Technology Crossover - CICMT


IMPORTANT EVENT NOTICE: 
CICMT 2021 will now be delivered virtually! IMAPS is welcoming the news of this change with an extended abstract submission deadline of December 18th. Corporate partnership opportunities will be shared soon. Click here to learn more about this change.


General Chair:
Steve Dai
Sandia National Laboratories


Technical Chairs:

Ulrich Schmid, TU Wien 
Markus Eberstein, TDK Sensors


Technical Organizing Committee:

Heli Jantunen, University of Oulu
Eung Soo Kim, Kyonggi University  
Soshu Kirihara, Joining and Welding Research Institute Osaka University  
Daniel Krueger, Honeywell  
Zhifu Liu, Shanghai Institute of Ceramics of the Chinese Academy of Sciences
Jens Müller, Technische Universität Ilmenau 
Uwe Partsch, Fraunhofer IKTS

SUBMIT ABSTRACTS
ABSTRACTS NOW DUE: DECEMBER 18, 2020

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications. 

The CICMT Conference rotates geographically between the USA, Europe and Asia to improve collaboration, networking, and the sharing of technical information across these geographic industry hubs. The tentative conference plans include:

  • CICMT 2021: USA - April 26-29, 2021 - Virtual
  • CICMT 2022: Vienna - April 2022 - Details available soon
  • CICMT 2023: Asia - Details soon

CICMT 2021 Conference Program

Abstracts Now Due December 18, 2020. Program available in January! 

The committee is planning sessions and inviting speakers on the following topics:

1. Functional materials for passive/active devices and their properties
Microwave/mm-wave LTCC/ULTCC dielectric materials
Ferroelectric/piezoelectric/pyroelectric/ferrite/multiferroic materials
Sensitive ceramics/thermoelectric/electrocaloric materials
Dielectric/ferroelectric/piezoelectric composites
Pastes/inks/slurries for electronics

2. Material processing and device manufacturing technologies
LTCC/HTCC and multilayer ceramic and glass processing
Emerging ultralow temperature, room temperature processing, and cold sintering processing
Additive manufacturing /3D printing/ direct writing
Advanced thick film processing
Fine structuring technologies
Emerging embedding/integration technologies

3. Devices for emerging technologies
Circuits, antennas, and filters for MHz, GHz and THz for communications
Automotive/aerospace/medical electronics/optoelectronics
Flexible/wearable electronics
Integrated physical/chemical/biological sensors and actuators
Packaging and integration issues for MEMS and BioMEMS devices
Batteries/fuel cells/ energy conversion systems
Micro-reactors/micro-fluidic devices

4. Design, modeling, simulation, characterization and reliability
Metamaterials design, realization and characterization
High frequency devices design/modeling/simulation
Materials and devices characterization
Material and device reliability, lifetime, and failure estimation
Thermal management/thermal transfer simulation

SUBMIT ABSTRACTS


Speaker Deadlines & Information:

  • Abstracts Deadline: DECEMBER 18, 2020
  • Speaker Notification Emails: January 15, 2021
  • Early Registration Deadline: March 2021
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
  • Keynote Speaker Presentation Time: 45 minutes (40 to present; 5 for Q&A)
  • No formal technical paper is required - there is no proceedings paper and there is NO copyright exchange required.
    • Authors are encourage to submit directly to IMAPS or ACerS Journals for consideration to be published in peer reviewed, archival publications. 


Presentation Format & Details:

  • IMAPS does not require you to use a conference powerpoint template. You are able to use your regular company/preferred powerpoint templates.
  • Please include the IMAPS show name and dates on your template and/or an IMAPS logo.
  • Poster Session/Information (if applicable): The poster session is planned to be an INTERACTIVE presentation. More information about the virtual delivery of a poster will be provided as soon as it is available.
  • Dress Code: There is no official "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. We do not recommend casual attire.
  • All session presentations are 25 minutes followed by 5 minutes for Questions
  • Speak with your session chair if you need assistance.
  • Photography and screen shots are not permitted.