Technology Crossover - Power Packaging

General Chair:
Prof. Douglas C Hopkins, Ph. D
NCSU Packaging Research in Electronic Energy Systems (PREES)

Technical Program Co-Chairs:
Prof. Patrick McCluskey, University of Maryland

Steering Committee:
John Bultitude, KEMET Electronics;
Benson Chan, Binghamton University;
Bob Conner, X-Celeprint;
Rick Eddins, GE Aviation US;
Mike McKeown, Hesse Mechatronics;
Jason Rouse, Sekisui Products;
Brian Rowden, Oak Ridge National Lab;

SUBMIT ABSTRACTS

ABSTRACTS DUE: OCTOBER 31, 2020


PACKAGING IS A DESIGN FUNCTION - MANUFACTURING CREATES THE DESIGN RULES.

This symposium brings together the experts from all disciplines in design and manufacturing to create the power electronics packaging technologies of the future! 



Advanced Power Electronics Packaging Symposium 2021 Program


Abstracts have been solicited from the following areas:

  • APEPS topical/session areas added soon!


SUBMIT ABSTRACTS