Technology Crossover - Power Packaging

Update: This event has been rescheduled for April 20-22, 2021.


Due to the continually evolving conditions surrounding COVID-19, the technology crossover extravaganza featuring the international conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), and Power Packaging has been postponed to April 20-22, 2021.

Speakers, sponsors, exhibitors and attendees will be contacted with relevant details about refunds and/or credits immediately. 

Please contact info@imaps.org if you have any questions about this event.

General Chair:
Prof. Douglas C Hopkins, Ph. D
NCSU Packaging Research in Electronic Energy Systems (PREES)

Technical Program Co-Chairs:
Prof. Patrick McCluskey, University of Maryland

Steering Committee:
John Bultitude, KEMET Electronics;
Benson Chan, Binghamton University;
Bob Conner, X-Celeprint;
Rick Eddins, GE Aviation US;
Mike McKeown, Hesse Mechatronics;
Jason Rouse, Sekisui Products;
Brian Rowden, Oak Ridge National Lab;

SUBMIT ABSTRACTS


HiTEC, CICMT,  Power Packaging -- April 2021!
ABSTRACTS DUE: OCTOBER 31, 2020



PACKAGING IS A DESIGN FUNCTION - MANUFACTURING CREATES THE DESIGN RULES.

This symposium brings together the experts from all disciplines in design and manufacturing to create the power electronics packaging technologies of the future! 



Advanced Power Electronics Packaging Symposium 2021 Program


Abstracts have been solicited from the following areas:

  • APEPS topical/session areas added soon!



SUBMIT ABSTRACTS