Wire Bonding - Feb. 2-3
Topical Workshop & Tabletop Exhibition on
WIRE BONDING
www.imaps.org/wirebonding
February 2-3, 2023
Westin San Diego Bayview | San Diego, California
General Co-Chairs:
Mike McKeown, Hesse Mechatronics | Utkarsh Mehrotra, Wolfspeed
Technical Committee:
Henri Seppanen, Kulicke & Soffa Industries

Thank you to our Workshop Sponsor:
Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and marketing people from around the world who have been working in the area of Wire Bonding. This workshop has been specifically organized to allow for the presentation and debate of some of the latest technologies out there related to the use of Wire Bonding in battery pack, semiconductor and microelectronic packaging.
Tabletop exhibits will be located around the perimeter of the session room for the entire workshop. Exhibits will be "open" during the full hours of the workshop as listed in our program, but we ask all attendees and exhibitors to use the breakfast, break, lunch, and reception break times for all networking. | |
THURSDAY, FEBRUARY 2 | |
Wire Bonding Workshop held in Crystal Ballroom 2 | |
8:00AM | Breakfast (Diamond Room) |
8:00AM | Registration |
8:45AM | Opening Remarks - Workshop General Chair Mike McKeown, Hesse Mechatronics |
9:00AM | TUTORIAL: WIRE BONDING - THE ULTRASONIC BONDING MECHANISM Wire bonding is the dominant method of chip interconnection with over 85% of market share. Trillions of wire bonds are produced annually. In high-volume and well controlled facilities defect rates are in the low ppm range. It remains the lowest cost method of chip interconnection. During both ball and wedge bonding wire is massively deformed between the bond tool and the bond pad or substrate forming a weld. The dominant variables affecting deformation are ultrasonic energy, temperature, bond force and bond time. Deformation exposes new surface material that is clean and has not been exposed to atmospheric contamination and oxidation. As the new wire and bond pad surfaces mix, they form diffusion couples that grow and transform into the intermetallic weld nugget. The initial mixing very quickly transforms into the compounds described by the equilibrium phase diagram. Ultrasonic energy is the principal driving force in wire bonding. It reduces the forces required, allowing deformation to occur at significantly lower stress than would otherwise be required. High-frequency ultrasonics provide higher strain rates, allowing faster, better controlled deformation that is required for precise, high-yield bonding and high productivity. This talk will discuss the mechanisms behind the formation of ball and wedge bonds. |
Session 1: HEAVY Cu WIRE BONDING Session Chair: Mike McKeown, Hesse Mechatronics | |
10:00AM | Heavy Copper Wirebonding for Automotive Batteries Grayson Young, University of California, Riverside (Josh Huang) |
10:30AM | Coffee Break with Exhibitors |
11:15AM | Large Copper Wire and Ribbon Bonding in Mass Production Tao Xu, Kulicke & Soffa Industries |
11:45AM | The effect of EPIG plating thicknesses on solder joint and wire bond reliability |
12:15PM | Lunch & Networking with Exhibitors (Diamond Room) |
Session 2: NOVEL BOND WIRE MATERIALS & WIRE BONDING TECHNOLOGIES Session Chair: Henri Seppaenen, Kulicke & Soffa Industries, Inc. | |
2:00PM | The Reliability of Heavy Ag Wire Bonding for Power Devices Xing Wei, Waseda University (Kohei Tatsumi) |
2:30PM | Process Advantages of Thermosonic Wedge Bonding Using Dosed Tool Heating Mike McKeown, Hesse Mechatronics |
3:00PM | Coffee Break with Exhibitors |
Session 3: FAILURE ANALYSIS & RELIABILITY Session Chair: Utkarsh Mehrotra, Wolfspeed | |
3:45PM | Vibration resistance of wire bonds in EV batteries Kosuke Ono, Tanaka Precious Metals (Tsukasa Ichikawa, Shizu Matsunaga, Shuichi Mitoma) |
