Power Electronics - April 18-20
ADVANCED PACKAGING FOR POWER ELECTRONICS
April 18-20, 2023
Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE, Albuquerque, NM 87109 USA
A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!
Last call to submit your Abstracts - submission form closing soon
General Co-Chairs:
Rita Mohanty, Henkel Corporation
Brian Rowden, Oak Ridge National Laboratory
Technical Chairs:
Benson Chan, Binghamton University | Giri Venkataramanan, University of Wisconsin-Madison |
Patrick McCluskey, University of Maryland
Technical Committee:
Mark Currie, Harima | Christopher Kapusta, GE Global Research Center | Andy Longford, PandA – IMAPS UK |
GQ Lu, Virginia Tech. | Sanjay Misra, Henkel Corporation | Boyi Zhang, Delta
Overview: The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on April 18-20 in Albuquerque, New Mexico. The Conference will bring together technologists from a diverse collection of disciplines in power semiconductor packaging, application development, reliability, modeling, process development, thermal management, and advanced materials/manufacturing to support the next generation of power electronics development. Attendees and Exhibitors will be exposed to a variety of power applications and packaging solutions from board level integration to power packaging for distributed energy systems to encourage cross pollination and insight of current and emerging market challenges and opportunities for collaboration.
POWER PACKAGING TECHNOLOGIES | APPLICATIONS | TOOLS |
Advanced/Sustainable Materials | Board Mount Power | Multiphysics Modeling |
Substrates & Module Designs | Granular Power | Co-Design Simulation |
Embedding Technologies | Data Center Power | Characterization Techniques |
Thermal Management | Embedded Components | Physics of Failure Analysis |
Manufacturing Technologies | Integrated Capacitors & Magnetics | Roadmapping |
Power Interposers | Energy Storage | Reliability |
Additive Manufacturing | Automotive Electronics | |
Attachment/Bonding/Joining Technologies | EV Charging | |
Planar Interconnects | Power Flip Chip | |
Insulation Materials/Strategies | Distributed Energy Interfaces |
Those wishing to present a 25-minute technical talk (+5 mins Q&A) at the conference, should submit a 250+ word abstract at www.imaps.org/powerpack immediately. Speakers are required to pay a reduced registration fee. Papers are not required.
Abstracts Deadline: December 15, 2022 - Submission Software Closing Soon
Notice of Acceptance: January 6, 2023
EXHIBITORS & SPONSORS
There will be a joint tabletop exhibition featuring companies from the HiTEC, CICMT and Power Packaging Conferences and extensive networking opportunities with the attendees from each Conference. There will be 30 total tabletops available at this conference, and the space is expected to sell out quickly. For companies wishing for broader exposure and additional benefits, we have a variety of sponsorships available with a range of options and price points. These spots are also very limited for this event. View the exhibit/sponsor prospectus. When you are ready book reserve your space, you can use the online registration or contact bschieman@imaps.org if you need assistance or a custom package.
REGISTRATION
Early registration discounts end March 24, 2023. Registration for the conferences includes access to technical sessions across all 3 conferences (HiTEC, CICMT, Power), so attendees can attend any sessions or speakers they wish at this event. The only additional fee is for add-on professional development courses which will be held Monday, April 17 before the full technical conferences begin Tuesday. All registrants also have access to visit the exhibit hall, participate in breakfasts, lunches and breaks and other networking activities, as noted in the program.
| Registration Type | Early (thru Mar. 24) | After Mar. 24 |
| Member | $825 | $925 |
| Nonmember | $1025 | $1125 |
| Speaker/Chair | $595 | $745 |
| Student | $150 | $300 |
| Tabletop Exhibit (includes 1 six-foot tabletop, with 1 booth personnel or full badge; additional discounted full badges at $500/person or booth personnel at $150/person) | $900 member $1050 nonmember | $1000 member $1150 nonmember |
| Premier Sponsorship (includes 2 six-foot tabletops, with 2 full badges and 2 exhibit badges, advertisements, flyer or giveaway distributed to attendees, additional discounted full badges at $500/person or booth personnel at $150/person) | $6000 | $6000 |
| HiTEC Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person) | $3000 | $3000 |
| CICMT Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person) | $3000 | $3000 |
| Power Packaging Sponsorship (includes 1 six-foot tabletop, with 1 full badge and 1 exhibit badge, advertisements, additional discounted full badges at $500/person or booth personnel at $150/person) | $3000 | $3000 |
| Coffee Break Sponsorship (includes logo recognition and signage, discounted full badges at $500/person) | $1500 | $1500 |
| Professional Development Courses (PDCs announced soon - each course is an additional fee, per course per person - this is in addition to the regular conference registration) | $325 | $425 |
HOTEL RESERVATIONS
IMAPS has arranged for a discounted hotel block at the:
Albuquerque Marriott Pyramid North
5151 San Francisco Road NE
Albuquerque, New Mexico 87109
$179 USD/night + taxes and fees (single/double)
Marriott online reservation link
Hotel block closes APRIL 10 and will not be extended
Just 10 miles from the ABQ airport
