Technology Crossover - Power Packaging
General Chair:
Prof. Douglas C Hopkins, Ph. D
NCSU Packaging Research in Electronic Energy Systems (PREES)
Technical Program Co-Chairs:
Prof. Patrick McCluskey, University of Maryland
Steering Committee:
John Bultitude, KEMET Electronics;
Benson Chan, Binghamton University;
Bob Conner, X-Celeprint;
Rick Eddins, GE Aviation US;
Mike McKeown, Hesse Mechatronics;
Jason Rouse, Sekisui Products;
Brian Rowden, Oak Ridge National Lab;
ABSTRACTS DUE: OCTOBER 31, 2020
PACKAGING IS A DESIGN FUNCTION - MANUFACTURING CREATES THE DESIGN RULES.
This symposium brings together the experts from all disciplines in design and manufacturing to create the power electronics packaging technologies of the future!
Advanced Power Electronics Packaging Symposium 2021 Program
Abstracts have been solicited from the following areas:
- APEPS topical/session areas added soon!