Publications Information





IMAPS proudly publishes a 6-issue magazine, a quarterly scientific journal, and a bounty of exclusive microelectronics research content from Society events. All IMAPS publications are available electronically through the IMAPSource Microelectronics Research Portal. This library of exclusive IMAPS content features downloadable versions of Advancing Microelectronics magazine, the Journal of Microelectronics Packaging, and proceedings from IMAPS conferences and symposia. 
 
Advancing Microelectronics Magazine
Advancing Microelectronics member magazine is published six times per year. Each issue focuses its articles and content on a relevant industry theme, as well as news from our chapters and industry members. Past issues are openly accessible to any interested reader at no cost via IMAPSource. The current issue of AM is made available to members only at IMAPSource. AM magazine is also provided in hard copy format to active individual and select corporate representative members.

Journal of Microelectronics and Electronic Packaging
The JMEP is dedicated to publishing peer-reviewed papers in research, development, and the application relating to all aspects of microelectronics packaging, interconnect and assembly technologies. This journal covers materials, processes, reliability, design, systems, and applications in microelectronics assembly and packaging technologies of the present and future including 3D integration, Ceramic Interconnect, Soldering, Flip Chip, Wire Bonding, Encapsulation, RF and microwaves, MEMS, Photonics, Power/High Temperature Electronics, Printed Electronics, LED packaging, and Medical Electronics. Articles from JMEP are only available at IMAPSource.org. Members can access each issue at no charge. Non-members may download each article for a small fee. 

International Symposium on Microelectronics
Full-text abstracts from technical session speakers and select presentations from keynote speakers from the International Symposium on Microelectronics are available for download after the event each year. Members can access full-text downloads up to the maximum amount included in a particular member package (100 for Individual members, 150 for Corporate Representative Members). Non-member downloads, or member downloads beyond the allocation, are available for a small fee. 

Additional Conference Content
Presentations from technical session speakers and select keynote speakers are available for download after each major conference, including the International Conferences on Device Packaging (DPC), High Temperature Electronics (HiTEN/HiTEC), and Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT). Members can access these files up to the maximum amount included in a particular member package (100 for Individual members, 150 for Corporate Representative Members). Non-member downloads, or member downloads beyond the allocation, are available for a small fee.