Technology Crossover | CICMT - HiTEC - Power Pkg
Due to the continually evolving conditions surrounding COVID-19, the technology crossover extravaganza featuring the international conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), and Power Packaging has been postponed to April 20-22, 2021.
Speakers, sponsors, exhibitors and attendees will be contacted with relevant details about refunds and/or credits immediately.
Please contact firstname.lastname@example.org if you have any questions about this event.
Three times the content, networking, and education!
Three International Conferences in One Place
Three star IMAPS conferences will align in 2021 for an incredible attendee experience in Albuquerque, New Mexico. The forces behind the International Conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect & Ceramic Microsystems Technologies (CICMT), and Power Packaging have joined for a special crossover technology extravaganza. These three major events will be hosted simultaneously at the Marriott Albuquerque Pyramid North from April 20th-22nd.
Sponsorship partners can choose from function sponsorships, single-conference sponsorships, or a premier multi-conference level of exposure. Each sponsorship includes a tabletop exhibit space in the common networking hall.
Each exhibitor registration includes a tabletop in the common networking hall and access to the common event registration list (3 times the reach of our traditional conferences!).