Technology Crossover - Power Packaging


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General Chair:
Prof. Douglas C Hopkins, Ph. D., NCSU Packaging Research in Electronic Energy Systems (PREES)

Technical Program Co-Chair:
Prof. Patrick McCluskey, University of Maryland


Steering Committee:
John Bultitude, KEMET Electronics
Benson Chan, Binghamton University
Bob Conner, X-Celeprint
Rick Eddins, GE Aviation US
Mike McKeown, Hesse Mechatronics
Jason Rouse, Corning Inc.
Brian Rowden, Oak Ridge National Lab


                    

  Speaker Information