Power Electronics - April 18-20

ADVANCED PACKAGING FOR POWER ELECTRONICS

www.imaps.org/powerpack


April 18-20, 2023

Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE, Albuquerque, NM 87109 USA

A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!

Abstract Deadline:  October 14, 2022

General Co-Chairs:
Rita Mohanty, Henkel Corporation
Brian Rowden, Oak Ridge National Laboratory

Technical Chairs:
Benson Chan, Binghamton University | Giri Venkataramanan, University of Wisconsin-Madison |
Patrick McCluskey, University of Maryland

Technical Committee:
Mark Currie, Harima | Christopher Kapusta, GE Global Research Center | Andy Longford, PandA – IMAPS UK |

GQ Lu, Virginia Tech. | Sanjay Misra, Henkel Corporation | Boyi Zhang, Delta

Overview:  The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on April 18-20 in Albuquerque, New Mexico. The Conference will bring together technologists from a diverse collection of disciplines in power semiconductor packaging, application development, reliability, modeling, process development, thermal management, and advanced materials/manufacturing to support the next generation of power electronics development. Attendees and Exhibitors will be exposed to a variety of power applications and packaging solutions from board level integration to power packaging for distributed energy systems to encourage cross pollination and insight of current and emerging market challenges and opportunities for collaboration.


POWER PACKAGING TECHNOLOGIES

APPLICATIONS

TOOLS

Advanced/Sustainable Materials

Board Mount Power

Multiphysics Modeling

Substrates & Module Designs

Granular Power

Co-Design Simulation

Embedding Technologies

Data Center Power

Characterization Techniques

Thermal Management

Embedded Components

Physics of Failure Analysis

Manufacturing Technologies

Integrated Capacitors & Magnetics

Roadmapping

Power Interposers

Energy Storage

Reliability

Additive Manufacturing

Automotive Electronics

Attachment/Bonding/Joining Technologies

EV Charging

Planar Interconnects

Power Flip Chip

Insulation Materials/Strategies

Distributed Energy Interfaces


Those wishing to present a 25-minute technical talk (+5 mins Q&A) at the conference, should submit a 200+ word abstract at www.imaps.org/powerpack no later than OCTOBER 14, 2022. Speakers are required to pay a reduced registration fee. Papers are not required.

Abstracts Deadline: October 14, 2022
Notice of Acceptance: November 16, 2022