Wire Bonding - Feb. 2-3

Breakfast   (Diamond Room)

TUTORIAL: WIRE BONDING - THE ULTRASONIC BONDING MECHANISM
Lee Levine, Process Solutions Consulting

Wire bonding is the dominant method of chip interconnection with over 85% of market share. Trillions of wire bonds are produced annually. In high-volume and well controlled facilities defect rates are in the low ppm range. It remains the lowest cost method of chip interconnection.

During both ball and wedge bonding wire is massively deformed between the bond tool and the bond pad or substrate forming a weld. The dominant variables affecting deformation are ultrasonic energy, temperature, bond force and bond time. Deformation exposes new surface material that is clean and has not been exposed to atmospheric contamination and oxidation. As the new wire and bond pad surfaces mix, they form diffusion couples that grow and transform into the intermetallic weld nugget. The initial mixing very quickly transforms into the compounds described by the equilibrium phase diagram.

Ultrasonic energy is the principal driving force in wire bonding. It reduces the forces required, allowing deformation to occur at significantly lower stress than would otherwise be required. High-frequency ultrasonics provide higher strain rates, allowing faster, better controlled deformation that is required for precise, high-yield bonding and high productivity.

This talk will discuss the mechanisms behind the formation of ball and wedge bonds. 

The effect of EPIG plating thicknesses on solder joint and wire bond reliability 
April Labonte, Uyemura (Chris Carrillo, Jose Garcia, Scott Larson, Pat Valentine, Don Gudeczauskas)

  IMAPS SAN DIEGO CHAPTER MEETING 
(Medical Workshop Meeting Room - CRYSTAL BALLROOM 1) 

The San Diego Chapter will hold it's first technical meeting of 2023, featuring a presentation from Dr. Beth Keser, IMAPS President. Attendees from the Medical and Wire Bonding Workshops are invited to attend. San Diego Chapter members are encouraged to come early and visit our exhibitors during each workshop's happy hour reception as well. 

The Future of Electronic Packaging
Recently, multiple application spaces including high performance compute (HPC), autonomous driver-assistance systems (ADAS) and automotive, 5G/6G, internet of things (IoT)/MEMS/sensors require the combining chips to create new competitive and reliable product solutions. These applications, whether driven by performance, form factor, or cost require packaging solutions where distinctly different chips can be integrated into a package or system. This talk will explore the current and future challenges of these growing application spaces, the future electronic packaging technologies required to meet these challenges and the skillsets that are needed to be successful.

Beth Keser, Ph.D. 
IMAPS President
BETH KESER, Ph.D., IMAPS President & IEEE Fellow, a recognized global leader in the semiconductor packaging industry with over 25 years of experience, received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 41 U.S. patents and patents pending and over 50 publications in the semiconductor industry. Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department in the Product Enablement Solutions Group.

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Chapter Members can REGISTER ONLINE by selecting the chapter visitor option, if not all ready registered for the workshops. This registration type only allows access to the chapter meeting and happy hours - not the technical sessions.

TUTORIAL: A PRACTICAL INTRODUCTION TO WIRE BOND PROCESS OPTIMIZATION
Henri Seppaenen, Kulicke & Soffa Industries, Inc.

TUTORIAL: PROCESS GUIDELINES FOR WIRE BONDING BATTERIES & POWER MODULES
Mike McKeown, Hesse Mechatronics

This presentation will discuss the various materials used in battery and power modules in relation to heavy Al or Cu wire bonding. It will discuss the various manufacturing steps and materials and how they relate to wire bonding.