Onshoring Workshop July 10-12

Workshop on
ON-SHORING

ADVANCED PACKAGING AND ASSEMBLY

www.imaps.org/onshoring

General Co-Chair:

Technical Chair:

Brandon Hamilton, Booz Allen Hamilton

Organizing Committee:

Speakers by Invitation Only

Overview:  The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a three-day Workshop to discuss and promote strategies to improve On-Shore Packaging and Assembly Capabilities,  July 10-12, 2023, at the Westin Tyson’s Corner just outside Washington DC. This workshop will be bringing Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly providers together to discuss their efforts to onshore advanced packaging.  The mission of this workshop is to engage our workforce community to identify the newly created Advanced Packaging programs which addresses US Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain.  Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III/Printed Circuit Board Executive Agent), DARPA and SRC will be briefing on their advanced packaging programs.

The workshop will feature two days of focused sessions, keynote presentations, a panel discussion, and a variety of networking opportunities. The event will kick-off on Monday with a pre-program day filled with 2-hour professional development courses and working groups addressing a variety of topics relevant to the onshoring of advanced packaging.