Virtual Events
IMAPS Virtual Programming
A valuable new resource for the semiconductor packaging industry
LIVE WEBINARS | VIRTUAL WORKSHOPS | VIRTUAL CONFERENCES
LIVE TECHNICAL WEBINAR SERIES and GLOBAL BUSINESS COUNCIL WEBINAR SERIES
Live Technical Webinar Series events features live presentations across a variety of relevant industry technical topics. Global Business Council events are focused on the business state of the industry.
Registration for all Live Technical Webinar Series and Global Business Council Webinar Series events is FREE for IMAPS members. Non-member registration is $50 per webinar.
Join or renew now to take advantage of the value of this and other webinar series.
Recent Webinars
SiP Layout and Analysis Design Tool/Flow
January 27, 2021
Power Electronics: Improve Bondline Control and Reliability
with Reinforced Matrix Preforms
December 9, 2020
Power Electronics: Improve Bondline Control and Reliability
with Reinforced Matrix Preforms
October 28, 2020
Advanced Packaging Landscape in Post-COVID Economy
& Electronics
-and-
Semiconductor Market Trends: Looking for Growth Beyond
2020, including Regional Manufacturing Opportunities
August 19, 2020
Hybrid Bonding: Fueling Advanced Memory and High Performance Compute Roadmaps
July 15, 2020
Chip-to-Chip Integration for High Bandwidth Memory Processor Interface
July 1, 2020
This Is Not Your Father's Semiconductor Packaging: An EDA Perspective
June 17, 2020
Recovery and Growth After COVID-19
May 20, 2020
New Webinars Coming Soon!
VIRTUAL WORKSHOPS
Virtual workshops and events take attendees on a deeper dive into a particular topical area. These programs feature multiple speakers.
Pricing is $100 for IMAPS members, free for students, or $200 for non-members (inclusive of a one-year membership).
Sponsorships for the morning and afternoon session are available. Sponsorships are $500 per session (max 2 sponsors).
Recent Workshops
Advanced System-in-Package
November 18, 2020
Thermal Management
June 10, 2020
Advanced Packaging for Medical Microelectronics
February 24, 2020
VIRTUAL CONFERENCES
Our flagship events, delivered virtually! These conferences and symposia feature several days of live and on-demand presentations, plus corporate partnership opportunities. Learn more below.
Recent Conferences
17th International Conference and Exhibition on Device Packaging
April 12 - 15, 2021
53rd International Symposium on Microelectronics
October 5-8, 2020
Technology Crossover Extravaganza
Featuring Three Conferences in One:
International Conference on High Temperature Electronics
Ceramic Interconnect and Ceramic Microsystems Technologies
Advanced Power Electronics Packaging
April 26-29, 2021
Learn More
