Wire Bonding - Feb. 2-3

Topical Workshop & Tabletop Exhibition on
WIRE BONDING


www.imaps.org/wirebonding


February 2-3, 2023
Westin San Diego Bayview | San Diego, California


General Co-Chairs:
Mike McKeown, Hesse Mechatronics | Utkarsh Mehrotra, Wolfspeed

Technical Committee:
Henri Seppanen, Kulicke & Soffa Industries





Thank you to our Workshop Sponsor:
Workshop Sponsor: Hesse Mechatronics


Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and marketing people from around the world who have been working in the area of Wire Bonding.  This workshop has been specifically organized to allow for the presentation and debate of some of the latest technologies out there related to the use of Wire Bonding in battery pack, semiconductor and microelectronic packaging.




Tabletop exhibits will be located around the perimeter of the session room for the entire workshop. Exhibits will be "open" during the full hours of the workshop as listed in our program, but we ask all attendees and exhibitors to use the breakfast, break, lunch, and reception break times for all networking.


THURSDAY, FEBRUARY 2

Wire Bonding Workshop held in Crystal Ballroom 2
8:00AM

Breakfast   (Diamond Room)

8:00AMRegistration
8:45AMOpening Remarks - Workshop General Chair
Mike McKeown, Hesse Mechatronics

9:00AM

TUTORIAL: WIRE BONDING - THE ULTRASONIC BONDING MECHANISM
Lee Levine, Process Solutions Consulting

Wire bonding is the dominant method of chip interconnection with over 85% of market share. Trillions of wire bonds are produced annually. In high-volume and well controlled facilities defect rates are in the low ppm range. It remains the lowest cost method of chip interconnection.

During both ball and wedge bonding wire is massively deformed between the bond tool and the bond pad or substrate forming a weld. The dominant variables affecting deformation are ultrasonic energy, temperature, bond force and bond time. Deformation exposes new surface material that is clean and has not been exposed to atmospheric contamination and oxidation. As the new wire and bond pad surfaces mix, they form diffusion couples that grow and transform into the intermetallic weld nugget. The initial mixing very quickly transforms into the compounds described by the equilibrium phase diagram.

Ultrasonic energy is the principal driving force in wire bonding. It reduces the forces required, allowing deformation to occur at significantly lower stress than would otherwise be required. High-frequency ultrasonics provide higher strain rates, allowing faster, better controlled deformation that is required for precise, high-yield bonding and high productivity.

This talk will discuss the mechanisms behind the formation of ball and wedge bonds. 

Session 1: HEAVY Cu WIRE BONDING
Session Chair: Mike McKeown, Hesse Mechatronics


10:00AMHeavy Copper Wirebonding for Automotive Batteries 
Grayson Young, University of California, Riverside (Josh Huang)


10:30AMCoffee Break with Exhibitors


11:15AMLarge Copper Wire and Ribbon Bonding in Mass Production 
Tao Xu, Kulicke & Soffa Industries

11:45AM

The effect of EPIG plating thicknesses on solder joint and wire bond reliability 
April Labonte, Uyemura (Chris Carrillo, Jose Garcia, Scott Larson, Pat Valentine, Don Gudeczauskas)


12:15PMLunch & Networking with Exhibitors   (Diamond Room)


Session 2: NOVEL BOND WIRE MATERIALS & WIRE BONDING TECHNOLOGIES
Session Chair: Henri Seppaenen, Kulicke & Soffa Industries, Inc.


2:00PMThe Reliability of Heavy Ag Wire Bonding for Power Devices
Xing Wei, Waseda University (Kohei Tatsumi)

2:30PMProcess Advantages of Thermosonic Wedge Bonding Using Dosed Tool Heating
Mike McKeown, Hesse Mechatronics



3:00PMCoffee Break with Exhibitors


Session 3: FAILURE ANALYSIS & RELIABILITY
Session Chair: Utkarsh Mehrotra, Wolfspeed
3:45PMVibration resistance of wire bonds in EV batteries
Dodgie Calpito, Tanaka Precious Metals (Tsukasa Ichikawa, Shizu Matsunaga, Shuichi Mitoma)

4:15PMUnderstanding the atomic-scale nature of ultrasonic wire bonding using molecular dynamics simulations
Milad Khajehvand, Santa Clara University (Henri Seppaenen, Kulicke & Soffa Industries, Inc.; Panthea Sepehrband, Santa Clara University)

5:00 - 6:00PMHappy Hour with the Exhibitors
Wire Bonding Workshop attendees can then join the Medical Workshop happy hour
& San Diego Chapter meeting at the conclusion of this meeting in the CRYSTAL BALLROOM 1


6:30PM - 7:30PM

  IMAPS SAN DIEGO CHAPTER MEETING 
(Medical Workshop Meeting Room - CRYSTAL BALLROOM 1) 

The San Diego Chapter will hold it's first technical meeting of 2023, featuring a presentation from Dr. Beth Keser, IMAPS President. Attendees from the Medical and Wire Bonding Workshops are invited to attend. San Diego Chapter members are encouraged to come early and visit our exhibitors during each workshop's happy hour reception as well. 


