Technology Crossover - CICMT

General Chair:
Steve Dai
Sandia National Laboratories

Technical Chairs:
Ulrich Schmid, TU Wien 
Markus Eberstein, TDK Sensors

Technical Organizing Committee:
Simon Ang, High Density Electronic Center, University of Arkansas  
Heli Jantunen, University of Oulu
Eung Soo Kim, Kyonggi University  
Soshu Kirihara, Joining and Welding Research Institute Osaka University  
Daniel Krueger, Honeywell  
Zhifu Liu, Shanghai Institute of Ceramics of the Chinese Academy of Sciences
Jens Müller, Technische Universität Ilmenau 
Uwe Partsch, Fraunhofer IKTS

SUBMIT ABSTRACTS

Abstract Deadline Now: MARCH 6


The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications. 

CICMT 2020 Conference Program

Program coming soon! 

The committee is planning sessions and inviting speakers on the following topics:

1. Functional materials for passive/active devices and their properties
Microwave/mm-wave LTCC/ULTCC dielectric materials
Ferroelectric/piezoelectric/pyroelectric/ferrite/multiferroic materials
Sensitive ceramics/thermoelectric/electrocaloric materials
Dielectric/ferroelectric/piezoelectric composites
Pastes/inks/slurries for electronics

2. Material processing and device manufacturing technologies
LTCC/HTCC and multilayer ceramic and glass processing
Emerging ultralow temperature, room temperature processing, and cold sintering processing
Additive manufacturing /3D printing/ direct writing
Advanced thick film processing
Fine structuring technologies
Emerging embedding/integration technologies

3. Devices for emerging technologies
Circuits, antennas, and filters for MHz, GHz and THz for communications
Automotive/aerospace/medical electronics/optoelectronics
Flexible/wearable electronics
Integrated physical/chemical/biological sensors and actuators
Packaging and integration issues for MEMS and BioMEMS devices
Batteries/fuel cells/ energy conversion systems
Micro-reactors/micro-fluidic devices

4. Design, modeling, simulation, characterization and reliability
Metamaterials design, realization and characterization
High frequency devices design/modeling/simulation
Materials and devices characterization
Material and device reliability, lifetime, and failure estimation
Thermal management/thermal transfer simulation

SUBMIT ABSTRACTS
Abstract Deadline Now: MARCH 6