4:15PM | Understanding the atomic-scale nature of ultrasonic wire bonding using molecular dynamics simulations Milad Khajehvand, Santa Clara University (Henri Seppaenen, Kulicke & Soffa Industries, Inc.; Panthea Sepehrband, Santa Clara University) |
5:00 - 6:00PM | Happy Hour with the Exhibitors Wire Bonding Workshop attendees can then join the Medical Workshop happy hour & San Diego Chapter meeting at the conclusion of this meeting in the CRYSTAL BALLROOM 1 |
6:30PM - 7:30PM | IMAPS SAN DIEGO CHAPTER MEETING The San Diego Chapter will hold it's first technical meeting of 2023, featuring a presentation from Dr. Beth Keser, IMAPS President. Attendees from the Medical and Wire Bonding Workshops are invited to attend. San Diego Chapter members are encouraged to come early and visit our exhibitors during each workshop's happy hour reception as well. The Future of Electronic Packaging
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FRIDAY, FEBRUARY 3 | |
Wire Bonding Workshop Held in Crystal Ballroom 2 | |
8:00AM | Breakfast (Diamond Room) |
8:00AM | Registration |
8:45AM | Day Two Opening Remarks - Workshop General Chair Mike McKeown, Hesse Mechatronics |
9:00AM | TUTORIAL: A PRACTICAL INTRODUCTION TO WIRE BOND PROCESS OPTIMIZATION |
Session 4: TESTING AND PROBING CHALLENGES Session Chair: Utkarsh Mehrotra, Wolfspeed | |
10:00AM | Design Considerations in Transitioning from Aluminum Wire to Aluminum Ribbon Thomas Bobal, Coining, Inc. |
10:30AM | Coffee Break with Exhibitors |
11:00AM | Creation of New Wire Bond Pull Test Method, JEDEC JESD22-B120 Curtis Grosskopf, IBM Corp. |
11:30AM | Contamination Detection on Ultrasonic Wire Bonding Henri Seppaenen, Kulicke & Soffa Industries, Inc. |
12:00PM | Battery Interconnect Quality Testing Karim Dehkordi, Acculogic (Paul Bennett) |
12:30PM | Lunch & Networking with Exhibitors (Diamond Room) |
AFTERNOON TUTORIAL | |
2:00PM | TUTORIAL: PROCESS GUIDELINES FOR WIRE BONDING BATTERIES & POWER MODULES This presentation will discuss the various materials used in battery and power modules in relation to heavy Al or Cu wire bonding. It will discuss the various manufacturing steps and materials and how they relate to wire bonding. |
2:45PM | Closing Remarks - Workshop General Chair |
SPONSORS & TABLETOP EXHIBITORS
Thank you to our Workshop Sponsor:
Please visit all of our tabletop exhibitors during the Wire Bonding Workshop:
Hesse Mechatronics - SPONSOR
Baitech Solutions LLC
DeWeyl Tool Company
Hybond Inc.
Kulicke & Soffa Industries
Sales and Service, Inc.
Tanaka Kikinzoku International (America), Inc.
A few tabletop exhibits and sponsorships are still available - REGISTER ONLINE
REGISTRATION
Registration Type | Early (on or before Jan. 16) | After Jan. 16 |
Member | $695 | $795 |
Nonmember | $895 | $995 |
Speaker/Chair | $495 | $595 |
Student | $100 | $200 |
Tabletop Exhibit (includes 1 six-foot tabletop in the session room, with 1 booth personnel badge; additional discounted full badges available to exhibitors at $450/person) | $850 | $950 |
Sponsorship (includes 1 six-foot tabletop in the session room, with 2 exhibit badges, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program; additional discounted full badges available to sponsors at $350/person) | $1750 |
HOTEL INFORMATION
WESTIN SAN DIEGO BAYVIEW
400 WEST BROADWAY
SAN DIEGO, CALIFORNIA, USA, 92101
IMAPS Room Rate: $239/night + taxes and fees
Call the hotel directly at 619-239-4500
BOOK YOUR ROOM WITH THE IMAPS GROUP RATE
Hotel Shuttle Services to/from SAN Airport
In-room Internet Access Included
Parking is Additional - Local garages available as well
HOTEL RESERVATION DEADLINE: FRIDAY, JANUARY 16, 2023
Upon reservation, guests must make a deposit for the first night's room reservation. Guests must cancel before 72 hours before the scheduled check-in date or the hotel will charge for 1 night.