Martin – Engineering Project Manager, Advanced Sensors Susan Trulli, Raytheon Technologies, RMD Advanced Microelectronics Solutions, Principal Engineering Fellow Jim Vandevere, BRIDG |
| 12:00pm-1:00pm | Lunch |
| SESSIONS | SESSION 1: SUBSTRATES & MATERIALS MANUFACTURING Session Chair: Dave Shahin, Northrop Grumman (Hynes Convention Center Room 210) | SESSION 2: ENABLING & DISRUPTIVE TECHNOLOGIES |
| 1:10pm-1:35pm | Organic Substrate Process and Commercial Practices | Co-Packaged Optics (CPO) of Silicon Photonics Optical I/O Chiplet Steve Groothuis, Ayar Labs |
| 1:35pm-2:00pm | Advances in Glass Interposers for (Beyond) 5G mmW Communications Madhavan Swaminathan, Georgia Tech | Design and Manufacturing for Additive and Flexible Electronics Patricia Beck, NextFlex |
2:00pm-2:50pm | Panel Discussion: Onshoring Advanced Substrates & Materials Meredith LaBeau, Calumet Electronics; Habib Hichri, Ajinomoto USA; Mike Gleason, GreenSource Fabrication; Jim Haley, EMD Group; John Swanson, MacDermidAlpha | 2:00pm-2:25pm Wafer Scale 3DHI for Next Generation RF Electronics Jeff Herd, MIT Lincoln Laboratory |
2:25pm-2:50pm Heterogenous Electronic and Photonic Multi-Chip Module Platforms Dave Kharas, MIT Lincoln Laboratory | ||
| SESSIONS | SESSION 3: RELIABILITY Session Chair: Brandon Hamilton, Booz Allen Hamilton, Inc. (Hynes Convention Center Room 210) | SESSION 4: HETEROGENEOUS INTEGRATION |
| 2:50pm-3:15pm | Advanced Packaging Needs and Issues in Perspective of High-reliability Space Applications Eric Suh, NASA JPL | When Chips Become Systems John Park, Cadence |
| 3:15pm-3:40pm | Low Volume, High Mix R&D and High-Reliability Production Scott List, Sandia National Labs. | Heterogeneous Integration of III-V Devices: Successes and Challenges John Lannon, Micross |
| 3:40pm-4:05pm | Design for Manufacturing: Package Design Cleaning Compatibility for High Reliability Electronic Assembly Tim Pearson, Collins | Establishing Domestic Heterogeneous Integration Capability Alan Huffman, SkyWater Technology; Tim Olson, Deca Technologies |
| 4:05pm-4:30pm | Break | |
| 4:30pm-5:30pm | PANEL DISCUSSION: WORKFORCE DEVELOPMENT (Hynes Convention Center Room 210) Panelists: Jim Vandevere, BRIDG |
| 5:30pm | Closing Remarks |
| 5:30pm-7:00pm | WELCOME RECEPTION with IMAPS 2022 Symposium All Workshop Attendees Invited! (Hynes Convention Center 2nd Floor Boylston Hallway) |
HOTEL
Hotel reservation deadline: September 2, 2022
CANCELLATION POLICY
Cancellations must be received 3-days (72 hours) prior to confirmed arrival date to avoid penalty fee equal to one night's room and tax.
Booking in the Block
IMAPS sincerely appreciates your support by staying at the Sheraton Boston Hotel. We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants.
Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel
Easily accessible — staying in the host hotel means less travel time and overall convenience
REGISTRATION
ONLINE REGISTRATION OPEN for the following attendee registration categories. Early registration fees expire on September 2, 2022.
| Registration Type | Early (by Sept. 2) | Sept. 3 and after |
| Member | $595 | $695 |
| Nonmember | $795 | $895 |
| Speaker/Chair | $395 | $495 |
| Student | $100 | $150 |
| Workshop Sponsorship (includes: 2 attendee registrations, full-page advertisement in program, logo/advertisement on event webpages, additional discounted full badges available to sponsors at $400/person) | $3000 | |
| Break Sponsorship (includes: logo on event webpages & program, discounted full badges available to sponsors at $500/person) | $1200 |
There are two ways to register for the Workshop on On-shoring.
- On-shoring Registration Only – If you will only be attending the Workshop on On-shoring on October 3,
- On-shoring plus IMAPS 2022 Symposium Registration – If you register for both the Workshop on On-shoring and IMAPS 2022 Symposium, you receive a $150 discount on the On-shoring registration (students receive $25 discount). Please note that Professional Development Courses (PDCs) are the same date and time of On-shoring, so you will not be able to register for PDCs.