The Future of Electronic Packaging
Recently, multiple application spaces including high performance compute (HPC), autonomous driver-assistance systems (ADAS) and automotive, 5G/6G, internet of things (IoT)/MEMS/sensors require the combining chips to create new competitive and reliable product solutions. These applications, whether driven by performance, form factor, or cost require packaging solutions where distinctly different chips can be integrated into a package or system. This talk will explore the current and future challenges of these growing application spaces, the future electronic packaging technologies required to meet these challenges and the skillsets that are needed to be successful.


Beth Keser, Ph.D. 
IMAPS President
BETH KESER, Ph.D., IMAPS President & IEEE Fellow, a recognized global leader in the semiconductor packaging industry with over 25 years of experience, received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 41 U.S. patents and patents pending and over 50 publications in the semiconductor industry. Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department in the Product Enablement Solutions Group.


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Chapter Members can REGISTER ONLINE by selecting the chapter visitor option, if not all ready registered for the workshops. This registration type only allows access to the chapter meeting and happy hours - not the technical sessions.





FRIDAY, FEBRUARY 3

Wire Bonding Workshop Held in Crystal Ballroom 2
8:00AMBreakfast   (Diamond Room)
8:00AMRegistration
8:45AMDay Two Opening Remarks - Workshop General Chair
Mike McKeown, Hesse Mechatronics

9:00AM

TUTORIAL: A PRACTICAL INTRODUCTION TO WIRE BOND PROCESS OPTIMIZATION
Henri Seppaenen, Kulicke & Soffa Industries, Inc.




Session 4: TESTING AND PROBING CHALLENGES
Session Chair: Utkarsh Mehrotra, Wolfspeed
10:00AMDesign Considerations in Transitioning from Aluminum Wire to Aluminum Ribbon
Thomas Bobal, Coining, Inc.


10:30AMCoffee Break with Exhibitors


11:00AMCreation of New Wire Bond Pull Test Method, JEDEC JESD22-B120
Curtis Grosskopf, IBM Corp.

11:30AMContamination Detection on Ultrasonic Wire Bonding
Henri Seppaenen, Kulicke & Soffa Industries, Inc.

12:00PMBattery Interconnect Quality Testing
Karim Dehkordi, Acculogic (Paul Bennett)

12:30PMLunch & Networking with Exhibitors   (Diamond Room)


AFTERNOON TUTORIAL


2:00PM

TUTORIAL: PROCESS GUIDELINES FOR WIRE BONDING BATTERIES & POWER MODULES
Mike McKeown, Hesse Mechatronics

This presentation will discuss the various materials used in battery and power modules in relation to heavy Al or Cu wire bonding. It will discuss the various manufacturing steps and materials and how they relate to wire bonding. 





2:45PMClosing Remarks - Workshop General Chair




SPONSORS & TABLETOP EXHIBITORS

  


Thank you to our Workshop Sponsor:
Workshop Sponsor: Hesse Mechatronics


Please visit all of our tabletop exhibitors during the Wire Bonding Workshop: 

Hesse Mechatronics - SPONSOR
Baitech Solutions LLC
DeWeyl Tool Company
Hybond Inc.
Kulicke & Soffa Industries
Sales and Service, Inc. 
Tanaka Kikinzoku International (America), Inc.


A few tabletop exhibits and sponsorships are still available - REGISTER ONLINE




REGISTRATION

REGISTER ONLINE

Early registration discounts end January 16, 2023.




Registration TypeEarly (on or before Jan. 16)After Jan. 16
     Member$695$795
     Nonmember$895$995
     Speaker/Chair$495$595
     Student$100$200
Tabletop Exhibit (includes 1 six-foot tabletop in the session room, with 1 booth personnel badge; additional discounted full badges available to exhibitors at $450/person)$850$950
Sponsorship (includes 1 six-foot tabletop in the session room, with 2 exhibit badges, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program; additional discounted full badges available to sponsors at $350/person)$1750





HOTEL INFORMATION

WESTIN SAN DIEGO BAYVIEW
400 WEST BROADWAY
SAN DIEGO, CALIFORNIA, USA, 92101


IMAPS Room Rate: $239/night  + taxes and fees

Call the hotel directly at 619-239-4500

BOOK YOUR ROOM WITH THE IMAPS GROUP RATE 


Hotel Shuttle Services to/from SAN Airport
In-room Internet Access Included
Parking is Additional - Local garages available as well


HOTEL RESERVATION DEADLINE: FRIDAY, JANUARY 16, 2023


Upon reservation, guests must make a deposit for the first night's room reservation. Guests must cancel before 72 hours before the scheduled check-in date or the hotel will charge for 1 night.


Westin San Diego

   



Westin San Diego Bayview

IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of the IMAPS 2023 Medical Workshop in San Diego. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best event in February and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative plans including virtual presentation options and other online tools in the event that the in-person components of the Workshop are deemed unsafe or not possible.