Power Electronics - April 18-20

ADVANCED PACKAGING FOR POWER ELECTRONICS

www.imaps.org/powerpack


April 18-20, 2023

Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE, Albuquerque, NM 87109 USA


A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!


Submit your Abstract on/before December 15, 2022



General Co-Chairs:
Rita Mohanty, Henkel Corporation
Brian Rowden, Oak Ridge National Laboratory


Technical Chairs:
Benson Chan, Binghamton University | Giri Venkataramanan, University of Wisconsin-Madison |
Patrick McCluskey, University of Maryland

Technical Committee:
Mark Currie, Harima | Christopher Kapusta, GE Global Research Center | Andy Longford, PandA – IMAPS UK |

GQ Lu, Virginia Tech. | Sanjay Misra, Henkel Corporation | Boyi Zhang, Delta


Overview:  The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on April 18-20 in Albuquerque, New Mexico. The Conference will bring together technologists from a diverse collection of disciplines in power semiconductor packaging, application development, reliability, modeling, process development, thermal management, and advanced materials/manufacturing to support the next generation of power electronics development. Attendees and Exhibitors will be exposed to a variety of power applications and packaging solutions from board level integration to power packaging for distributed energy systems to encourage cross pollination and insight of current and emerging market challenges and opportunities for collaboration.


POWER PACKAGING TECHNOLOGIES

APPLICATIONS

TOOLS

Advanced/Sustainable Materials

Board Mount Power

Multiphysics Modeling

Substrates & Module Designs

Granular Power

Co-Design Simulation

Embedding Technologies

Data Center Power

Characterization Techniques

Thermal Management

Embedded Components

Physics of Failure Analysis

Manufacturing Technologies

Integrated Capacitors & Magnetics

Roadmapping

Power Interposers

Energy Storage

Reliability

Additive Manufacturing

Automotive Electronics


Attachment/Bonding/Joining Technologies

EV Charging


Planar Interconnects

Power Flip Chip


Insulation Materials/Strategies

Distributed Energy Interfaces



Those wishing to present a 25-minute technical talk (+5 mins Q&A) at the conference, should submit a 250+ word abstract at www.imaps.org/powerpack no later than DECEMBER 15, 2022. Speakers are required to pay a reduced registration fee. Papers are not required.


Abstracts Deadline Extended: December 15, 2022
Notice of Acceptance: December 23, 2022





EXHIBITORS & SPONSORS


There will be a joint tabletop exhibition featuring companies from the HiTEC, CICMT and Power Packaging Conferences and extensive networking opportunities with the attendees from each Conference. There will be 30 total tabletops available at this conference, and the space is expected to sell out quickly. For companies wishing for broader exposure and additional benefits, we have a variety of sponsorships available with a range of options and price points. These spots are also very limited for this event. View the exhibit/sponsor prospectus. When you are ready book reserve your space, you can use the online registration or contact bschieman@imaps.org if you need assistance or a custom package. 



REGISTRATION


REGISTER ONLINE

Early registration discounts end March 24, 2023. Registration for the conferences includes access to technical sessions across all 3 conferences (HiTEC, CICMT, Power), so attendees can attend any sessions or speakers they wish at this event. The only additional fee is for add-on professional development courses which will be held Monday, April 17 before the full technical conferences begin Tuesday. All registrants also have access to visit the exhibit hall, participate in breakfasts, lunches and breaks and other networking activities, as noted in the program. 




Registration TypeEarly (thru Mar. 24)After Mar. 24
     Member$825$925
     Nonmember$1025$1125
     Speaker/Chair$595$745
     Student$150$300
Tabletop Exhibit (includes 1 six-foot tabletop, with 1 booth personnel or full  badge; additional discounted full badges at $500/person or booth personnel at $150/person)$900 member
$1050 nonmember
$1000 member
$1150 nonmember
Premier Sponsorship (includes 2 six-foot tabletops, with 2 full badges and 2 exhibit badges, advertisements, flyer or giveaway distributed to attendees, additional discounted full badges at $500/person or booth personnel at $150/person)$6000$6000
HiTEC Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)$3000$3000
CICMT Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)$3000$3000
Power Packaging Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person)$3000$3000
Coffee Break Sponsorship (includes logo recognition and signage, discounted full badges at $500/person)$1500$1500
Professional Development Courses (PDCs announced soon - each course is an additional fee, per course per person - this is in addition to the regular conference registration)$325$425





HOTEL RESERVATIONS

IMAPS has arranged for a discounted hotel block at the:

Albuquerque Marriott Pyramid North
5151 San Francisco Road NE
Albuquerque, New Mexico 87109

$179 USD/night + taxes and fees (single/double)

Marriott online reservation link

Hotel block closes APRIL 10 and will not be extended



Marriott Pyramid North

Just 10 miles from the ABQ airport


Albuquerque, New Mexico