UPCOMING TECHNICAL WEBINARS:

Advanced High Density Rigid Packaging Substrates for RF and Miniaturization
New date: October 28th, 2020
Register now!

This webinar presentation focuses on advanced rigid multilayer substrates comprised of high density ultra-thin build-ups using a material set with excellent RF properties for applications up to 60 GHz. Read more...

PAST WEBINARS & ARCHIVES:

Hybrid Bonding: Fueling Advanced Memory and High Performance Compute Roadmaps
July 15, 2020

Speaker: Laura Mirkarimi, Xperi
The promise of high growth markets for the internet of things and artificial intelligence, is driving semiconductor manufacturers to increase functionality and performance of devices and modules. With Moores law losing steam due to the technical challenges and increasing costs, the electronics industry looks toward 2.5D and 3D stacking to meet the market requirements for future products. A central theme for higher functionality is increased bandwidth and finer pitch interconnects. The challenge to deliver low cost modules with high yield remains difficult. Continue reading full abstract...

This webinar was recorded. IMAPS members can access the speaker presentation slides below, and request that the archived webinar recording be sent to you.

Click here to download Laura Mirkarimi's presentation slides (coming soon)

Click here to request the webinar recording (MP4) (coming soon)

Chip-to-Chip Integration for High Bandwidth Memory Processor Interface
July 1, 2020

Speaker: Andy Heinig, Fraunhofer IIS
Most electronic systems comprise a processing unit and some memory as basis components. Devices with a high compute power also demand a lot of embedded memory. In many cases this embedded memory is integrated within the same IC. This is maybe not the best solution for each case, since processing unit and embedded memory  have different requirements. So a technology could be optimized for performance or memory but not both. Also the demand for metal stack is distinct. Processing units need a lot of metal layers for proper routing and memory typically comes out with a lot less, because of the regular arrangement. Because of these differences it can be suitable to divide processing and memory during production and merge both during assembly. In this webinar, the idea to partitioning processing and memory is presented and an example low-cost chip stack-up will be described, that is currently in production.

This webinar was recorded. IMAPS members can access the speaker presentation slides below, and request that the archived webinar recording be sent to you.

Click here to download Andy Heinig's presentation slides.

Click here to request the webinar recording (MP4).

This Is Not Your Father's Semiconductor Packaging: An EDA Perspective
June 17, 2020

Speaker: John Park, Cadence Design Systems
Semiconductor foundries are accelerating their offerings for advanced packaging. This sea change in the advanced packaging market brings several important new solutions to the industry as well as significant design and analysis challenges for the packaging engineer. Many packaging professionals are becoming aware that the typical design flows used today for BGA packages have gaping holes when targeting the newer 2.5D-/3D-IC packaging technologies.  Get an overview of the trends and advancements for foundry-based 2.5D-IC, 3D-IC, and FOWLP solutions. Learn about the challenges  and benefits of the modernized design flow for foundry-based packaging.

This webinar was recorded. IMAPS members can access the speaker presentation slides below, and request that the archived webinar recording be sent to you.

Click here to download John Park's presentation slides.

Click here to request the webinar recording (MP4).

PAST GBC WEBINARS & ARCHIVES:

Advanced Packaging Landscape in Post-COVID Economy & Electronics and Semiconductor Market Trends: Looking for Growth Beyond 2020, including Regional Manufacturing Opportunities
August 19, 2020
IMAPS Members can access the speaker presentation slides and the archived webinar recording below.

This IMAPS Global Business Council live webinar featured a presentation from Vaibhav Trivedi of Yole Developpement and Brandon Prior of Prismark Partners.  This webinar was recorded and IMAPS Members can replay the archived MP4 recording here.

Member login credentials are required to view these archived resources.

Click here to download Vaibhav Trivedi's slides.

Click here to download Brandon Prior's slides.

Click here to replay the entire webinar (MP4 recording).

Recovery and Growth After COVID-19
May 20, 2020
IMAPS Members can access the speaker presentation slides and the archived webinar recording below. 

This IMAPS Global Business Council live webinar featured a discussion from industry heavyweights Jan Vardaman, TechSearch International, and Jeorge Hurtarte, Teradyne, on recovery and growth areas after COVID-19. This webinar was recorded and IMAPS Members can replay the archived MP4 recording here.

Member login credentials are required to view these archived resources.

Click here to download Jan Vardaman's slides.

Click here to download Jeorge Hurtarte's slides.

Click here to replay the entire webinar (MP4 recording).

Live Virtual Workshop on Thermal Management
June 10, 2020
This workshop has been recorded. The recording and presentation files have been archived for workshop attendees only. Contact blamm@imaps.org for more information!

This virtual workshop featured six technical speakers on a variety of thermal management topics.