Technology Crossover - Power Packaging


IMPORTANT EVENT NOTICE: 
APEPS 2021 will now be delivered virtually! IMAPS is welcoming the news of this change with an extended abstract submission deadline of December 18th. Corporate partnership opportunities will be shared soon. Click here to learn more about this change.


General Chair:
Prof. Douglas C Hopkins, Ph. D
NCSU Packaging Research in Electronic Energy Systems (PREES)

Technical Program Co-Chairs:
Prof. Patrick McCluskey, University of Maryland

Steering Committee:
John Bultitude, KEMET Electronics;
Benson Chan, Binghamton University;
Bob Conner, X-Celeprint;
Rick Eddins, GE Aviation US;
Mike McKeown, Hesse Mechatronics;
Jason Rouse, Sekisui Products;
Brian Rowden, Oak Ridge National Lab;

SUBMIT ABSTRACTS

ABSTRACTS NOW DUE: DECEMBER 18, 2020


PACKAGING IS A DESIGN FUNCTION - MANUFACTURING CREATES THE DESIGN RULES.

This symposium brings together the experts from all disciplines in design and manufacturing to create the power electronics packaging technologies of the future! 




Advanced Power Electronics Packaging Symposium 2021 Program


Abstracts have been solicited from the following areas:

  • APEPS topical/session areas added soon!

SUBMIT ABSTRACTS

Abstracts Now Due: DECEMBER 18, 2020